TW200730656A - Cathode incorproating fixed or rotating target in combination with a moving magnet assembly and applications thereof - Google Patents
Cathode incorproating fixed or rotating target in combination with a moving magnet assembly and applications thereofInfo
- Publication number
- TW200730656A TW200730656A TW095139269A TW95139269A TW200730656A TW 200730656 A TW200730656 A TW 200730656A TW 095139269 A TW095139269 A TW 095139269A TW 95139269 A TW95139269 A TW 95139269A TW 200730656 A TW200730656 A TW 200730656A
- Authority
- TW
- Taiwan
- Prior art keywords
- fixed
- magnet assembly
- incorproating
- cathode
- applications
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/342—Hollow targets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59682405P | 2005-10-24 | 2005-10-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200730656A true TW200730656A (en) | 2007-08-16 |
Family
ID=37968646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095139269A TW200730656A (en) | 2005-10-24 | 2006-10-25 | Cathode incorproating fixed or rotating target in combination with a moving magnet assembly and applications thereof |
Country Status (9)
Country | Link |
---|---|
US (1) | US20070089983A1 (zh) |
EP (1) | EP1941071A4 (zh) |
JP (1) | JP2009512788A (zh) |
CN (1) | CN101297059A (zh) |
BR (1) | BRPI0619284A2 (zh) |
CA (1) | CA2626915A1 (zh) |
MX (1) | MX2008005318A (zh) |
TW (1) | TW200730656A (zh) |
WO (1) | WO2007051105A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI652365B (zh) | 2016-05-02 | 2019-03-01 | 美商應用材料股份有限公司 | 塗佈一基板之方法及用以塗佈一基板之塗佈設備 |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0715879D0 (en) * | 2007-08-15 | 2007-09-26 | Gencoa Ltd | Low impedance plasma |
US9175383B2 (en) | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
EP2081212B1 (en) | 2008-01-16 | 2016-03-23 | Applied Materials, Inc. | Double-Coating Device with one Process Chamber |
GB2461094B (en) * | 2008-06-20 | 2012-08-22 | Mantis Deposition Ltd | Deposition of materials |
EP2306489A1 (en) * | 2009-10-02 | 2011-04-06 | Applied Materials, Inc. | Method for coating a substrate and coater |
JP5730888B2 (ja) | 2009-10-26 | 2015-06-10 | ジェネラル・プラズマ・インコーポレーテッド | ロータリーマグネトロンマグネットバー、およびこれを含む高いターゲット利用のための装置 |
EP2640865B1 (en) * | 2010-11-17 | 2020-05-13 | Soleras Advanced Coatings bvba | Soft sputtering magnetron system |
US20120181171A1 (en) * | 2011-01-13 | 2012-07-19 | Regents Of The University Of Minnesota | Nanoparticle Deposition Systems |
KR101298768B1 (ko) | 2011-03-29 | 2013-08-21 | (주)에스엔텍 | 원통형 스퍼터링 캐소드 장치 |
US20130032476A1 (en) * | 2011-08-04 | 2013-02-07 | Sputtering Components, Inc. | Rotary cathodes for magnetron sputtering system |
US20140332369A1 (en) * | 2011-10-24 | 2014-11-13 | Applied Materials, Inc. | Multidirectional racetrack rotary cathode for pvd array applications |
CN102703872B (zh) * | 2012-05-24 | 2014-01-29 | 广东友通工业有限公司 | 磁控溅射镀膜机的磁控溅射靶 |
JPWO2013179544A1 (ja) * | 2012-05-31 | 2016-01-18 | 東京エレクトロン株式会社 | マグネトロンスパッタ装置 |
CN102719799A (zh) * | 2012-06-08 | 2012-10-10 | 深圳市华星光电技术有限公司 | 旋转磁控溅射靶及相应的磁控溅射装置 |
JP2016518240A (ja) | 2013-02-15 | 2016-06-23 | リージェンツ オブ ザ ユニバーシティ オブ ミネソタ | 粒子の官能化 |
EP2778253B1 (de) | 2013-02-26 | 2018-10-24 | Oerlikon Surface Solutions AG, Pfäffikon | Zylinderförmige Verdampfungsquelle |
US9281167B2 (en) * | 2013-02-26 | 2016-03-08 | Applied Materials, Inc. | Variable radius dual magnetron |
KR102152949B1 (ko) * | 2013-04-24 | 2020-09-08 | 삼성디스플레이 주식회사 | 스퍼터링 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법 |
KR102205398B1 (ko) * | 2013-07-25 | 2021-01-21 | 삼성디스플레이 주식회사 | 스퍼터링 장치 및 이를 이용한 박막 형성 방법 |
CN105154837B (zh) * | 2015-10-16 | 2017-10-27 | 京东方科技集团股份有限公司 | 一种溅镀设备的靶材更换装置及溅镀设备 |
CN105506568B (zh) * | 2016-01-21 | 2017-10-31 | 武汉科瑞达真空科技有限公司 | 一种新型孪生外置旋转阴极 |
JP6396367B2 (ja) * | 2016-06-27 | 2018-09-26 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Pvdアレイ用の多方向レーストラック回転カソード |
KR20190077575A (ko) * | 2016-11-22 | 2019-07-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 상으로의 층 증착을 위한 장치 및 방법 |
CN108468029B (zh) * | 2018-02-12 | 2020-01-21 | 中国科学院国家天文台南京天文光学技术研究所 | 用于碳化硅光学镜面改性与面形提升的磁控溅射扫描方法 |
JP7328744B2 (ja) * | 2018-07-31 | 2023-08-17 | キヤノントッキ株式会社 | 成膜装置、および、電子デバイスの製造方法 |
CN110220048A (zh) * | 2019-04-18 | 2019-09-10 | 厦门阿匹斯智能制造系统有限公司 | 一种磁场角度可调的磁钢 |
RU2761900C1 (ru) * | 2021-02-08 | 2021-12-13 | Федеральное государственное бюджетное учреждение науки Институт радиотехники и электроники им. В.А. Котельникова Российской академии наук | Магнетронное распылительное устройство |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0046154B1 (en) * | 1980-08-08 | 1984-11-28 | Battelle Development Corporation | Apparatus for coating substrates by high-rate cathodic sputtering, as well as sputtering cathode for such apparatus |
US4417968A (en) * | 1983-03-21 | 1983-11-29 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
US5618388A (en) * | 1988-02-08 | 1997-04-08 | Optical Coating Laboratory, Inc. | Geometries and configurations for magnetron sputtering apparatus |
DE4418906B4 (de) * | 1994-05-31 | 2004-03-25 | Unaxis Deutschland Holding Gmbh | Verfahren zum Beschichten eines Substrates und Beschichtungsanlage zu seiner Durchführung |
JPH1129866A (ja) * | 1997-07-11 | 1999-02-02 | Fujitsu Ltd | スパッタ装置 |
US6436252B1 (en) * | 2000-04-07 | 2002-08-20 | Surface Engineered Products Corp. | Method and apparatus for magnetron sputtering |
CA2509952A1 (en) * | 2002-12-18 | 2004-11-25 | Cardinal Cg Company | Plasma-enhanced film deposition |
US20080017506A1 (en) * | 2004-04-05 | 2008-01-24 | Anja Blondeel | Tubular Magnet Assembly |
-
2006
- 2006-10-24 CN CNA2006800395955A patent/CN101297059A/zh active Pending
- 2006-10-24 BR BRPI0619284-0A patent/BRPI0619284A2/pt not_active IP Right Cessation
- 2006-10-24 EP EP06839520A patent/EP1941071A4/en not_active Withdrawn
- 2006-10-24 US US11/552,270 patent/US20070089983A1/en not_active Abandoned
- 2006-10-24 CA CA002626915A patent/CA2626915A1/en not_active Abandoned
- 2006-10-24 JP JP2008538148A patent/JP2009512788A/ja active Pending
- 2006-10-24 WO PCT/US2006/060190 patent/WO2007051105A2/en active Application Filing
- 2006-10-24 MX MX2008005318A patent/MX2008005318A/es unknown
- 2006-10-25 TW TW095139269A patent/TW200730656A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI652365B (zh) | 2016-05-02 | 2019-03-01 | 美商應用材料股份有限公司 | 塗佈一基板之方法及用以塗佈一基板之塗佈設備 |
Also Published As
Publication number | Publication date |
---|---|
US20070089983A1 (en) | 2007-04-26 |
WO2007051105A3 (en) | 2007-11-08 |
EP1941071A2 (en) | 2008-07-09 |
EP1941071A4 (en) | 2010-04-07 |
CN101297059A (zh) | 2008-10-29 |
MX2008005318A (es) | 2008-09-26 |
BRPI0619284A2 (pt) | 2011-09-20 |
CA2626915A1 (en) | 2007-05-03 |
WO2007051105A2 (en) | 2007-05-03 |
JP2009512788A (ja) | 2009-03-26 |
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