JP2006320855A - Paste applicator - Google Patents

Paste applicator Download PDF

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JP2006320855A
JP2006320855A JP2005147500A JP2005147500A JP2006320855A JP 2006320855 A JP2006320855 A JP 2006320855A JP 2005147500 A JP2005147500 A JP 2005147500A JP 2005147500 A JP2005147500 A JP 2005147500A JP 2006320855 A JP2006320855 A JP 2006320855A
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Prior art keywords
paste
substrate
portal frame
axis
power
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JP2005147500A
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JP4815872B2 (en
JP2006320855A5 (en
Inventor
Yohei Kawaguchi
洋平 川口
Yukihiro Kawasumi
幸宏 川隅
Shigeru Ishida
茂 石田
Shinya Yamama
伸也 山間
Takao Murayama
孝夫 村山
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Hitachi Plant Technologies Ltd
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Hitachi Plant Technologies Ltd
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Priority to JP2005147500A priority Critical patent/JP4815872B2/en
Priority to KR1020060045057A priority patent/KR100795135B1/en
Priority to TW095117877A priority patent/TW200709858A/en
Priority to CNB2006100824473A priority patent/CN100457291C/en
Publication of JP2006320855A publication Critical patent/JP2006320855A/en
Publication of JP2006320855A5 publication Critical patent/JP2006320855A5/ja
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a coating applicator having many coating heads is requested in order to coat a large-sized substrate at a high speed but when the number of the coating heads is increased, the numbers of a signal wire and an electrical wire are also increased and consequently the cleanliness and precision when the substrate is coated are deteriorated owing to generated dust. <P>SOLUTION: The paste applicator is constituted so that a double column type frame to be reciprocated to one direction and a plurality of coating heads to be moved to the longitudinal direction of the double column type frame are arranged, the substrate is placed on a table arranged to be opposed to a discharge port of a nozzle of each of coating heads and a paste pattern having a desired shape is formed on the substrate by changing the relative position of the substrate to the nozzle while discharging the paste packed in a paste housing cylinder onto the substrate from the discharge port. A power feeding line arranged straightly on the side of a rack is connected electrically to a power receiving core arranged on the side of the double column type frame by using a magnetic coupling to feed power to the double column type frame in a non-contact state. Optical wireless communication is arranged between the moving the double column type frame and the rack to transmit and receive a control signal. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、フラットパネルやプリント基板および半導体組立の製造過程で、基板上に所望形状のペーストパタ−ンを塗布するペースト塗布機に関する。   The present invention relates to a paste applicator for applying a paste pattern having a desired shape on a substrate in a manufacturing process of a flat panel, a printed circuit board, and a semiconductor assembly.

従来の技術として、特許文献1に示すように、ガラス基板を固定テーブル上に載置し、ガラス基板の主面に対してX軸方向に移動可能な門型フレームに取り付けられたYZ軸方向に移動可能な塗布ヘッドのノズル吐出口に対向するようにし、ペースト収納筒に充填したペーストを該吐出口から該基板上に吐出させながら該基板と該ノズルとの相対位置関係を変化させることにより、該基板上に所望形状のペーストパターンを塗布している。この引用文献1では、ガラス基板サイズの大型化が進んでおり、塗布ヘッドの塗布範囲も拡大、塗布ヘッドを複数設ける構成としている。これにより、固定外部制御盤から門型フレームに接続される動力線、信号線などの電気配線や、空圧配管が増加し、門型フレームに追従するケーブル本数も増加している。   As a conventional technique, as shown in Patent Document 1, a glass substrate is placed on a fixed table and mounted in a YZ axis direction attached to a portal frame that is movable in the X axis direction with respect to the main surface of the glass substrate. By facing the nozzle discharge port of the movable coating head and changing the relative positional relationship between the substrate and the nozzle while discharging the paste filled in the paste storage cylinder onto the substrate from the discharge port, A paste pattern having a desired shape is applied on the substrate. In this cited document 1, the glass substrate size is increasing, the coating range of the coating head is enlarged, and a plurality of coating heads are provided. As a result, electric wiring such as power lines and signal lines connected from the fixed external control panel to the portal frame and pneumatic piping are increased, and the number of cables following the portal frame is also increased.

また、特許文献2に示すように 電力配線を非接触にして搬送車を移動させるために給電区間を複数に分割し、その連結部を搬送車に搭載してある受電コイルが移送する際に、隣接する給電区間の給電位相を同一位相で給電するようにすることが開示されている。   Further, as shown in Patent Document 2, when the power receiving section is divided into a plurality of power feeding sections in order to move the transportation vehicle without contacting the power wiring, and the receiving coil mounted on the transportation vehicle moves, It is disclosed that the feeding phases of adjacent feeding sections are fed with the same phase.

特開2002−346452号公報JP 2002-346252 A 特開2001−211501号公報JP 2001-211501 A

これにより、固定外部制御盤から門型フレームに接続される動力線、信号線などの電気配線や、空圧配管が増加し、門型フレームに追従するケーブル本数も増加する為、ケーブルの磨耗やケーブル同士のこすれによる発塵により、クリーン環境での使用には適さない状況にある。   As a result, the number of cables that follow the portal frame increases because of the increase in electrical wiring such as power lines and signal lines connected from the fixed external control panel to the portal frame, and pneumatic piping, and the number of cables following the portal frame increases. Due to dust generation by rubbing between cables, it is not suitable for use in a clean environment.

本発明の目的は、塗布ヘッド個数の増加により、外部電源や、外部制御部と門型フレームを接続するケーブルも長く、本数も多くなり、ケーブルの磨耗や、ケーブル同士のこすれによる発塵を少なくした、ペースト塗布機を提供することである。   The purpose of the present invention is to increase the number of coating heads and to increase the length and number of cables connecting the external power supply and the external control unit to the portal frame, thereby reducing dust generation due to cable wear and cable rubbing. And providing a paste applicator.

本発明は、現状、装置外部に設置されている塗布ヘッド駆動用モータドライバを塗布ヘッド内部に設置し、モータドライバへの給電を磁気結合による非接触給電方式に、モータドライバの入出力信号、各種センサ信号や位置補正画像診断用カメラからの画像信号を光無線通信することにより、可動ケーブルの本数を少なくし、ケーブルからの発塵を少なくしたペースト塗布機とした。   In the present invention, a motor driver for driving a coating head currently installed outside the apparatus is installed inside the coating head, and the motor driver is fed into a non-contact power feeding system using magnetic coupling. The paste application machine reduced the number of movable cables and reduced dust generation from the cables by optical and wireless communication of sensor signals and image signals from the camera for position correction image diagnosis.

本発明によれば、基板主面にペーストパターンを塗布描画する際に、門型フレームの移動に追従するケーブル本数を少なくできるため、ケーブル同士のこすれや、ケーブルの磨耗が少なく低発塵のペースト塗布機を提供することができる。また、ケーブルを削減することで門型フレームや塗布ヘッドなどの移動体に加わる負荷かが低減できるために、塗布ヘッドの位置精度が向上するために高精度の塗布が行える。また塗布ヘッド部、門型フレーム部、各ユニット毎に配線作業を完結でき、ケーブル長も短く出来るので配線作業工数を削減することが出来る。   According to the present invention, when applying and drawing a paste pattern on the main surface of the substrate, the number of cables following the movement of the portal frame can be reduced. An applicator can be provided. Further, since the load applied to the moving body such as the portal frame and the coating head can be reduced by reducing the number of cables, high-precision coating can be performed because the positional accuracy of the coating head is improved. Further, the wiring work can be completed for each of the coating head portion, the portal frame portion, and each unit, and the cable length can be shortened, so that the number of wiring work steps can be reduced.

