TW200729422A - Chip package - Google Patents
Chip packageInfo
- Publication number
- TW200729422A TW200729422A TW095101687A TW95101687A TW200729422A TW 200729422 A TW200729422 A TW 200729422A TW 095101687 A TW095101687 A TW 095101687A TW 95101687 A TW95101687 A TW 95101687A TW 200729422 A TW200729422 A TW 200729422A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- pads
- die
- disposed
- passivation layer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 12
- 238000002161 passivation Methods 0.000 abstract 5
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095101687A TWI286829B (en) | 2006-01-17 | 2006-01-17 | Chip package |
US11/445,868 US20070164447A1 (en) | 2006-01-17 | 2006-06-02 | Semiconductor package and fabricating method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095101687A TWI286829B (en) | 2006-01-17 | 2006-01-17 | Chip package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200729422A true TW200729422A (en) | 2007-08-01 |
TWI286829B TWI286829B (en) | 2007-09-11 |
Family
ID=38262431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095101687A TWI286829B (en) | 2006-01-17 | 2006-01-17 | Chip package |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070164447A1 (zh) |
TW (1) | TWI286829B (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8641913B2 (en) | 2003-10-06 | 2014-02-04 | Tessera, Inc. | Fine pitch microcontacts and method for forming thereof |
US7495179B2 (en) | 2003-10-06 | 2009-02-24 | Tessera, Inc. | Components with posts and pads |
US7709968B2 (en) | 2003-12-30 | 2010-05-04 | Tessera, Inc. | Micro pin grid array with pin motion isolation |
JP4908750B2 (ja) * | 2004-11-25 | 2012-04-04 | ローム株式会社 | 半導体装置 |
JP5629580B2 (ja) * | 2007-09-28 | 2014-11-19 | テッセラ,インコーポレイテッド | 二重ポスト付きフリップチップ相互接続 |
KR100924552B1 (ko) | 2007-11-30 | 2009-11-02 | 주식회사 하이닉스반도체 | 반도체 패키지용 기판 및 이를 갖는 반도체 패키지 |
TW201011878A (en) * | 2008-09-03 | 2010-03-16 | Phoenix Prec Technology Corp | Package structure having substrate and fabrication thereof |
US8330272B2 (en) | 2010-07-08 | 2012-12-11 | Tessera, Inc. | Microelectronic packages with dual or multiple-etched flip-chip connectors |
US8580607B2 (en) | 2010-07-27 | 2013-11-12 | Tessera, Inc. | Microelectronic packages with nanoparticle joining |
US8853558B2 (en) | 2010-12-10 | 2014-10-07 | Tessera, Inc. | Interconnect structure |
JP5959395B2 (ja) * | 2012-09-29 | 2016-08-02 | 京セラ株式会社 | 配線基板 |
KR20140070057A (ko) * | 2012-11-30 | 2014-06-10 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
US9633971B2 (en) | 2015-07-10 | 2017-04-25 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
US10886250B2 (en) | 2015-07-10 | 2021-01-05 | Invensas Corporation | Structures and methods for low temperature bonding using nanoparticles |
TWI822659B (zh) | 2016-10-27 | 2023-11-21 | 美商艾德亞半導體科技有限責任公司 | 用於低溫接合的結構和方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3311215B2 (ja) * | 1995-09-28 | 2002-08-05 | 株式会社東芝 | 半導体装置 |
US5903052A (en) * | 1998-05-12 | 1999-05-11 | Industrial Technology Research Institute | Structure for semiconductor package for improving the efficiency of spreading heat |
JP2005101031A (ja) * | 2003-09-22 | 2005-04-14 | Rohm Co Ltd | 半導体集積回路装置、及び電子機器 |
US7078272B2 (en) * | 2004-09-20 | 2006-07-18 | Aptos Corporation | Wafer scale integration packaging and method of making and using the same |
-
2006
- 2006-01-17 TW TW095101687A patent/TWI286829B/zh active
- 2006-06-02 US US11/445,868 patent/US20070164447A1/en not_active Abandoned
Also Published As
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TWI286829B (en) | 2007-09-11 |
US20070164447A1 (en) | 2007-07-19 |
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