JP2006332571A - Adhesive tape peeling method and adhesive tape peeling device to be used in a wafer tape mounter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method that surely peels off an adhesive tape polymerized on a release tape and pastes it on the rear of a semiconductor wafer or ring frame. <P>SOLUTION: In this adhesive tape peeling method that pulls and moves a release tape b with a polymerized adhesive tape a via a sharp-angled bend route in the guide margin 56a of a peel-off plate 56, the above peel-off plate 56 is made a flat plate with an even thickness, and the crosswise central part of the above guide margin 56a is projected to a convex of the above bend of the release tape b to form an arc, viewed from a direction orthogonal to the plane of the above flat plate so that a pull can be applied. In addition, a tape press unit 57 is provided to make a polymerized point of the peel-off plate 56 and release tape b adjacent to the plane of the peel-off plate 56 in a direction orthogonal to the plane of the peel-off plate 56. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a pressure-sensitive adhesive tape peeling method for peeling off a pressure-sensitive adhesive tape polymerized and bonded to a release tape, and a pressure-sensitive adhesive tape peeling device used for a wafer tape mounter, and more particularly to a semiconductor wafer. In the dicing process of dividing into chips, this is useful when a process of attaching an adhesive tape to the back surface of the semiconductor wafer and the ring frame is performed in order to prevent dispersion of the divided chips.

  For example, as shown in Patent Document 1, it is an apparatus for adhering an adhesive tape to the back surface of a semiconductor wafer and a ring frame, and a release tape on which an adhesive tape is polymerized and adhered is pulled out from a film supply position of a peeling plate. 2. Description of the Related Art Conventionally, there has been a wafer tape mounter in which an adhesive tape peeling device that pulls and moves so as to pass through an acute-angled bending path around a guide edge.

  In this wafer tape mounter, a tape roll t1 is used in which a laminated tape t made of a release tape b obtained by polymerizing and sticking a substantially circular adhesive tape a as shown in FIG. Such a laminated tape is prepared by bonding an uncut adhesive tape having the same shape to the release tape b, cutting a cutting line a1 into the uncut adhesive tape under this state, and forming a substantially circular adhesive tape a. And the non-use adhesive tape a2.

  The wafer tape mounter will be described with reference to FIG. 15. The laminated tape t pulled out from the tape roll t1 is fed so as to pass through an acute bent path around the guide edge of the peeling plate c (see FIG. 14). Pulled out by the roll d, peeled off the adhesive tape a having the adhesive layer on the lower surface from the release tape b, and then the peeled adhesive tape a in this way can freely reciprocate with the upper pressing roller k. 16 is pressed between the semiconductor wafer f placed on the table e (see FIG. 14) and the ring frame g surrounding the semiconductor wafer f, and the table e moves forward to bring the semiconductor wafer f and the ring frame g back to the rear surface of FIG. Adhesive tape a is adhered as shown.

  In the illustrated apparatus, the table e is configured to move up and down, left and right, and when the adhesive tape a starts to be adhered, the table e is raised and the semiconductor wafer f and the ring frame g set in advance thereon, The tip of the adhesive tape a fed out from the peeling plate c is sandwiched between the upper pressing roller k and the table e advances. At this time, the adhesive tape a is applied with tension, and the semiconductor wafer f and the ring frame. It is stuck on the back of g, and when the sticking is finished, the table e descends. Next, the processed product as shown in FIG. 16 formed by adhering the semiconductor wafer f and the ring frame g onto the adhesive tape a is removed, and a new semiconductor wafer f and the ring frame g are placed thereon. Thereafter, the table e is retracted to the original position. Note that h is a tension roller that is driven by a motor to apply tension to the adhesive tape a.

JP-A-4-340746

In the wafer tape mounter described in Patent Document 1 described above, the adhesive tape a may not be properly peeled from the release tape b bent at an acute angle via the peeling plate c, and the semiconductor wafer f or ring Due to the relatively large intersection angle θ between the back surface of the frame g and the pressure-sensitive adhesive tape peeled off by the peeling plate, the pressure-sensitive adhesive tape a bonded to the above-described pressure-sensitive adhesive tape, that is, the release tape b. It is possible that the process of peeling off and sticking to the back surface of the semiconductor wafer f or the ring frame g is not performed accurately.
An object of the present invention is mainly to provide a pressure-sensitive adhesive tape peeling method capable of solving such problems and a pressure-sensitive adhesive tape peeling device used for a wafer tape mounter and the like.

  In order to achieve the above object, according to the first method of the present invention, as described in claim 1, a release tape having a pressure-sensitive adhesive tape superposed thereon is bent at an acute angle around the guide edge of the peeling plate. In the adhesive tape peeling method of pulling and moving along a path, the peeling plate is formed into a flat plate having a uniform thickness, and the widthwise central portion of the guide edge is viewed from a direction perpendicular to the plane of the peeling plate. It is characterized by carrying out in the shape of a circular arc protruding on the convex side of the bend of the release tape.

