TW200709858A - Paste applicator - Google Patents

Paste applicator

Info

Publication number
TW200709858A
TW200709858A TW095117877A TW95117877A TW200709858A TW 200709858 A TW200709858 A TW 200709858A TW 095117877 A TW095117877 A TW 095117877A TW 95117877 A TW95117877 A TW 95117877A TW 200709858 A TW200709858 A TW 200709858A
Authority
TW
Taiwan
Prior art keywords
substrate
type frame
column type
double column
paste
Prior art date
Application number
TW095117877A
Other languages
Chinese (zh)
Other versions
TWI296546B (en
Inventor
Youhei Kawaguchi
Yukihiro Kawasumi
Shigeru Ishida
Shinya Yamama
Takao Murayama
Original Assignee
Hitachi Plant Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plant Technologies Ltd filed Critical Hitachi Plant Technologies Ltd
Publication of TW200709858A publication Critical patent/TW200709858A/en
Application granted granted Critical
Publication of TWI296546B publication Critical patent/TWI296546B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet

Abstract

To solve such a problem that a coating applicator having many coating heads is requested in order to coat a large-sized substrate at a high speed but when the number of the coating heads is increased, the numbers of a signal wire and an electrical wire are also increased and consequently the cleanliness and precision when the substrate is coated are deteriorated owing to generated dust. The paste applicator is constituted so that a double column type frame to be reciprocated to one direction and a plurality of coating heads to be moved to the longitudinal direction of the double column type frame are arranged, the substrate is placed on a table arranged to be opposed to a discharge port of a nozzle of each of coating heads and a paste pattern having a desired shape is formed on the substrate by changing the relative position of the substrate to the nozzle while discharging the paste packed in a paste housing cylinder onto the substrate from the discharge port. A power feeding line arranged straightly on the side of a rack is connected electrically to a power receiving core arranged on the side of the double column type frame by using a magnetic coupling to feed power to the double column type frame in a non-contact state. Optical wireless communication is arranged between the moving the double column type frame and the rack to transmit and receive a control signal.
TW095117877A 2005-05-20 2006-05-19 Paste applicator TW200709858A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005147500A JP4815872B2 (en) 2005-05-20 2005-05-20 Paste applicator

Publications (2)

Publication Number Publication Date
TW200709858A true TW200709858A (en) 2007-03-16
TWI296546B TWI296546B (en) 2008-05-11

Family

ID=37442465

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117877A TW200709858A (en) 2005-05-20 2006-05-19 Paste applicator

Country Status (4)

Country Link
JP (1) JP4815872B2 (en)
KR (1) KR100795135B1 (en)
CN (1) CN100457291C (en)
TW (1) TW200709858A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100795137B1 (en) * 2006-02-17 2008-01-17 가부시키가이샤 히타치플랜트테크놀로지 Paste coating apparatus
KR100901490B1 (en) * 2007-05-15 2009-06-08 삼성전기주식회사 Apparatus for forming wiring and manufacturing method of printed circuit board
JP5018391B2 (en) * 2007-10-12 2012-09-05 株式会社日立プラントテクノロジー Paste applicator
JP5525182B2 (en) * 2009-05-14 2014-06-18 株式会社日立製作所 Paste coating apparatus and coating method
EP2874482B1 (en) * 2012-07-12 2018-06-27 Fuji Machine Mfg. Co., Ltd. Contactless electrical power supply device
CN104704939B (en) * 2012-09-28 2018-08-10 富士机械制造株式会社 Driving device
CN104190578B (en) * 2014-09-23 2016-08-24 苏州万图明电子软件有限公司 A kind of dedusting is stretched spray-painting plant
CN105334591B (en) * 2015-11-19 2018-08-24 江苏法尔胜光通有限公司 A kind of cable cream coating unit

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2929897B2 (en) * 1993-06-14 1999-08-03 株式会社ダイフク Automatic warehouse
JP3697315B2 (en) * 1996-05-13 2005-09-21 松下電器産業株式会社 Adhesive applicator
US6132809A (en) * 1997-01-16 2000-10-17 Precision Valve & Automation, Inc. Conformal coating using multiple applications
JPH1157586A (en) * 1997-08-11 1999-03-02 Dainippon Screen Mfg Co Ltd Coating device
JP3266088B2 (en) * 1998-01-13 2002-03-18 株式会社豊田自動織機 Non-contact power supply
JP3657812B2 (en) 1999-05-14 2005-06-08 株式会社 日立インダストリイズ Paste pattern quality control method and paste applicator
JP3154121B2 (en) 1999-05-28 2001-04-09 教裕 中元 Buckle for belt
JP2001016702A (en) * 1999-06-29 2001-01-19 Tsubakimoto Chain Co Noncontact feeder and pickup part used therefor
JP2001211501A (en) * 2000-01-27 2001-08-03 Hitachi Kiden Kogyo Ltd Power supplying method for conveying equipment
JP3465078B2 (en) * 2000-08-23 2003-11-10 株式会社椿本チエイン Non-contact power supply method and non-contact power supply device
JP2002345104A (en) * 2001-05-16 2002-11-29 Tsubakimoto Chain Co Non-contact power feeding system
JP3778874B2 (en) * 2001-05-23 2006-05-24 株式会社椿本チエイン Non-contact power feeding device
JP3701882B2 (en) * 2001-05-25 2005-10-05 株式会社 日立インダストリイズ Paste applicator
JP2003086441A (en) * 2001-09-10 2003-03-20 Hitachi Kiden Kogyo Ltd Non-contact power feed device
JP3828824B2 (en) * 2002-03-28 2006-10-04 株式会社 日立インダストリイズ Paste applicator

Also Published As

Publication number Publication date
JP4815872B2 (en) 2011-11-16
TWI296546B (en) 2008-05-11
CN1868604A (en) 2006-11-29
KR100795135B1 (en) 2008-01-17
KR20060120484A (en) 2006-11-27
JP2006320855A (en) 2006-11-30
CN100457291C (en) 2009-02-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees