TW200739278A - Exposure apparatus - Google Patents

Exposure apparatus

Info

Publication number
TW200739278A
TW200739278A TW096108637A TW96108637A TW200739278A TW 200739278 A TW200739278 A TW 200739278A TW 096108637 A TW096108637 A TW 096108637A TW 96108637 A TW96108637 A TW 96108637A TW 200739278 A TW200739278 A TW 200739278A
Authority
TW
Taiwan
Prior art keywords
substrate
peripheral portion
liquid
inner member
exposure apparatus
Prior art date
Application number
TW096108637A
Other languages
English (en)
Chinese (zh)
Inventor
Keiji Emoto
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200739278A publication Critical patent/TW200739278A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW096108637A 2006-03-29 2007-03-13 Exposure apparatus TW200739278A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006092338A JP2007266504A (ja) 2006-03-29 2006-03-29 露光装置

Publications (1)

Publication Number Publication Date
TW200739278A true TW200739278A (en) 2007-10-16

Family

ID=38558376

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096108637A TW200739278A (en) 2006-03-29 2007-03-13 Exposure apparatus

Country Status (4)

Country Link
US (1) US7705969B2 (OSRAM)
JP (1) JP2007266504A (OSRAM)
KR (1) KR100883810B1 (OSRAM)
TW (1) TW200739278A (OSRAM)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8102512B2 (en) * 2004-09-17 2012-01-24 Nikon Corporation Substrate holding device, exposure apparatus, and device manufacturing method
US7433016B2 (en) 2005-05-03 2008-10-07 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP5020662B2 (ja) 2006-05-26 2012-09-05 キヤノン株式会社 ステージ装置、露光装置、及びデバイス製造方法
US20080137055A1 (en) * 2006-12-08 2008-06-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20080198346A1 (en) * 2007-02-16 2008-08-21 Canon Kabushiki Kaisha Exposure apparatus and method for manufacturing device
US20080198348A1 (en) * 2007-02-20 2008-08-21 Nikon Corporation Apparatus and methods for minimizing force variation from immersion liquid in lithography systems
US8514365B2 (en) * 2007-06-01 2013-08-20 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2010140958A (ja) * 2008-12-09 2010-06-24 Canon Inc 露光装置及びデバイス製造方法
NL2005874A (en) * 2010-01-22 2011-07-25 Asml Netherlands Bv A lithographic apparatus and a device manufacturing method.
JP5918965B2 (ja) 2011-10-25 2016-05-18 キヤノン株式会社 加工機システム及び加工機の配置方法
KR101911400B1 (ko) * 2012-05-29 2018-10-24 에이에스엠엘 네델란즈 비.브이. 대상물 홀더 및 리소그래피 장치
WO2013178484A1 (en) * 2012-05-29 2013-12-05 Asml Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
JP5943742B2 (ja) * 2012-07-04 2016-07-05 三菱電機株式会社 半導体試験治具およびそれを用いた半導体試験方法
US10578959B2 (en) 2015-04-29 2020-03-03 Asml Netherlands B.V. Support apparatus, lithographic apparatus and device manufacturing method
JP6556869B2 (ja) 2015-06-23 2019-08-07 エーエスエムエル ネザーランズ ビー．ブイ． 支持装置、リソグラフィ装置、及びデバイス製造方法
WO2024188552A1 (en) * 2023-03-13 2024-09-19 Asml Netherlands B.V. Substrate support and lithographic apparatus

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002158154A (ja) 2000-11-16 2002-05-31 Canon Inc 露光装置
SG121822A1 (en) * 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7110081B2 (en) * 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
TWI232357B (en) * 2002-11-12 2005-05-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7372541B2 (en) * 2002-11-12 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101470360B (zh) * 2002-11-12 2013-07-24 Asml荷兰有限公司 光刻装置和器件制造方法
DE60335595D1 (de) * 2002-11-12 2011-02-17 Asml Netherlands Bv Lithographischer Apparat mit Immersion und Verfahren zur Herstellung einer Vorrichtung
JP3953460B2 (ja) 2002-11-12 2007-08-08 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ投影装置
CN1723541B (zh) * 2002-12-10 2010-06-02 株式会社尼康 曝光装置和器件制造方法
JP4529433B2 (ja) 2002-12-10 2010-08-25 株式会社ニコン 露光装置及び露光方法、デバイス製造方法
TWI295414B (en) * 2003-05-13 2008-04-01 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
US7213963B2 (en) * 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005072132A (ja) 2003-08-21 2005-03-17 Nikon Corp 露光装置及びデバイス製造方法
TWI263859B (en) * 2003-08-29 2006-10-11 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
EP1695148B1 (en) * 2003-11-24 2015-10-28 Carl Zeiss SMT GmbH Immersion objective
TW201804262A (zh) * 2003-12-03 2018-02-01 尼康股份有限公司 曝光裝置、曝光方法、元件製造方法
JP2005175016A (ja) * 2003-12-08 2005-06-30 Canon Inc 基板保持装置およびそれを用いた露光装置ならびにデバイス製造方法
US7227619B2 (en) * 2004-04-01 2007-06-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2005302880A (ja) 2004-04-08 2005-10-27 Canon Inc 液浸式露光装置
JP2007123525A (ja) * 2005-10-27 2007-05-17 Toshiba Corp 液浸露光装置及び半導体装置の製造方法
US7787101B2 (en) * 2006-02-16 2010-08-31 International Business Machines Corporation Apparatus and method for reducing contamination in immersion lithography
US20080198346A1 (en) * 2007-02-16 2008-08-21 Canon Kabushiki Kaisha Exposure apparatus and method for manufacturing device

Also Published As

Publication number Publication date
KR100883810B1 (ko) 2009-02-16
JP2007266504A (ja) 2007-10-11
US7705969B2 (en) 2010-04-27
KR20070098527A (ko) 2007-10-05
US20070229787A1 (en) 2007-10-04

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