  According to the second method, as described in claim 2, the release tape having the adhesive tape superposed thereon is pulled out from the film supply position (the position of the disk body 29a) and folded at an acute angle around the guide edge of the peeling plate. In the adhesive tape peeling method of pulling and moving so as to pass through a curved path, the peeling plate is formed into a flat plate having a uniform thickness, and the release tape extends from the film supply position to the guide edge in the middle of the length. It is carried out by providing a tape press for bringing the overlapping position with the peeling plate in the direction perpendicular to the plane of the peeling plate close to the surface on the side where the halfway length of the release tape exists. It is said.

  In the third method, as described in claim 3, the pressure-sensitive adhesive tape is peeled by pulling and moving the release tape on which the pressure-sensitive adhesive tape is polymerized and pasted along a sharp bend path around the guide edge of the peeling plate. In the method, the peeling plate is formed into a flat plate having a uniform thickness, and the widthwise central portion of the guide edge is viewed from the direction orthogonal to the plane of the peeling plate, and the convex side of the bending of the release tape. And in the direction perpendicular to the plane of the peeling plate at a midpoint of the length of the release tape from the film supply position (position of the disk body 29a) to the guide edge. Provided with a tape press for bringing the overlapping position of the release plate with the surface on the side where the halfway length of the release tape exists, It is characterized in that it is performed to apply a pulling force by the feed roll width portion.

  The above first to third methods may be embodied as follows, that is, as described in claim 4, in relation to the position of the adhesive tape on the release tape, The release tape is temporarily pulled back to the opposite side of the supply direction.

  Next, as described in claim 5, the first device according to the present invention pulls out the release tape on which the adhesive tape has been polymerized and stuck from the film supply position, and forms an acute angle bend around the guide edge of the peeling plate. In the adhesive tape peeling apparatus that pulls and moves along a path, the peeling plate is formed into a flat plate having a uniform thickness, and the center portion in the width direction of the guide edge is viewed from a direction perpendicular to the plane of the peeling plate. Thus, the release tape has a circular arc shape projecting on the convex side of the fold.

  As described in claim 6, the second device pulls the release tape on which the adhesive tape is polymerized and stuck from the film supply position so as to pass through an acute bent path around the guide edge of the peeling plate. In the adhesive tape peeling device to be moved, the peeling plate is formed into a flat plate having a uniform thickness, and the release tape extends from the film supply position (position of the disk body 29a) to the guide edge in the middle of the length. A tape press is provided to bring the overlapping position with the peeling plate in the direction orthogonal to the plane of the peeling plate close to the surface on the side where the halfway length of the release tape exists.

  The fifth and sixth devices described above should be embodied as follows, that is, as described in claim 7, the portion of the release tape that has reached the position past the guide edge. Tape returning means is provided for pulling back to a position before reaching the guide edge. Here, the tape return means includes, for example, a tape presence sensor 13, a servo motor 33, a stepping motor 34, and the like.

According to the present invention as described above, the following effects can be obtained.
That is,
According to the first or fifth aspect, since the peeling plate is formed into a flat plate having a uniform thickness, the release tape is pulled and moved through a bending path of about 180 degrees around the guide edge of the peeling plate. The peeled adhesive tape can be made substantially parallel to the back surface of the semiconductor wafer or the ring frame, and the widthwise central portion of the guide edge is viewed from the direction perpendicular to the plane of the peeling plate. Since it has an arc shape that protrudes to the convex side of the release tape bending path, the adhesive tape that has been polymerized and bonded to the release tape can be reliably peeled off, and therefore the adhesive tape that has been peeled off from the release tape. Can be accurately attached only to a semiconductor wafer or to a semiconductor wafer and a ring frame.

  According to the second or sixth aspect of the present invention, in addition to making the peeling plate into a flat plate having a uniform thickness as in the first aspect, the release tape extending from the film supply position to the guide edge is further provided. A tape press for bringing the overlapping position with the peeling plate in the middle of the length and in the direction perpendicular to the plane of the peeling plate to the surface on the side where the halfway length of the release tape exists (in FIG. 8) And the release tape positioned between the tape press and the guide edge can be stably made substantially parallel to and close to the plane of the flat plate as a peeling plate, The release tape can be pulled and moved so that it can follow the bending path of approximately 180 degrees around the guide edge of the release plate, so that the release tape is peeled off. It is possible to accurately adhere the adhesive tape only to a semiconductor wafer or the like to the semiconductor wafer and the ring frame.

  According to the third aspect, it is possible to obtain both the effect of the first aspect and the second aspect.

  According to the present invention, in relation to the position of the adhesive tape on the release tape, the release tape is temporarily pulled back to the opposite side of the supply direction. Thus, the pressure-sensitive adhesive tape that has been polymerized and bonded can be more reliably peeled off.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1 is a side sectional view of a wafer tape mounter equipped with an adhesive tape peeling apparatus according to the present invention, FIG. 2 is a front view of the wafer tape mounter, FIG. 3 is a plan view of the wafer tape mounter, and FIG. FIG. 5 is a plan view of the tape mounter with the upper structure omitted, FIG. 5 is a view of the wafer tape mounter viewed from an oblique front, and FIG. 6 is a view of the wafer tape mounter in an upright state, viewed from an oblique front; FIG. 7 is a view of the upper structure of the wafer tape mounter as viewed from an oblique rear, FIG. 8 is a side view showing the tape peeling main part of the wafer tape mounter, and FIG. 9 is the tape peeling main part. A is a front view, B is a bottom view, C is a side view, and FIG. 10 is a plan view explanatory view exaggerating the bending of a guide edge, showing a peeling plate of the tape peeling main part. 11 A shows the tape pressing of the tape peeling main part is B in plan view is a side view, explanatory view showing a state 12 which is peeled off the adhesive tape from the release tape by the peeling plate. In the figure, x1 indicates the front-rear direction, and x2 indicates the left-right direction.

  1 to 7, reference numeral 100 denotes a lower structure portion, and reference numeral 101 denotes an upper structure portion that is supported so as to be swingable with respect to the lower structure portion via a left-right fulcrum shaft 1.

  The lower structure portion 100 includes a rectangular base 2 placed on an appropriate support surface. As shown in FIG. 4, each of the left and right fulcrum shafts 1 is provided on the upper surface of the base 2. The shaft support members 3 and 3 that support the end portions are fixed upright, and a pair of front and rear guide rollers 4 and 4 are provided on the front side x10 of the shaft support members 3 and 3, and these guide rollers The groove-shaped guide portions 5 and 5 are fixedly provided at the respective positions on the front side of the left and right end portions of 4 and 4, and the nut body 6 is fixedly mounted on the base 2 between the groove-shaped guide portions 5 and 5. Has been.

  As shown in FIGS. 1 and 6, the left and right ends of each guide roller 4 are pivotally attached to the corresponding upper support plate 7, and each upper support plate 7 is fixed to two bases at the corresponding positions. The lower support plate 8 is supported. Each lower support plate 8 is fixed to the upper surface of the base 100, and each lower support plate 8 can be displaced up and down via the guide mechanism 9 with respect to each of the two upper support plates 7, 7 corresponding thereto. The upper support plate 7 is supported in a state in which some downward displacement is allowed against the elasticity of the spring 10 corresponding to each upper support plate 7.

  A bracket 11 is provided in a protruding manner from the front edge of each of the pair of upper support plates 7 and 7 that support the left and right ends of the guide roller 4 on the front side x10, and a straight shape is provided between the front ends of the brackets 11 and 11. A guide shaft 12 is installed. A non-contact type tape presence sensor 13 (see FIG. 4) is provided in the vicinity of the nut body 6 so as to be supported by the base 2.

  As shown in FIGS. 2 and 4, a table 14 is arranged on the upper surface of the base 2, and a straight member 15 having a longitudinal direction x 1 is fixed to each of the left and right sides of the lower surface of the table 14. Each of the straight strip members 15 and 15 is slidably fitted back and forth in the corresponding groove guide portions 5 and 5, and the groove guide portions 5 and 5 and the straight strip members 15 and 15 are tables. 14 is held movably back and forth with respect to the base 2.

  A support plate 16 is fixed to the front surface of the lower surface of the table 14 so as to be vertically oriented in the left-right direction. A front-rear screw shaft 18 is rotatably mounted via a bearing member 17 fixed to the support plate 16. The rear portion of the front and rear screw shaft 18 is screwed into the screw hole of the nut body 6 in the front and rear direction x1. Further, a stepping motor 19 is fixed to the support plate 16 in the front-rear direction x1, and a toothed pulley 20 fixed to the output shaft of the stepping motor 19 and a toothed pulley fixed to the front end of the front-rear screw shaft 18 are provided. A toothed belt 22 is wound around the pulley 21. Accordingly, when the output shaft of the stepping motor 19 is rotated, the front-rear screw shaft 18 is rotated, and a screw feed action is generated between the front-rear screw shaft 18 and the nut body 6 by the rotation, and the screw feed action is generated. Thus, the table 14 is moved back and forth between the storage position p1 indicated by the solid line in FIG. 1 and the overhanging position p2 indicated by the phantom line in FIG.

