TW200722918A - Material for pattern formation, device for pattern formation, and methof for pattern formation - Google Patents

Material for pattern formation, device for pattern formation, and methof for pattern formation

Info

Publication number
TW200722918A
TW200722918A TW095132517A TW95132517A TW200722918A TW 200722918 A TW200722918 A TW 200722918A TW 095132517 A TW095132517 A TW 095132517A TW 95132517 A TW95132517 A TW 95132517A TW 200722918 A TW200722918 A TW 200722918A
Authority
TW
Taiwan
Prior art keywords
pattern formation
compounds
developer
pattern
organic solvent
Prior art date
Application number
TW095132517A
Other languages
Chinese (zh)
Other versions
TWI411880B (en
Inventor
Kazumori Minami
Morimasa Sato
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of TW200722918A publication Critical patent/TW200722918A/en
Application granted granted Critical
Publication of TWI411880B publication Critical patent/TWI411880B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/001—Phase modulating patterns, e.g. refractive index patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

This invention provides a material for pattern formation, a device for pattern formation comprised of the said material, and a method of using the said material for pattern formation. The material for pattern formation enables the formed pattern to be a low trouble showing, prevention of light fog caused by developer, less broken in undeveloped film, high resolution, big strength for covering film, well removing activity after pattern formation, and a refined pattern formation. The material for pattern formation comprises photosensitive film containing binder, polymeric compounds, photoinitiator, hetero-fused ring compounds, polymerization inhibitor, developer, and organic solvent; wherein the acid value of binder is 50 to 400 mgKOH/g with mass average molecular weight of 10,000 to 100,000, polymeric compounds comprise at least one of urethane-based compounds and aryl-based compounds, and organic solvent at least selects from one of ketones, alcohols, and ethers, with amount less than 0.5 mass%.
TW95132517A 2005-09-14 2006-09-04 Pattern forming material, pattern forming device and pattern forming method TWI411880B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005266876A JP4966528B2 (en) 2005-09-14 2005-09-14 Pattern forming material, pattern forming apparatus and pattern forming method

Publications (2)

Publication Number Publication Date
TW200722918A true TW200722918A (en) 2007-06-16
TWI411880B TWI411880B (en) 2013-10-11

Family

ID=37864793

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95132517A TWI411880B (en) 2005-09-14 2006-09-04 Pattern forming material, pattern forming device and pattern forming method

Country Status (4)

Country Link
JP (1) JP4966528B2 (en)
CN (1) CN101263425B (en)
TW (1) TWI411880B (en)
WO (1) WO2007032195A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760311B (en) * 2015-08-31 2022-04-11 日商富士軟片股份有限公司 Coloring photosensitive composition, cured film, color filter, light-shielding film, solid state imaging device, image display device, and method for manufacturing cured film

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JP5549439B2 (en) * 2009-09-18 2014-07-16 Ｊｓｒ株式会社 Radiation sensitive resin composition for forming cured product as protective film, insulating film or spacer for display element, cured product and method for forming the same
CN106918991A (en) * 2010-07-13 2017-07-04 日立化成工业株式会社 Photosensitive element, the forming method of corrosion-resisting pattern, the manufacture method of printed circuit board and printed circuit board
JP5697461B2 (en) 2011-01-17 2015-04-08 ユニチカ株式会社 Polyester film and photosensitive resin structure
JP2013023592A (en) * 2011-07-21 2013-02-04 Auto Kagaku Kogyo Kk Primer composition, and method for constructing sealing material using the primer composition and method for constructing waterproof material using the primer composition
JP5814097B2 (en) * 2011-12-06 2015-11-17 富士フイルム株式会社 Photosensitive resin composition for photo spacer for microlens array exposure
KR101986032B1 (en) * 2012-07-20 2019-06-04 아사히 가세이 이-매터리얼즈 가부시키가이샤 Method for producing photosensitive resin element
WO2015037431A1 (en) * 2013-09-11 2015-03-19 三洋化成工業株式会社 Active energy ray curable resin composition, and cured product
TWI633388B (en) * 2013-11-29 2018-08-21 旭化成電子材料股份有限公司 Photosensitive resin element
JP6309761B2 (en) * 2013-12-27 2018-04-11 東京応化工業株式会社 Photosensitive resin composition for black column spacer
JP2016133661A (en) * 2015-01-20 2016-07-25 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing structure
JP6859353B2 (en) 2016-08-25 2021-04-14 富士フイルム株式会社 Curable composition and its manufacturing method, cured film and its manufacturing method, color filter, solid-state image sensor, solid-state image sensor, and infrared sensor
CN111316164B (en) * 2017-11-06 2023-12-29 旭化成株式会社 Photosensitive resin laminate and method for producing resist pattern
JP6959887B2 (en) * 2018-03-26 2021-11-05 ニッコー・マテリアルズ株式会社 A photosensitive resin composition, a photoresist film using the photosensitive resin composition, and a method for forming a resist pattern.
WO2019225363A1 (en) * 2018-05-22 2019-11-28 富士フイルム株式会社 Photosensitive transfer material, method for producing resin pattern, method for manufacturing circuit wiring, and method for manufacturing touch panel

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US5001036A (en) * 1989-03-03 1991-03-19 E. I. Du Pont De Nemours And Company Multi-layer peel-apart photosensitive reproduction element containing a photorelease layer
JP2756623B2 (en) * 1992-02-26 1998-05-25 富士写真フイルム株式会社 Photopolymerizable composition
EP1739484B1 (en) * 2000-04-19 2011-08-24 AGFA Graphics NV Photosensitive lithographic printing plate and method for making a prinitng plate.
JP2001318461A (en) * 2000-05-11 2001-11-16 Nichigo Morton Co Ltd Photosensitive resin composition and photosensitive film using the same
JP4519356B2 (en) * 2001-04-26 2010-08-04 旭化成イーマテリアルズ株式会社 Photosensitive resin laminate
JP3824508B2 (en) * 2001-08-10 2006-09-20 旭化成エレクトロニクス株式会社 Dry film resist and manufacturing method thereof
CN1273867C (en) * 2001-11-12 2006-09-06 旭化成电子材料元件株式会社 Photosensitive resin composition and applications thereof
US7074546B2 (en) * 2002-06-24 2006-07-11 Konica Corporation Light sensitive planographic printing plate precursor and its processing method
JP3797331B2 (en) * 2003-01-20 2006-07-19 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern manufacturing method, and printed wiring board manufacturing method
JP4305732B2 (en) * 2003-04-17 2009-07-29 日立化成工業株式会社 Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, and method for producing printed wiring board
JP2004335639A (en) * 2003-05-06 2004-11-25 Fuji Photo Film Co Ltd Projection aligner
JP4244156B2 (en) * 2003-05-07 2009-03-25 富士フイルム株式会社 Projection exposure equipment
JP2005070175A (en) * 2003-08-20 2005-03-17 Fuji Photo Film Co Ltd Photopolymerizable composition and dry film photoresist
JP2005136223A (en) * 2003-10-30 2005-05-26 Fuji Photo Film Co Ltd Manufacturing method of printed circuit board
KR100742251B1 (en) * 2003-12-26 2007-07-24 후지필름 가부시키가이샤 Method and device for image exposure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI760311B (en) * 2015-08-31 2022-04-11 日商富士軟片股份有限公司 Coloring photosensitive composition, cured film, color filter, light-shielding film, solid state imaging device, image display device, and method for manufacturing cured film

Also Published As

Publication number Publication date
JP4966528B2 (en) 2012-07-04
JP2007079128A (en) 2007-03-29
CN101263425A (en) 2008-09-10
TWI411880B (en) 2013-10-11
CN101263425B (en) 2012-06-13
WO2007032195A1 (en) 2007-03-22

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