TW200735422A - LED with compound encapsulant lens - Google Patents

LED with compound encapsulant lens

Info

Publication number
TW200735422A
TW200735422A TW095149979A TW95149979A TW200735422A TW 200735422 A TW200735422 A TW 200735422A TW 095149979 A TW095149979 A TW 095149979A TW 95149979 A TW95149979 A TW 95149979A TW 200735422 A TW200735422 A TW 200735422A
Authority
TW
Taiwan
Prior art keywords
lens
emitter
virtual image
led
inner lens
Prior art date
Application number
TW095149979A
Other languages
English (en)
Chinese (zh)
Inventor
Patrick Rene Destain
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200735422A publication Critical patent/TW200735422A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Landscapes

  • Led Device Packages (AREA)
TW095149979A 2005-12-30 2006-12-29 LED with compound encapsulant lens TW200735422A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/322,801 US7798678B2 (en) 2005-12-30 2005-12-30 LED with compound encapsulant lens

Publications (1)

Publication Number Publication Date
TW200735422A true TW200735422A (en) 2007-09-16

Family

ID=38223464

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095149979A TW200735422A (en) 2005-12-30 2006-12-29 LED with compound encapsulant lens

Country Status (7)

Country Link
US (1) US7798678B2 (https=)
EP (1) EP1974398A2 (https=)
JP (1) JP2009522779A (https=)
KR (1) KR20080081085A (https=)
CN (1) CN101371371B (https=)
TW (1) TW200735422A (https=)
WO (1) WO2007078971A2 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395979B (zh) * 2008-07-04 2013-05-11 A microlens and a mold manufacturing method thereof, and a light emitting device
TWI407597B (zh) * 2010-02-05 2013-09-01 Shinyoptics Corp 發光二極體照明裝置
TWI465671B (zh) * 2012-04-26 2014-12-21 Advanced Optoelectronic Tech 發光二極體燈源裝置

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395979B (zh) * 2008-07-04 2013-05-11 A microlens and a mold manufacturing method thereof, and a light emitting device
TWI407597B (zh) * 2010-02-05 2013-09-01 Shinyoptics Corp 發光二極體照明裝置
TWI465671B (zh) * 2012-04-26 2014-12-21 Advanced Optoelectronic Tech 發光二極體燈源裝置

Also Published As

Publication number Publication date
EP1974398A2 (en) 2008-10-01
JP2009522779A (ja) 2009-06-11
WO2007078971A2 (en) 2007-07-12
WO2007078971A3 (en) 2007-08-30
KR20080081085A (ko) 2008-09-05
US20070152231A1 (en) 2007-07-05
CN101371371A (zh) 2009-02-18
CN101371371B (zh) 2010-12-15
US7798678B2 (en) 2010-09-21

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