  As shown in FIG. 1, a circular hole 14a is formed in the center of the upper surface of the table 14, and a circular plate 23 is fitted in the circular hole 14a so as to be movable up and down. A spring 24 that biases the circular plate 23 upward is provided between the bottom surface of the hole 14a. In the free state, the circular plate 23 is stably held at the height shown in the figure by the elasticity of the springs 24, 24, and is pushed down against the elasticity of the springs 24, 24 when a downward force of a specific magnitude or more is applied. It has been made.

  A plurality of air suction holes (not shown) are formed in the upper surface of the circular plate 23 and an annular range on the upper surface of the table 14 and in the vicinity of the periphery of the circular plate 23. The air suction holes of the circular plate 23 are circular. This is for fixing the semiconductor wafer by applying a vacuum pressure to the lower surface of the semiconductor wafer placed on the plate 23, and the air suction holes in the annular area on the upper surface of the table 14 are placed in the annular area. The ring frame g is fixed by applying a vacuum pressure to the lower surface of the ring frame g.

  On the other hand, as shown in FIG. 5, the upper structure portion 101 includes a pair of left and right side plate members 25, 25 whose rear end portions are supported by a left and right fulcrum shaft 1 so as to be swingable and displaceable, and the side plate members 25, 25. A gate-shaped frame is formed of a left-right coupling member 26 that joins the tip portions. At the upper part of each of the left and right side plate members 25, 25, the support shaft body 27 is provided with respective end surfaces of a support shaft body 27a that fixedly supports a tape roll t1 formed by winding a conventional laminated tape t in a roll shape. A disc body 29a, which is detachably held through the two engaging projections 28, 28, is rotatably attached to a shaft, and left and right side plates on the rear side of these disc bodies 29a, 29a. Each end surface of the support shaft body 27b that supports the cylindrical core member that winds the laminated tape t from which the adhesive tape a has been peeled off in a roll shape is provided on the support shaft body 27b at the top of each of the members 25 and 25. A disc body 29b, which is detachably held via the two locking projections 28, 28, is rotatably mounted on the shaft. The rotation center shafts 30a and 30b of the two front and rear disc bodies 29a and 29b attached to the left side plate member 25 when viewed from the front are rotatably inserted in the side plate member 25, and the left side plate member 25 when viewed from the front and left. Toothed pulleys 31a and 31b (see FIG. 1) are fixed to the respective rotation center shafts 30a and 30b located on the left side of the shaft.

  On the left side of the left side plate member 25 in the front view, as shown in FIG. 4, a support plate 32 is fixed in a standing manner in the front-rear direction x1 in the same shape as the side plate member 25, and the support plate 32 extends from the front side x10. Supply-side servo motors 33 in order. A feeding stepping motor 34 and a take-up servo motor 35 are fixed. Then, toothed pulleys 36 and 37 are fixed to the output shafts of the supply side servo motor 33 and the take-up side servo motor 35, respectively, and as shown in FIG. 1, a toothed belt is provided between the toothed pulley 36 and the toothed pulley 31a. 38, and a toothed belt 39 is wound around the toothed pulley 37 and the toothed pulley 31b.

  As shown in FIG. 4, left and right feed rolls 39 are rotatably mounted at positions corresponding to the pair of guide rolls 4, 4 between the left and right side plate members 25, 25. The left end and the output shaft of the feed stepping motor 34 are connected via a coupling member 40.

  As shown in FIG. 1, the disk body 29a, 29a that supports the tape roll t1 between the left and right side plate members 25, 25 has a straight shape that guides the laminated tape t with the adhesive tape a superposed on the tape. The guide shaft 41 is fixed in a bridge shape, and the disk bodies 29b and 29b that support the cylindrical core member that winds the laminated tape t from which the adhesive tape a is peeled between the left and right side plate members 25 and 25 in a roll shape. A straight guide shaft 42 that guides the release tape b from which the adhesive tape a has been peeled is fixed to the diagonally lower side in a bridging manner, and is further supported by the base 2 between the left and right side plate members 25, 25. Immediately after the straight guide shaft 12, a straight guide shaft 43 that guides the release tape b from which the adhesive tape a has been peeled is fixed in a bridging manner.

  As shown in FIGS. 1 to 3, a pressing roller 44 and a vertical driving means 45 for the pressing roller 44 are provided on the front side of the left-right coupling member 26. The pressing roller 44 is formed of an elastic material such as rubber at the peripheral surface portion, and is rotatably supported through a front-view gate-shaped support member 46 at the rotation center axis. The vertical drive means 45 couples the lower end of the output rod of the pneumatic cylinder device 47 fixed to the front surface of the left and right coupling member 26 to the left and right support plate 48 and is fixed to the left and right sides of the left and right support plate 48. In addition to guiding the support member 46 only in the vertical displacement direction by the vertical guide means comprising the guide tube 48a and the guided rod 46a which is guided by the guide tube 48a so as to be vertically slidable and fixed to the support member 46, it is resistant to the elasticity of the spring 50. Thus, the upper displacement of a specific distance is allowed.

  On the other hand, the adhesive tape peeling main part 51 and the vertical drive means 52 of this main part are provided in the rear surface side of the left-right coupling member 26. .

  As shown in FIG. 8, the adhesive tape peeling main part 51 includes a front portal support member 54, a mounting base 55 fixed in a bridging manner between lower portions of the left and right side plate parts 54 a of the support member 54, It consists of a rectangular flat plate 56 fixed to the mounting base 55 and having a uniform thickness, and a tape press 57 fixed to the left and right side plate portions 54a, 54a of the support member 54 in a bridging manner.

  As shown in FIG. 9, the mounting base 55 is formed in a U-shape in plan view with the front side x10 open, and a peeling plate 56 made of a flat plate having a uniform thickness is formed in the front of the lower surfaces of the left and right side portions 55a, 55a It is supposed to be fixed to. The peeling plate 56 has a thickness of about several mm (preferably about 1 mm), and the shape of the guide edge 56a, which is the front edge of the peeling plate 56, has a radius of curvature that is the thickness of the flat plate. Further, the guide edge 56a has a plan view shape in which the central portion of the length x2 in the left-right direction, which is the width direction, slightly protrudes toward the front side x10 as shown in FIG. The projection amount δ1 at this time is about one hundredth of the length L in the width direction. Specifically, for example, the length L in the width direction of the guide edge 56a. Is about 300 mm, the protrusion amount δ1 is about 0.5 mm.

  As shown in FIG. 11, the tape retainer 57 is a substantially flat body, the width of the front portion 57a is made smaller than the width of the rear portion 57b, and the upper and lower surfaces of the front portion 57a are gradually brought closer to each other as they move forward from the rear portion 57b. The front edge 57c of the front portion 57a is formed in a convex arc shape and straight in the width direction. At this time, the cross-sectional shape of the tip edge 57c is, for example, an arc shape having a radius of curvature of about 2 mm to 3 mm. The tape retainer 57 is fixed to the support member 54 so that the inclination of the front and rear can be changed. The rear portion 57b is fixed in a bridging manner between the left and right side plates 54a, 54a of the support member 54, and the front portion 57a is fixed to the mounting base 55. Between the left and right side portions 55a and 55a. The leading edge 57 c is positioned on the upper surface of the peeling plate 56 at a height within several mm (preferably 1 mm) from the upper surface so as to match the width direction of the peeling plate 56.

  The vertical drive means 52 couples the lower end of the output rod of the pneumatic cylinder device 58 fixed to the front surface of the left / right coupling member 26 to the support member 54, and the guide cylinder 59 fixed to the left / right coupling member 26. The support member 54 is guided by a vertical guide means including a guided rod 60 guided so as to be slidable in the vertical direction so that only the vertical displacement is possible.

In FIG. 5, 61 is a handle for oscillating and displacing the upper structure 101 and is fixed to the left-right coupling member 26, and 62 is a use state position where the upper structure 101 is leveled as shown in FIG. Is a release handle for releasing the lock state of a lock mechanism (not shown) that operates so as to stably hold the horizontal position. It will be in the state which can be rock | fluctuated around the fulcrum axis | shaft 1 facing left-right direction with respect to the base 100. FIG. The lock mechanism automatically enters the locked state by positioning the upper structure 101 in the use state position under the free state of the release handle 62.
S1 is a table opening / closing switch, and s2 is a start switch for adhesive tape attaching work.

  The above is the structure of the wafer tape mounter. The adhesive tape is obtained by removing the table 14 and its driving mechanism (for example, the forward and backward screw rod 18 and the nut 6), the pressing roller 44 and its vertical driving means 45 from the structure. It forms a peeling device.

Next, usage examples and operations of the wafer tape mounter described above will be described.
First, the tape roll t1 is fitted and fixed to the support shaft body 27a, and the support shaft body 27a is mounted on the pair of disk bodies 29a and 29a on the front side x10. Next, the laminated tape t of the tape roll t1 is pulled out by an appropriate length under the state in which the upper structure portion 101 is oscillated and displaced upright as shown in FIGS. At this time, since no current flows through the servomotor 33, the servomotor 33 idles in conjunction with the withdrawal of the laminated tape t, and the laminated tape t is drawn out smoothly.

  Next, in a state where the laminated tape t pulled out in this way is expanded in the left-right direction x2, it is guided so as to pass through the upper side of the peripheral surface of the left-right direction guide shaft 41 at the use state position, and is then equivalent to the tape press 57. The sheet is passed between the release plate 56 and the guide plate 56a. Then, the release plate 56 is bent from the upper surface side to the lower surface side when the release plate 56 is in use. Next, the lower side of the peripheral surface of the left-right guide shaft 43 at the use state position, the lower side of the peripheral surface of the feed roll 39 at the use state position, and the use state of the peripheral surface of the left-right guide shaft 42 The lower side of the position is passed in this order.

