TW200733219A - An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements - Google Patents

An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements

Info

Publication number
TW200733219A
TW200733219A TW095147217A TW95147217A TW200733219A TW 200733219 A TW200733219 A TW 200733219A TW 095147217 A TW095147217 A TW 095147217A TW 95147217 A TW95147217 A TW 95147217A TW 200733219 A TW200733219 A TW 200733219A
Authority
TW
Taiwan
Prior art keywords
fluid flow
mechanical processing
conductive layer
electrochemical mechanical
flow assist
Prior art date
Application number
TW095147217A
Other languages
English (en)
Inventor
You Wang
Renhe Jia
Stan D Tsai
Yongqi Hu
Zhihong Wang
Jie Diao
Gerald John Alonzo
Lakshmanan Karuppiah
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200733219A publication Critical patent/TW200733219A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095147217A 2006-01-05 2006-12-15 An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements TW200733219A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/327,527 US20070153453A1 (en) 2006-01-05 2006-01-05 Fully conductive pad for electrochemical mechanical processing
US11/431,231 US20070151867A1 (en) 2006-01-05 2006-05-10 Apparatus and a method for electrochemical mechanical processing with fluid flow assist elements

Publications (1)

Publication Number Publication Date
TW200733219A true TW200733219A (en) 2007-09-01

Family

ID=38223252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147217A TW200733219A (en) 2006-01-05 2006-12-15 An apparatus and a method for electrochemical mechanical processing with fluid flow assist elements

Country Status (3)

Country Link
US (2) US20070153453A1 (zh)
JP (1) JP2009522809A (zh)
TW (1) TW200733219A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152979A (zh) * 2014-09-04 2014-11-19 蒙家革 一种电解蚀刻头和数控电解蚀刻系统及蚀刻方法

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JP5156511B2 (ja) * 2008-07-11 2013-03-06 ポリマテック株式会社 熱伝導性シート複合体及びその製造方法
JP5981154B2 (ja) * 2012-02-02 2016-08-31 三菱電機株式会社 半導体装置の製造方法
TWI550140B (zh) * 2014-01-28 2016-09-21 國立中山大學 電解複合磨粒拋光裝置及其拋光方法
KR20190039171A (ko) * 2016-08-31 2019-04-10 어플라이드 머티어리얼스, 인코포레이티드 환형 플래튼 또는 연마 패드를 갖는 연마 시스템
KR20200011575A (ko) * 2017-06-22 2020-02-03 어플라이드 머티어리얼스, 인코포레이티드 다이 접합 응용들을 위한 정전 캐리어
CN111455424B (zh) * 2020-04-24 2021-08-31 上海金厦实业有限公司 一种金属件耐腐蚀防锈工艺
US11935777B2 (en) 2021-12-01 2024-03-19 STATS ChipPAC Pte Ltd. Semiconductor manufacturing equipment and method of providing support base with filling material disposed into openings in semiconductor wafer for support

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104152979A (zh) * 2014-09-04 2014-11-19 蒙家革 一种电解蚀刻头和数控电解蚀刻系统及蚀刻方法
CN104152979B (zh) * 2014-09-04 2017-02-01 蒙家革 一种电解蚀刻头和数控电解蚀刻系统及蚀刻方法

Also Published As

Publication number Publication date
JP2009522809A (ja) 2009-06-11
US20070151867A1 (en) 2007-07-05
US20070153453A1 (en) 2007-07-05

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