TW200736895A - Power supply cooling system - Google Patents
Power supply cooling systemInfo
- Publication number
- TW200736895A TW200736895A TW095135333A TW95135333A TW200736895A TW 200736895 A TW200736895 A TW 200736895A TW 095135333 A TW095135333 A TW 095135333A TW 95135333 A TW95135333 A TW 95135333A TW 200736895 A TW200736895 A TW 200736895A
- Authority
- TW
- Taiwan
- Prior art keywords
- cooling system
- power supply
- supply cooling
- computer device
- inlet
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 4
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1632—External expansion units, e.g. docking stations
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/256,857 US8000099B2 (en) | 2005-10-24 | 2005-10-24 | Power supply cooling system |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200736895A true TW200736895A (en) | 2007-10-01 |
Family
ID=37734076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095135333A TW200736895A (en) | 2005-10-24 | 2006-09-25 | Power supply cooling system |
Country Status (5)
Country | Link |
---|---|
US (1) | US8000099B2 (zh) |
EP (1) | EP1777606A3 (zh) |
JP (1) | JP2007122709A (zh) |
CN (1) | CN1991678A (zh) |
TW (1) | TW200736895A (zh) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4554503B2 (ja) * | 2005-12-14 | 2010-09-29 | 富士通株式会社 | 放熱装置および電子機器 |
US20080007910A1 (en) * | 2006-07-10 | 2008-01-10 | Cheng-I Lin | Storage-type heat-dissipating pad of notebook computer |
US7830661B2 (en) * | 2007-08-01 | 2010-11-09 | Belkin International, Inc. | Laptop computer support |
BRPI0704566A2 (pt) * | 2007-09-18 | 2009-05-12 | Whirlpool Sa | estação de docagem para um computador |
US8895171B2 (en) * | 2007-10-23 | 2014-11-25 | Ford Global Technologies, Llc | System for cooling a vehicle battery and method of installing same |
US20090128092A1 (en) * | 2007-11-15 | 2009-05-21 | Steven Woud | Base case battery with storage |
US7809478B2 (en) * | 2008-01-30 | 2010-10-05 | Dell Products L.P. | System and method for managing portable information handling system cooling |
US8705233B2 (en) * | 2008-03-29 | 2014-04-22 | Dell Products L.P. | System and method for portable information handling system thermal shield |
US8315746B2 (en) * | 2008-05-30 | 2012-11-20 | Apple Inc. | Thermal management techniques in an electronic device |
US20100226088A1 (en) * | 2008-06-25 | 2010-09-09 | Cheng Yu Huang | Heat-Dissipation, Connection and Support Structure for Notebook Computer |
US8553409B2 (en) * | 2008-06-27 | 2013-10-08 | Dell Products L.P. | System and method for portable information handling system parallel-wall thermal shield |
CN101650587A (zh) * | 2008-08-12 | 2010-02-17 | 鸿富锦精密工业(深圳)有限公司 | 便携式电脑支架 |
TWM391129U (en) * | 2010-04-19 | 2010-10-21 | Wistron Corp | Power supply having heat dissipation function and its combination with an electronic device |
CN102402261B (zh) * | 2010-09-08 | 2014-11-12 | 神讯电脑(昆山)有限公司 | 具有防水功能的主机装置与其散热模块 |
EP2485321B1 (en) * | 2011-02-04 | 2016-10-19 | Sony Ericsson Mobile Communications AB | Electrical connector comprising a temperature control arrangement |
US20130114203A1 (en) * | 2011-11-07 | 2013-05-09 | Sergey Ignatchenko | Systems, Apparatuses and Methods for Improving the Performance of Computing Devices |
US8699221B2 (en) * | 2012-03-09 | 2014-04-15 | Cheng Yu Huang | Notebook computer cooling pad capable of temperature detection and fan-speed adjustment |
US9239598B2 (en) * | 2012-05-30 | 2016-01-19 | Apple Inc. | Thermal architecture |
CN103576809B (zh) * | 2012-07-24 | 2017-09-29 | 联想(北京)有限公司 | 电子设备及其第一、二电子设备和第一电子设备切换方法 |
US9354903B2 (en) * | 2012-07-24 | 2016-05-31 | Beijing Lenovo Software Ltd. | Control method and electronic device |
TWM445207U (zh) * | 2012-08-06 | 2013-01-11 | Acer Inc | 散熱機構 |
US20140043750A1 (en) * | 2012-08-10 | 2014-02-13 | Philip Calderone | Laptop Computer Cooling and Docking Station |
US20140098486A1 (en) * | 2012-10-05 | 2014-04-10 | Steven Davis | Active cooling dock for computing device |
CN103970309A (zh) * | 2013-01-31 | 2014-08-06 | 鸿富锦精密电子(天津)有限公司 | 鼠标垫 |