  Then, the support shaft body 27b is fixed to the pair of left and right disc bodies 29b and 29b on the rear side in the use state position, the tip of the laminated tape t is fixed to the support shaft body 27b, and the support shaft body 27b is turned by hand. The laminated tape t is fixedly wound around the peripheral surface thereof.

  Thereafter, the upper structure portion 101 is positioned at the use state position shown in FIGS. 1 and 5. At this time, the locking means (not shown) stably holds the position of the upper structure portion 101 at that time. In the use state position of the upper structure portion 101, the left-right guide shaft 12 of the base 100 is pushed up the laminated tape t just before the left-right guide shaft 43 on the upper structure portion 101 side. The laminated tape t is sandwiched between the peripheral surfaces of the guide rolls 4 and 4 and the peripheral surface of the feed roll 39 through the elasticity of the springs 10 and 10.

  Next, the step opening motor 19 is operated by operating the table opening / closing switch s1, and the table 14 is moved to the overhanging position p1 as shown in FIG. Under such an overhanging state, the operator places the semiconductor wafer on the upper surface of the circular plate 23, and in the annular area around the circular plate 23 on the upper surface of the table 14, as shown by phantom lines in FIG. A ring frame g is placed.

  Thereafter, the table opening / closing switch s1 is operated to operate the stepping motor 19 in the reverse direction to move the table 14 to the storage position as shown in FIG. In association with the operation of the table opening / closing switch s1, a vacuum pressure is applied to the lower surface of the semiconductor wafer or ring frame g through an air suction hole (not shown), and the semiconductor wafer is sucked and fixed to the upper surface of the circular plate 23. Is in a state of being fixed to the upper surface of the table 14 by suction.

Next, the start switch s2 for the adhesive tape sticking operation is operated, whereby the servo motors 33 and 35 and the stepping motor 34 are automatically operated by a control operation of a control unit (not shown).
The feed roll 39 is driven to rotate by the operation of the stepping motor 34, and a feed force is applied to the laminated tape t of the tape roll t1 to pull it backward. At this time, the servo motor 33 applies a rotational force in the counterclockwise direction in FIG. 1 to the tape roll t1, and applies an appropriate tension to the laminated tape t in the range from the tape roll t1 to the feed roll 39. The servo motor 35 applies a rotational force in the counterclockwise direction in FIG. 1 to the cylindrical core member fixed to the support shaft 27b, and an appropriate tension is applied to the laminated tape t in the range from the tape roll t1 to the cylindrical core member. It will be in the state which gave.

  During the feeding movement of the laminated tape t, the adhesive tape a is in a tension state and is pressed by the leading edge 57c of the tape pressing member 57, so that it is bent about 180 degrees around the guide edge 56a of the uniform thickness peeling plate 56. It becomes a state. In this state, after the tip portion p3 of the adhesive tape a superposed and bonded to the release tape b shown in FIG. 14 reaches the guide edge 56a, it is gradually peeled from the tip portion p3 as the release tape b is moved. As shown in FIG. 12, it is projected forward in a substantially horizontal shape. When the adhesive tape a protrudes several mm forward of the guide edge 56a, the tape presence sensor 13 detects this protruding portion, and the stepping motor 34 is automatically stopped in connection with this.

At this time, since the leading edge 57c of the tape retainer 57 is located in the vicinity of the guide edge 56a, the laminated tape t from the leading edge 57c to the guide edge 56a is held in a stable horizontal posture. The tape a can be accurately peeled off.
In addition, the fact that the peeling plate 56 is a flat plate having a uniform thickness makes it possible to bend the laminated tape t with a large curvature by approximately 180 degrees, and to accurately peel the adhesive tape a. After the flat plate 56 is brought close to the upper surface of the table 14, the laminated tape t on the upper surface of the flat plate 56 having a uniform thickness is made almost horizontal, and the adhesive tape a is removed from the upper surface of the table 14 in the peeling process of the adhesive tape a. It protrudes to the front in a substantially horizontal direction at a position close to. As a result, the angle corresponding to the conventional angle θ, that is, the intersection angle between the back surface of the semiconductor wafer f or the ring frame g and the adhesive tape peeled off by the peeling plate 56 becomes substantially zero.
Further, the peeling plate 56 having a center portion in the width direction having an arc shape that is convex in a plan view toward the front side x10 gives an effective tension force on the peeling action to the center of the width of the laminated tape t and adheres. The both ends in the left and right direction of tape a (parts p4 and p4 indicated by slant lines in FIG. 12) are peeled off prior to the center of the width, and the adhesive tape a is peeled accurately. .

