TW200727382A - Relay station and substrate processing system using relay station - Google Patents

Relay station and substrate processing system using relay station

Info

Publication number
TW200727382A
TW200727382A TW095106905A TW95106905A TW200727382A TW 200727382 A TW200727382 A TW 200727382A TW 095106905 A TW095106905 A TW 095106905A TW 95106905 A TW95106905 A TW 95106905A TW 200727382 A TW200727382 A TW 200727382A
Authority
TW
Taiwan
Prior art keywords
relay station
substrate processing
side opening
apparatus side
processing system
Prior art date
Application number
TW095106905A
Other languages
English (en)
Other versions
TWI306641B (zh
Inventor
Wataru Karasawa
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200727382A publication Critical patent/TW200727382A/zh
Application granted granted Critical
Publication of TWI306641B publication Critical patent/TWI306641B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW095106905A 2005-03-01 2006-03-01 Relay station and substrate processing system using relay station TW200727382A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005056362A JP4563219B2 (ja) 2005-03-01 2005-03-01 中継ステーション及び中継ステーションを用いた基板処理システム

Publications (2)

Publication Number Publication Date
TW200727382A true TW200727382A (en) 2007-07-16
TWI306641B TWI306641B (zh) 2009-02-21

Family

ID=36941149

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106905A TW200727382A (en) 2005-03-01 2006-03-01 Relay station and substrate processing system using relay station

Country Status (6)

Country Link
US (1) US20080124192A1 (zh)
JP (1) JP4563219B2 (zh)
KR (1) KR100840959B1 (zh)
CN (1) CN1957456A (zh)
TW (1) TW200727382A (zh)
WO (1) WO2006093120A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5921371B2 (ja) * 2012-07-13 2016-05-24 信越ポリマー株式会社 基板収納容器
EP3140697A1 (en) * 2014-05-07 2017-03-15 Mapper Lithography IP B.V. Enclosure for a target processing machine
JP7090469B2 (ja) * 2018-05-15 2022-06-24 東京エレクトロン株式会社 基板処理装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US513954A (en) * 1894-01-30 Metal-working tool
JPS6155930A (ja) * 1984-08-27 1986-03-20 Mitsubishi Electric Corp 工程間リ−ドフレ−ム搬送装置
JP2502661B2 (ja) * 1988-03-04 1996-05-29 松下電器産業株式会社 気相成長装置
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
US5277579A (en) * 1991-03-15 1994-01-11 Tokyo Electron Sagami Limited Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring system
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JPH05166917A (ja) * 1991-12-18 1993-07-02 Kawasaki Steel Corp バッファ・カセット
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP2951628B2 (ja) * 1998-01-22 1999-09-20 アプライド マテリアルズ インコーポレイテッド ウェハ保管用カセット
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
US6641349B1 (en) * 1999-04-30 2003-11-04 Tdk Corporation Clean box, clean transfer method and system
KR100729986B1 (ko) * 1999-12-20 2007-06-20 아시스트 신꼬, 인코포레이티드 자동반송시스템
JP2003031641A (ja) * 2001-07-19 2003-01-31 Mitsubishi Electric Corp 製品保管方法および製品保管装置
JP4194262B2 (ja) * 2001-09-27 2008-12-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP2003321102A (ja) * 2002-05-02 2003-11-11 Tokyo Electron Ltd 無人搬送車システム
JP2004281474A (ja) * 2003-03-12 2004-10-07 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
JP4065997B2 (ja) * 2003-05-23 2008-03-26 株式会社ダイフク 台車式搬送装置

Also Published As

Publication number Publication date
JP2006245130A (ja) 2006-09-14
WO2006093120A1 (ja) 2006-09-08
JP4563219B2 (ja) 2010-10-13
CN1957456A (zh) 2007-05-02
KR20070029172A (ko) 2007-03-13
KR100840959B1 (ko) 2008-06-24
US20080124192A1 (en) 2008-05-29
TWI306641B (zh) 2009-02-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees