TW200714430A - Sheet cutting device and cutting method - Google Patents
Sheet cutting device and cutting methodInfo
- Publication number
- TW200714430A TW200714430A TW095128544A TW95128544A TW200714430A TW 200714430 A TW200714430 A TW 200714430A TW 095128544 A TW095128544 A TW 095128544A TW 95128544 A TW95128544 A TW 95128544A TW 200714430 A TW200714430 A TW 200714430A
- Authority
- TW
- Taiwan
- Prior art keywords
- cutting
- sheet
- wafers
- cutting device
- adhesive sheet
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/10—Making cuts of other than simple rectilinear form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/005—Manipulators for mechanical processing tasks
- B25J11/0055—Cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3806—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface
- B26F1/3813—Cutting-out; Stamping-out wherein relative movements of tool head and work during cutting have a component tangential to the work surface wherein the tool head is moved in a plane parallel to the work in a coordinate system fixed with respect to the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
- B26F1/3846—Cutting-out; Stamping-out cutting out discs or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Forests & Forestry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005229226A JP4739853B2 (ja) | 2005-08-08 | 2005-08-08 | シート切断装置及び切断方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200714430A true TW200714430A (en) | 2007-04-16 |
Family
ID=37727229
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095128544A TW200714430A (en) | 2005-08-08 | 2006-08-03 | Sheet cutting device and cutting method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4739853B2 (ja) |
TW (1) | TW200714430A (ja) |
WO (1) | WO2007018040A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007041423A1 (de) * | 2007-08-31 | 2009-03-05 | Abb Technology Ab | Roboterwerkzeug, Robotersystem und Verfahren zum Bearbeiten von Werkstücken |
JP2020078837A (ja) * | 2018-11-12 | 2020-05-28 | リンテック株式会社 | シート切断装置およびシート切断方法 |
CN111673766B (zh) * | 2020-06-19 | 2021-12-10 | 江西联麓智能装备有限公司 | 一种工业切割机器人 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2919938B2 (ja) * | 1990-09-26 | 1999-07-19 | 日東電工株式会社 | 薄板に貼着した粘着テープのカット方法 |
JP2002190457A (ja) * | 2000-12-20 | 2002-07-05 | Fdk Corp | 方向性を有する素子の作製・取扱方法 |
JP4311522B2 (ja) * | 2002-03-07 | 2009-08-12 | 日東電工株式会社 | 接着シート貼付方法およびその装置並びに半導体ウエハ処理方法 |
-
2005
- 2005-08-08 JP JP2005229226A patent/JP4739853B2/ja active Active
-
2006
- 2006-07-27 WO PCT/JP2006/314851 patent/WO2007018040A1/ja active Application Filing
- 2006-08-03 TW TW095128544A patent/TW200714430A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
JP4739853B2 (ja) | 2011-08-03 |
JP2007044774A (ja) | 2007-02-22 |
WO2007018040A1 (ja) | 2007-02-15 |
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