  By the way, when the leading end portion p3 of the adhesive tape a is not peeled even if the leading end portion p3 of the adhesive tape a passes the guide edge 56a during the feeding movement of the laminated tape t, the leading end portion p3 of the adhesive tape a is peeled off. It is detected that the guide edge 56a has passed a specific distance (for example, several mm) without being performed. The detection is performed based on a detection signal of the tape presence sensor 13 and measurement information of an appropriate measuring instrument (not shown) that measures the feeding time or feeding distance of the laminated tape t or measures the existence position of the adhesive tape a. be able to.

In association with this detection, the stepping motor 34 is rotated in the reverse direction, and the laminated tape t is rewound onto the tape roll t1 by a rotational force of the servo motor 33 for a distance slightly longer than the specific distance. Next, as described above, the stepping motor 34 is rotated to the positive side, the laminated tape t1 is pulled and moved, and the adhesive tape a is peeled again.
Also in this peeling process, when the tip portion p3 of the adhesive tape a is not peeled, the laminated tape t is rewound again as described above, and the peeling process of the adhesive tape a is performed again.

  The number of times that the pressure-sensitive adhesive tape a is peeled can be arbitrarily determined. Even if the pressure-sensitive adhesive tape a is not peeled even if the number of times the peel-off processing is performed in advance, it is determined as an abnormal state. Thus, the subsequent feeding operation of the stepping motor 34 is stopped.

  When the adhesive tape a protrudes several mm forward of the guide edge 56a by the operation as described above, the stepping motor 34 is temporarily stopped. In connection with this temporary stop, the stepping motor 19 is operated, and the table 14 Is moved forward.

  When the table 14 reaches a position corresponding to the protruding adhesive tape a, the adhesive tape peeling main part 51 is lowered by the vertical drive means 52, and the peeling plate 56 is substantially parallel to the upper surface of the table 14. Held close to each other. Next, the pressing roller 44 is lowered by the vertical driving means 47, and the tip portion p3 of the adhesive tape a projecting several millimeters ahead of the guide edge 56a is moved to the forefront portion of the upper surface of the ring frame g. Press through. After the lowering operation time of the pressing roller 44, the stepping motor 34 is rotated in association with the forward movement of the table 14, and the adhesive tape a in a state of protruding several millimeters forward of the guide edge 56a is formed on the table 14. As the tape is peeled off from the release tape b at the same speed as the forward movement, the projection is advanced forward, and the pressure roller 44 sequentially and continuously presses the adhesive tape a gradually projected in this manner. Is attached to the ring frame g and the back surface of the semiconductor wafer (the upper surface in FIG. 1) through the adhesive layer on the lower surface thereof.

  When the semiconductor wafer is positioned directly below the pressing roller 44 during the pasting process, even if the height of the upper surface of the ring frame g and the upper surface of the semiconductor wafer are somewhat different, the height of the semiconductor wafer depends on the amount of difference. The circular plate 23 is displaced up and down by the elasticity of the spring 24, and the adhesive tape a is affixed to the back surface of the semiconductor wafer as well as the ring frame g by the pressing roller 44 in a homogeneous state.

The single adhesive tape a stuck in this way is completely peeled off from the release tape b, and the whole is stuck on the ring frame g and the semiconductor wafer, so that the table 14 is in a completely extended state as shown in FIG. At this time, the operations of the servo motors 33 and 35 and the stepping motors 19 and 34 are automatically stopped, and the vacuum pressure applied to the semiconductor wafer and the ring frame g is also released.
Thereafter, the operator removes the processed product (ring frame g, semiconductor wafer, adhesive tape a) shown in FIG.

When the adhesive tape is subsequently applied, the ring frame g and the semiconductor wafer to be applied next are placed on the table 14 as described above, and the table opening / closing switch s1 is operated. Then, after the table 14 reaches the storage position p2, the adhesive tape attaching work start switch s2 is turned on and operated again. As a result, the same processed product as before is obtained. Thereafter, the processing described above is repeated.
On the other hand, when removing the processed product from the table 14 and ending the adhesive tape attaching operation, the table open / close switch s1 is operated without placing the ring frame g or the semiconductor wafer on the table 14. As a result, the table 14 reaches the storage position p2, and each part is stopped.

The above-described adhesive tape peeling main part can be deformed as follows. FIG. 13 is a side view showing a modification of the main part of the adhesive tape peeling.
As shown in FIG. 13, the tip edge 57 c of the tape press 57 is formed by a left-right direction shaft 63 supported by the support member 54 and a roller 64 that is rotatable about the shaft 63. The lower part of the peripheral surface is brought close to the upper surface of the peeling plate 56.
Then, the laminated tape t inserted between the left-right guide shaft 41 and the guide edge 56a of the peeling plate 56 is pressed below the peripheral surface of the roller 64 according to the case of the tip edge 57c.
By doing so, the frictional force generated between the tape press 57 and the laminated tape t is reduced, and the adhesive tape a is smoothly and accurately attached to the ring frame g and the semiconductor wafer.

