TW200737457A - Method for manufacturing flip chip substrate - Google Patents

Method for manufacturing flip chip substrate

Info

Publication number
TW200737457A
TW200737457A TW095110362A TW95110362A TW200737457A TW 200737457 A TW200737457 A TW 200737457A TW 095110362 A TW095110362 A TW 095110362A TW 95110362 A TW95110362 A TW 95110362A TW 200737457 A TW200737457 A TW 200737457A
Authority
TW
Taiwan
Prior art keywords
layer
metal layer
thin metal
forming
flip chip
Prior art date
Application number
TW095110362A
Other languages
English (en)
Other versions
TWI296436B (zh
Inventor
Bo-Wei Chen
Hsien-Shou Wang
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW095110362A priority Critical patent/TW200737457A/zh
Publication of TW200737457A publication Critical patent/TW200737457A/zh
Application granted granted Critical
Publication of TWI296436B publication Critical patent/TWI296436B/zh

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095110362A 2006-03-24 2006-03-24 Method for manufacturing flip chip substrate TW200737457A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095110362A TW200737457A (en) 2006-03-24 2006-03-24 Method for manufacturing flip chip substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095110362A TW200737457A (en) 2006-03-24 2006-03-24 Method for manufacturing flip chip substrate

Publications (2)

Publication Number Publication Date
TW200737457A true TW200737457A (en) 2007-10-01
TWI296436B TWI296436B (zh) 2008-05-01

Family

ID=45068764

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110362A TW200737457A (en) 2006-03-24 2006-03-24 Method for manufacturing flip chip substrate

Country Status (1)

Country Link
TW (1) TW200737457A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394248B (zh) * 2008-05-22 2013-04-21 Unimicron Technology Corp 封裝基板之製法

Also Published As

Publication number Publication date
TWI296436B (zh) 2008-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees