TW200716987A - Probe card - Google Patents

Probe card

Info

Publication number
TW200716987A
TW200716987A TW095123260A TW95123260A TW200716987A TW 200716987 A TW200716987 A TW 200716987A TW 095123260 A TW095123260 A TW 095123260A TW 95123260 A TW95123260 A TW 95123260A TW 200716987 A TW200716987 A TW 200716987A
Authority
TW
Taiwan
Prior art keywords
contactor
elastic sheet
probe card
periphery
circuit board
Prior art date
Application number
TW095123260A
Other languages
English (en)
Chinese (zh)
Other versions
TWI293120B (enExample
Inventor
Hisatomi Hosaka
Takashi Amemiya
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200716987A publication Critical patent/TW200716987A/zh
Application granted granted Critical
Publication of TWI293120B publication Critical patent/TWI293120B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW095123260A 2005-07-12 2006-06-28 Probe card TW200716987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005203285A JP4472593B2 (ja) 2005-07-12 2005-07-12 プローブカード

Publications (2)

Publication Number Publication Date
TW200716987A true TW200716987A (en) 2007-05-01
TWI293120B TWI293120B (enExample) 2008-02-01

Family

ID=37636940

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123260A TW200716987A (en) 2005-07-12 2006-06-28 Probe card

Country Status (5)

Country Link
US (1) US7541820B2 (enExample)
JP (1) JP4472593B2 (enExample)
KR (1) KR100915179B1 (enExample)
TW (1) TW200716987A (enExample)
WO (1) WO2007007544A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200525675A (en) * 2004-01-20 2005-08-01 Tokyo Electron Ltd Probe guard
US7629806B2 (en) * 2005-03-08 2009-12-08 Tokyo Electron Limited Method for forming connection pin, probe, connection pin, probe card and method for manufacturing probe card
KR100851392B1 (ko) * 2007-03-16 2008-08-11 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
KR101402144B1 (ko) * 2007-03-30 2014-06-03 주식회사 아이에스시 이방 도전성 커넥터, 프로브 부재 및 웨이퍼 검사 장치
JP5015671B2 (ja) * 2007-06-21 2012-08-29 日本電子材料株式会社 プローブカード
JP5188161B2 (ja) * 2007-11-30 2013-04-24 東京エレクトロン株式会社 プローブカード
JP2009133722A (ja) * 2007-11-30 2009-06-18 Tokyo Electron Ltd プローブ装置
JP2009204393A (ja) * 2008-02-27 2009-09-10 Renesas Technology Corp プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法
JP2009301859A (ja) * 2008-06-12 2009-12-24 Japan Electronic Materials Corp Ｉｃピンフレームおよびｉｃピンを用いたプローブカード
KR101593521B1 (ko) 2009-08-07 2016-02-15 삼성전자주식회사 테스터 및 이를 구비한 반도체 디바이스 검사 장치
DE202009014987U1 (de) * 2009-10-28 2010-02-18 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen
US8643394B2 (en) * 2010-04-16 2014-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Non-reflow probe card structure
WO2012095997A1 (ja) * 2011-01-16 2012-07-19 日本電子材料株式会社 プローブカード及びその製造方法
US9891273B2 (en) * 2011-06-29 2018-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Test structures and testing methods for semiconductor devices
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
JP7590820B2 (ja) * 2020-06-17 2024-11-27 株式会社ヨコオ プローブカード

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
JP2892505B2 (ja) 1994-11-15 1999-05-17 フォームファクター，インコーポレイテッド 回路基板への電子コンポーネントの実装
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
ATE494645T1 (de) * 2001-02-09 2011-01-15 Jsr Corp ßANISOTROPER LEITFÄHIGER VERBINDER, HERSTELLUNGSVERFAHREN DAFÜR UND SONDENGLIEDß
US7396236B2 (en) * 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
JP3891798B2 (ja) * 2001-06-19 2007-03-14 松下電器産業株式会社 プローブ装置
US6677771B2 (en) * 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
TW525273B (en) * 2002-02-07 2003-03-21 Via Tech Inc Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof
JP3621938B2 (ja) * 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7372286B2 (en) * 2006-01-03 2008-05-13 Chipmos Technologies (Bermuda) Ltd. Modular probe card

Also Published As

Publication number Publication date
KR20070104531A (ko) 2007-10-26
JP2007024533A (ja) 2007-02-01
KR100915179B1 (ko) 2009-09-02
JP4472593B2 (ja) 2010-06-02
WO2007007544A1 (ja) 2007-01-18
TWI293120B (enExample) 2008-02-01
US7541820B2 (en) 2009-06-02
US20080150558A1 (en) 2008-06-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees