TW200734836A - Cleaning composition for removing post-dry-etch residues - Google Patents
Cleaning composition for removing post-dry-etch residuesInfo
- Publication number
- TW200734836A TW200734836A TW095108424A TW95108424A TW200734836A TW 200734836 A TW200734836 A TW 200734836A TW 095108424 A TW095108424 A TW 095108424A TW 95108424 A TW95108424 A TW 95108424A TW 200734836 A TW200734836 A TW 200734836A
- Authority
- TW
- Taiwan
- Prior art keywords
- dry
- composition
- weight
- water
- cleaning composition
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- 238000004140 cleaning Methods 0.000 title abstract 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 abstract 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 abstract 1
- -1 amine compound Chemical class 0.000 abstract 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000009972 noncorrosive effect Effects 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3209—Amines or imines with one to four nitrogen atoms; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
-
- C11D2111/22—
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095108424A TW200734836A (en) | 2006-03-13 | 2006-03-13 | Cleaning composition for removing post-dry-etch residues |
| PCT/EP2007/052311 WO2007104746A1 (en) | 2006-03-13 | 2007-03-12 | Cleaning composition for removing post-dry-etch residues |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW095108424A TW200734836A (en) | 2006-03-13 | 2006-03-13 | Cleaning composition for removing post-dry-etch residues |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200734836A true TW200734836A (en) | 2007-09-16 |
Family
ID=37964424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095108424A TW200734836A (en) | 2006-03-13 | 2006-03-13 | Cleaning composition for removing post-dry-etch residues |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW200734836A (zh) |
| WO (1) | WO2007104746A1 (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2138557A1 (en) * | 2008-06-18 | 2009-12-30 | Paul Hughett | An upper internal combustion engine cleaning composition |
| KR20110106880A (ko) * | 2009-01-22 | 2011-09-29 | 바스프 에스이 | 화학적 기계적 연마 후 세정을 위한 조성물 |
| CN101787335A (zh) * | 2009-01-22 | 2010-07-28 | 巴斯夫公司 | 用于化学机械抛光后清洗的组合物 |
| CN104277944A (zh) * | 2013-09-29 | 2015-01-14 | 东旭集团有限公司 | 一种tft液晶玻璃基板清洗液及其清洗方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5279771A (en) * | 1990-11-05 | 1994-01-18 | Ekc Technology, Inc. | Stripping compositions comprising hydroxylamine and alkanolamine |
| KR100569533B1 (ko) * | 2001-10-25 | 2006-04-07 | 주식회사 하이닉스반도체 | 포토레지스트 세정용 조성물 |
-
2006
- 2006-03-13 TW TW095108424A patent/TW200734836A/zh unknown
-
2007
- 2007-03-12 WO PCT/EP2007/052311 patent/WO2007104746A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007104746A1 (en) | 2007-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008509554A5 (zh) | ||
| TW200940706A (en) | Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions | |
| TWI263676B (en) | Compositions for chemically treating a substrate using foam technology | |
| TW200942609A (en) | Compositions for removal of metal hard mask etching residues from a semiconductor substrate | |
| SG131867A1 (en) | Aqueous cleaning composition and method for using same | |
| TW200732864A (en) | Composition for removing residue of a wiring substrate, and washing method thereof | |
| TW200710205A (en) | Dense fluid compositions for removal of hardened photoresist, post-etch residue and/or bottom anti-reflective coating layers | |
| MY127401A (en) | Low surface tension, low viscosity, aqueous, acidic compositions containing fluoride and organic, polar solvents for removal of photoresist and organic and inorganic etch residues at room temperature | |
| WO2012051380A3 (en) | Composition for and method of suppressing titanium nitride corrosion | |
| DE602004009595D1 (de) | Ablös- und reinigungszusammensetzungen für die mikroelektronik | |
| TWI617901B (zh) | 光阻剝離劑組成物及光阻剝離方法 | |
| DE602004030121D1 (de) | Reinigungsmittel, verfahren zur reinigung von halbleitersubstrat sowie verfahren zur ausbildung der leitungsbahnen auf halbleitersubstrat | |
| TW200708597A (en) | Metal and dielectric compatible sacrificial anti-reflective coating cleaning and removal composition | |
| DE602005018075D1 (de) | Reinigungsmittel für mikroelektronik-substrate | |
| ATE505517T1 (de) | Verfahren zum schutz von substraten und zur entfernung von verunreinigungen aus solchen substraten | |
| TW200509237A (en) | Compositions suitable for removing photoresist, photoresist byproducts and etching residue, and use thereof | |
| ATE495546T1 (de) | Zusammensetzung zum abziehen und reinigen und deren verwendung | |
| IL155429A0 (en) | Stabilized alkaline compositions for cleaning microelectronic substrates | |
| TW200613543A (en) | Aqueous resist stripper composition | |
| TW200630482A (en) | Aqueous based residue removers comprising fluoride | |
| JP2008537182A5 (zh) | ||
| SG152961A1 (en) | Flouride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction | |
| TW200734836A (en) | Cleaning composition for removing post-dry-etch residues | |
| TW200627095A (en) | Remover composition | |
| JP2008541426A5 (zh) |