TW200736601A - Pattern defect inspecting apparatus, pattern defect inspecting method, and method of producing a photomask - Google Patents

Pattern defect inspecting apparatus, pattern defect inspecting method, and method of producing a photomask

Info

Publication number
TW200736601A
TW200736601A TW096106686A TW96106686A TW200736601A TW 200736601 A TW200736601 A TW 200736601A TW 096106686 A TW096106686 A TW 096106686A TW 96106686 A TW96106686 A TW 96106686A TW 200736601 A TW200736601 A TW 200736601A
Authority
TW
Taiwan
Prior art keywords
photomask
pattern defect
defect inspecting
pattern
light beam
Prior art date
Application number
TW096106686A
Other languages
English (en)
Inventor
Noboru Yamaguchi
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200736601A publication Critical patent/TW200736601A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H01L21/0275—Photolithographic processes using lasers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
TW096106686A 2006-03-31 2007-02-27 Pattern defect inspecting apparatus, pattern defect inspecting method, and method of producing a photomask TW200736601A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006096756A JP4831607B2 (ja) 2006-03-31 2006-03-31 パターン欠陥検査方法及びフォトマスクの製造方法

Publications (1)

Publication Number Publication Date
TW200736601A true TW200736601A (en) 2007-10-01

Family

ID=38674381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106686A TW200736601A (en) 2006-03-31 2007-02-27 Pattern defect inspecting apparatus, pattern defect inspecting method, and method of producing a photomask

Country Status (4)

Country Link
JP (1) JP4831607B2 (zh)
KR (1) KR20070098695A (zh)
CN (1) CN101046624B (zh)
TW (1) TW200736601A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579660B (zh) * 2014-09-29 2017-04-21 斯克林集團公司 圖像獲取裝置及圖像獲取方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009156687A (ja) * 2007-12-26 2009-07-16 Hoya Corp フォトマスクの欠陥検査装置、フォトマスクの欠陥検査方法及びフォトマスクの製造方法
JP5245482B2 (ja) * 2008-03-21 2013-07-24 株式会社ニコン 基板検査装置、およびマスク用基板の製造方法
KR20100042924A (ko) 2008-10-17 2010-04-27 삼성전자주식회사 포토 마스크의 헤이즈 모니터링 시스템 및 모니터링 방법
CN101738400B (zh) * 2008-11-14 2011-12-07 中芯国际集成电路制造(上海)有限公司 判断晶圆表面重复缺陷的方法及装置
CN102519968A (zh) * 2011-11-28 2012-06-27 上海华力微电子有限公司 掩膜板缺陷检测装置
CN102495070A (zh) * 2011-12-09 2012-06-13 北京凌云光视数字图像技术有限公司 大幅宽不干胶标签表面三维缺陷检测系统
JP2014035326A (ja) 2012-08-10 2014-02-24 Toshiba Corp 欠陥検査装置
WO2015167492A1 (en) 2014-04-30 2015-11-05 Hewlett-Packard Development Company, L.P. Imaging appratus and methods using diffraction-based illumination
CN106783648B (zh) * 2016-12-28 2019-01-25 歌尔股份有限公司 一种led显示屏的制备方法
KR102112053B1 (ko) * 2018-08-01 2020-05-18 주식회사 뷰온 이미지 센서를 이용한 표면결함 검사장치 및 검사방법
CN112557400B (zh) * 2020-11-30 2021-10-22 电子科技大学 一种卫星望远镜镜片表面疵病轮廓检测系统及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08226901A (ja) * 1995-02-21 1996-09-03 Dainippon Printing Co Ltd ビューファインダー用カラーフイルターの検査装置
WO2001038860A1 (fr) * 1999-11-25 2001-05-31 Olympus Optical Co., Ltd. Systeme de traitement de donnees d'inspection d'anomalie
TW500920B (en) * 2000-03-24 2002-09-01 Olympus Optical Co Defect detecting apparatus
KR20040039372A (ko) * 2001-09-21 2004-05-10 올림푸스 가부시키가이샤 결함 검사 장치
JP2004117059A (ja) * 2002-09-24 2004-04-15 Sony Corp 透明体の検査方法及び検査装置
JP4474904B2 (ja) * 2003-11-18 2010-06-09 凸版印刷株式会社 周期性パターンムラ検査装置
JP4480001B2 (ja) * 2004-05-28 2010-06-16 Ｈｏｙａ株式会社 ムラ欠陥検査マスク、ムラ欠陥検査装置及び方法、並びにフォトマスクの製造方法
JP2007170827A (ja) * 2005-12-19 2007-07-05 Toppan Printing Co Ltd 周期性パターンの欠陥検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI579660B (zh) * 2014-09-29 2017-04-21 斯克林集團公司 圖像獲取裝置及圖像獲取方法

Also Published As

Publication number Publication date
JP2007271425A (ja) 2007-10-18
CN101046624B (zh) 2011-11-02
KR20070098695A (ko) 2007-10-05
JP4831607B2 (ja) 2011-12-07
CN101046624A (zh) 2007-10-03

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