  In the above example, the present invention is used for peeling an adhesive tape a for adhering to a semiconductor wafer or a ring frame g. However, the present invention is not limited to this and may be used for various adhesive tape peeling processes. It is.

It is side surface sectional drawing of the wafer tape mounter which comprised the adhesive tape peeling apparatus which concerns on this invention. It is a front view of the wafer tape mounter. It is a top view of the wafer tape mounter. It is the top view which abbreviate | omitted the upper structure of the said wafer tape mounter. It is the figure seen from the diagonal front of the said wafer tape mounter. It is the figure which looked at the state which raised the upper structure part of the said wafer tape mounter from diagonally forward. It is the figure which looked at the state which raised the upper structure part of the said wafer tape mounter from diagonally behind. It is a side view which shows an adhesive tape peeling principal part. An attachment base is shown, A is a front view, B is a bottom view, and C is a side view. It is plane view explanatory drawing which exaggerated and expressed the bending of the guide edge, showing the peeling plate. A tape press is shown, A is a plan view, and B is a side view. It is explanatory drawing which shows the state which has peeled the adhesive tape from the release tape with the peeling plate. It is a side view which shows the modification of an adhesive tape peeling principal part. It is a figure which shows the lamination tape which superposed | bonded the adhesive tape on the release tape. It is a side view which shows the conventional wafer tape mounter. It is a figure which shows the processed goods formed by sticking an adhesive tape on the back surface of a semiconductor wafer and a ring frame.

Explanation of symbols

13 Tape presence sensor (tape return means)
29a Disc body (film supply position)
33 Servo motor (tape return means)
34 Stepping motor (tape return means)
39 Feed roll 56 Peeling plate 56a Guide edge 57 Tape retainer a Adhesive tape b Release tape

Claims (7)

  In the adhesive tape peeling method in which the release tape having the adhesive tape attached thereto is pulled and moved so as to pass through an acute bending path around the guide edge of the peeling plate, the peeling plate is formed into a flat plate having an equal thickness. The center portion in the width direction of the guide edge is formed in an arc shape projecting on the convex side of the bend of the release tape when viewed from the direction orthogonal to the plane of the peeling plate. Adhesive tape peeling method.   In the pressure-sensitive adhesive tape peeling method, the release tape having the pressure-sensitive adhesive tape superposed is pulled out from the film supply position and pulled through a sharp bend path around the guide edge of the peeling plate. And the release point at the middle of the length of the release tape from the film supply position to the guide edge and in the direction perpendicular to the plane of the peeling plate. A pressure-sensitive adhesive tape peeling method comprising: carrying out a tape press for bringing the tape close to the surface on the side where the halfway portion of the tape exists.   In the adhesive tape peeling method in which the release tape having the adhesive tape attached thereto is pulled and moved so as to pass through an acute bending path around the guide edge of the peeling plate, the peeling plate is formed into a flat plate having an equal thickness. In addition, the central portion in the width direction of the guide edge is formed in an arc shape projecting from the convex side of the bend of the release tape when viewed from the direction orthogonal to the plane of the peeling plate, and the film supply The release tape is located in the middle of the length of the release tape in the middle of the length of the release tape from the position to the guide edge and in the direction perpendicular to the plane of the peeling plate. An adhesive tape peeling method characterized by providing a tape press for making it close to the side surface.   4. The pressure-sensitive adhesive tape according to claim 1, wherein the pressure-sensitive adhesive tape is temporarily pulled back to the opposite side of the supply direction in relation to the position of the pressure-sensitive adhesive tape on the release tape. Peeling method.   In the pressure-sensitive adhesive tape peeling device, the release tape with the pressure-sensitive adhesive tape superposed is pulled out from the film supply position and pulled through a sharp bend path around the guide edge of the peeling plate. And the center portion in the width direction of the guide edge is formed in an arc shape projecting on the convex side of the bend of the release tape as seen from the direction orthogonal to the plane of the peeling plate. An adhesive tape peeling device used for a wafer tape mounter or the like.   In the pressure-sensitive adhesive tape peeling device, the release tape with the pressure-sensitive adhesive tape superposed is pulled out from the film supply position and pulled through a sharp bend path around the guide edge of the peeling plate. And the release point at the middle of the length of the release tape from the film supply position to the guide edge and in the direction perpendicular to the plane of the peeling plate. A pressure-sensitive adhesive tape peeling apparatus used for a wafer tape mounter or the like, characterized in that a tape press is provided to bring the tape close to the surface on the side where the halfway portion of the tape exists.   8. The wafer tape mounter according to claim 5 or 7, further comprising a tape returning means for pulling back the release tape portion that has reached the position past the guide edge to a position before reaching the guide edge. Adhesive tape peeling device used for

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