CN105917753A (zh) * | 2014-01-16 | 2016-08-31 | 三菱电机株式会社 | 电子设备单元及电子设备 |
US20150293567A1 (en) * | 2014-04-09 | 2015-10-15 | Ray Broadwell | Secondary cooling system for laptop computer |
CN105022463B (zh) * | 2014-04-29 | 2018-10-02 | 和硕联合科技股份有限公司 | 电子装置模块 |
US9792961B2 (en) | 2014-07-21 | 2017-10-17 | Advanced Micro Devices, Inc. | Distributed computing with phase change material thermal management |
US10877529B2 (en) * | 2014-11-11 | 2020-12-29 | Darren Saravis | Temperature regulating mount |
US9836101B1 (en) | 2014-11-11 | 2017-12-05 | Darren Saravis | Cooling mount |
US11262816B2 (en) | 2014-11-11 | 2022-03-01 | Darren Saravis | Temperature regulating mount with magnetic power mount |
US11836020B2 (en) * | 2014-11-11 | 2023-12-05 | Darren Saravis | Temperature regulating mount |
US9996110B2 (en) * | 2014-12-24 | 2018-06-12 | Intel Corporation | Direct attach dock cooling leveraging maximum silicon junction temperature control |
AU2016258540A1 (en) * | 2015-05-01 | 2017-11-02 | Baselayer Technology, Llc | Side-cooled modular data center |
AT517411B1 (de) * | 2015-06-03 | 2017-10-15 | Christoph Schmiedl | Mobiles Rechnersystem |
KR102463535B1 (ko) * | 2015-06-12 | 2022-11-07 | 삼성전자주식회사 | 전자 장치에 연결되는 컴퓨팅 모듈 및 그 동작 방법 |
JP6159783B2 (ja) * | 2015-11-30 | 2017-07-05 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
US10416734B2 (en) * | 2016-03-15 | 2019-09-17 | Dell Products L.P. | Mechanically-adjustable supplemental cooling systems and methods for portable information handling systems |
CN205864936U (zh) * | 2016-07-11 | 2017-01-04 | 番禺得意精密电子工业有限公司 | 电子设备散热结构 |
US11092986B2 (en) * | 2017-06-30 | 2021-08-17 | Dell Products L.P. | Multi-fan sealed boost dock |
TWI677277B (zh) * | 2018-05-21 | 2019-11-11 | 訊凱國際股份有限公司 | 外搭式散熱裝置與調溫裝置 |
US20210191461A1 (en) * | 2019-12-23 | 2021-06-24 | Advanced Micro Devices, Inc. | External cooling module |
US11409340B2 (en) * | 2020-06-23 | 2022-08-09 | Qualcomm Incorporated | Thermal mitigation in a portable computing device by active heat transfer to a docking device |
KR20220052108A (ko) * | 2020-10-20 | 2022-04-27 | 주식회사 엘지에너지솔루션 | 냉각팬을 내장한 커넥터 |
US11914427B2 (en) * | 2022-07-25 | 2024-02-27 | Spigen Korea Co., Ltd. | Apparatus for standing of computer |
Family Cites Families (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5664118A (en) * | 1994-03-28 | 1997-09-02 | Kabushiki Kaisha Toshiba | Computer system having detachable expansion unit |
US6275945B1 (en) | 1996-11-26 | 2001-08-14 | Kabushiki Kaisha Toshiba | Apparatus for radiating heat for use in computer system |
US5862037A (en) | 1997-03-03 | 1999-01-19 | Inclose Design, Inc. | PC card for cooling a portable computer |
JP3889114B2 (ja) * | 1997-05-28 | 2007-03-07 | 富士通株式会社 | 電子機器 |
US5898568A (en) | 1997-07-25 | 1999-04-27 | Cheng; Chun-Cheng | External heat dissipator accessory for a notebook computer |
US6522535B1 (en) * | 1997-10-23 | 2003-02-18 | Hewlett-Packard Company | Method and apparatus for cooling a portable computer in a docking station |
JP2000003231A (ja) | 1998-06-12 | 2000-01-07 | Sharp Corp | 放熱促進機能付き情報処理システム |
US6353536B1 (en) * | 1998-06-25 | 2002-03-05 | Kabushiki Kaisha Toshiba | Electronic equipment system and extension device for expanding the functions of electronic equipment |
JP2000089855A (ja) * | 1998-09-14 | 2000-03-31 | Fujitsu Ltd | 機能拡張装置及び電子機器 |
US6188573B1 (en) | 1998-09-25 | 2001-02-13 | Fujitsu Limited | Information processing device, peripheral device and attachment device |
JP2000172378A (ja) * | 1998-12-04 | 2000-06-23 | Sony Corp | 冷却補助装置、冷却補助方法、電子機器、および情報処理装置 |
US6453378B1 (en) * | 1998-12-16 | 2002-09-17 | Gateway, Inc. | Portable computer with enhanced performance management |
US6094347A (en) * | 1999-01-08 | 2000-07-25 | Intel Corporation | Airflow heat exchanger for a portable electronic device and port replicator, docking station, or mini-docking station |
JP2000207063A (ja) | 1999-01-20 | 2000-07-28 | Hitachi Ltd | 情報処理システム |
JP2000216558A (ja) * | 1999-01-21 | 2000-08-04 | Toshiba Corp | 電子機器及び電子機器に装着可能な拡張装置及び拡張装置を備えた電子機器システム |
JP2000214952A (ja) | 1999-01-25 | 2000-08-04 | Toshiba Corp | コンピュ―タシステム |
US6109039A (en) * | 1999-03-24 | 2000-08-29 | International Business Machines Corporation | Heat transfer in electronic apparatus |
JP2000293270A (ja) | 1999-04-08 | 2000-10-20 | Hitachi Ltd | 携帯型電子機器の冷却方法及び携帯型電子機器 |
US6034871A (en) | 1999-04-27 | 2000-03-07 | Auras Technology Ltd. | Heat dissipation cassette for a notebook personal computer |
JP3601778B2 (ja) * | 2000-06-30 | 2004-12-15 | 株式会社東芝 | 電子機器 |
DE20013029U1 (de) * | 2000-07-27 | 2000-12-14 | Yu Ming Chuan | Kühlunterlage für Notebook |
US6563703B2 (en) | 2000-12-27 | 2003-05-13 | Intel Corporation | Portable and plugable thermal and power solution for a notebook or handheld device |
US6459574B1 (en) * | 2000-12-28 | 2002-10-01 | Intel Corporation | Docking station having a cooling unit to cool an electronic device |
US6459575B1 (en) | 2001-05-15 | 2002-10-01 | Hewlett-Packard Company | Cooling module for portable computer |
TW584372U (en) * | 2002-03-13 | 2004-04-11 | Cyber Internat Co Ltd A | Heat dissipation apparatus with serial and parallel connection ports |
US6738256B2 (en) * | 2002-09-10 | 2004-05-18 | Chen-Huang Hsieh | Heat sink attached externally on bottom portion of portable computer |
JPWO2004066133A1 (ja) * | 2003-01-22 | 2006-05-18 | 富士通株式会社 | 情報処理装置 |
US6894896B2 (en) * | 2003-05-13 | 2005-05-17 | Jen-Cheng Lin | Portable heat-dissipating device for a notebook computer |
US7106585B2 (en) * | 2004-02-11 | 2006-09-12 | Cooler Master Co., Ltd. | Holding dock for portable computers |
TWI245985B (en) * | 2004-09-17 | 2005-12-21 | Shiou-Huei Jeng | Docketing station for notebook computer |
US7038909B1 (en) * | 2005-02-23 | 2006-05-02 | Win-Win Opto-Electronics Co., Ltd. | Contractible and extentable laptop computer external cooler pad |
-
2005
- 2005-10-24 US US11/256,857 patent/US8000099B2/en not_active Expired - Fee Related
-
2006
- 2006-09-25 TW TW095135333A patent/TW200736895A/zh unknown
- 2006-09-26 EP EP06020168A patent/EP1777606A3/en not_active Ceased
- 2006-10-04 JP JP2006272945A patent/JP2007122709A/ja not_active Withdrawn
- 2006-10-24 CN CNA2006100640592A patent/CN1991678A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20070091560A1 (en) | 2007-04-26 |
EP1777606A3 (en) | 2009-01-21 |
US8000099B2 (en) | 2011-08-16 |
EP1777606A2 (en) | 2007-04-25 |
CN1991678A (zh) | 2007-07-04 |
JP2007122709A (ja) | 2007-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200736895A (en) | Power supply cooling system | |
TW200717218A (en) | Portable computer docking server system | |
DE602007010455D1 (de) | Operationsgerät | |
WO2006034976A3 (de) | Kühleinrichtung einer elektrischen maschine | |
GB2431777B (en) | Impingement cooling of components in an electronic system | |
TW200627137A (en) | Context based power management | |
TWI265271B (en) | Thermal module capable of dusting fins off by vibration and electronic appliance thereof | |
WO2007083046A3 (fr) | Dispositif de gestion electrique pour alimentation electrique de vehicule | |
WO2006087690A3 (en) | A cooling device | |
MX2013006663A (es) | Evaporador. | |
GB2464046A (en) | Computer device heat dissipation system | |
GB2471275B (en) | Air cooler shield system | |
TW200601602A (en) | Thermal management systems for battery packs | |
WO2009135740A3 (de) | Elektrische maschine mit einer integrierten gehäusekühlung | |
MX2009010698A (es) | Dispositivo de desacoplamiento. | |
TR200801108T1 (tr) | Bir soğutucu cihaz. | |
EP1890094A3 (en) | Cogeneration system | |
DE602007008158D1 (de) | Gehäuseeinheit zum Aufwickeln von Drahtelementen | |
WO2009149982A3 (de) | Vorrichtung zur freisetzung von ammoniak | |
DE502008003418D1 (de) | Ventilanordnung | |
SI1818604T1 (sl) | Osvetljevalna mreĺ˝a | |
ATE431526T1 (de) | Leuchtenanordnung | |
SG146606A1 (en) | Temperature control of a bonding stage | |
ATE451825T1 (de) | Elektronisches gerät mit einer elektrischen spule | |
WO2006094966A3 (de) | Verfahren zum erstellen einer dokumentation |