本発明は、塗布ヘッド部を駆動するモータへの動力供給や、センサ信号の為に門型フレームに接続される給電線や信号配線を省配線化する為に、モータドライバをガントリ上に設置し、該ドライバへの給電方法を門型移動方向に敷設した給電線と門型フレームに取り付けられた受電ピックアップからなる非接触給電方式とし、主制御部からドライバへの信号線を光無線通信方式とすることにより、門型フレームに追従する可動ケーブルを減らし、低発塵、配線作業工数の低減を実現する方法について、以下の実施例にて詳細に説明する。   In the present invention, a motor driver is installed on the gantry in order to reduce the power supply and signal wiring connected to the portal frame for power supply to the motor that drives the coating head section and sensor signals. The power supply method to the driver is a non-contact power supply method consisting of a power supply line laid in the portal movement direction and a power receiving pickup attached to the portal frame, and a signal line from the main control unit to the driver is an optical wireless communication system A method for reducing the movable cable following the portal frame, realizing low dust generation, and reducing the man-hour for wiring work will be described in detail in the following embodiments.

以下、本発明の実施例について図面を用いて説明する。
図1は本発明を適用したペースト塗布機の斜視図である。門型フレームの伸延方向と垂直方向をX軸、門型フレームの伸延方向をY軸、上下方向をZ軸とする。門型フレームは基本的にX軸方向に直線的に往復移動するものであり、塗布ヘッドはY軸方向に往復移動するものである。装置架台1上には、2つの門型フレーム2A、2Bが設けてある。本図において、右側の門型フレームと左側の門型フレームで同一数字のものは同一の分品を表しているため、添え字を省略して説明する場合がある。
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view of a paste applicator to which the present invention is applied. The extension direction of the portal frame is perpendicular to the X axis, the extension direction of the portal frame is the Y axis, and the vertical direction is the Z axis. The portal frame basically reciprocates linearly in the X-axis direction, and the coating head reciprocates in the Y-axis direction. Two portal frames 2A and 2B are provided on the apparatus base 1. In the figure, the right-side portal frame and the left-side portal frame that have the same number represent the same item, so that the suffix may be omitted.

2つの門型フレーム2は、図示していないX軸リニアモータを駆動することによりそれぞれX軸方向に移動可能としてある。門型フレームの上部には門型フレームを覆うカバー3が設けてある。門型フレーム2には一次給電コア6が設けてあり、このコアを貫通するように一次給電線5が架台1に沿ってX軸方向に敷設されている。この一次給電線5は、高周波電源4に接続されており、この電源より高周波電圧が給電される。なお、一次給電コア6には、二次側巻線と門型フレーム内への給電線を兼ねた二次給電線7がそれぞれ設けてある。二次給電線7Aは一次受電コア6Aに巻線され、門型フレームカバー3A上にY軸方向に敷設、二次給電線7Bは一次受電コア6Bに巻線され、門型フレームカバー3B上にY軸方向に敷設される。   The two portal frames 2 can be moved in the X-axis direction by driving an X-axis linear motor (not shown). A cover 3 for covering the portal frame is provided on the upper portion of the portal frame. The portal frame 2 is provided with a primary power supply core 6, and a primary power supply line 5 is laid in the X-axis direction along the frame 1 so as to penetrate the core. The primary power supply line 5 is connected to a high frequency power supply 4, and a high frequency voltage is supplied from the power supply. The primary power supply core 6 is provided with a secondary power supply line 7 that also serves as a secondary side winding and a power supply line into the portal frame. The secondary power supply line 7A is wound around the primary power receiving core 6A and is laid in the Y-axis direction on the gate-type frame cover 3A. The secondary power supply line 7B is wound around the primary power receiving core 6B and is placed on the gate-type frame cover 3B. It is laid in the Y-axis direction.

門型フレーム2Aには4つの塗布ヘッド8A〜8Dが支持され、門型フレーム5Bにも同じく4つの塗布ヘッド8E〜8Hが支持されている。各塗布ヘッドは後に詳述するが、Y軸リニアモータを駆動することによりY軸方向に移動する。また塗布ヘッドに設けてある塗布ノズル等のペースト収納筒を含む一部分はZ軸サーボモータにて、Z軸方向に可動する。また、各ヘッドには二次受電コイル9が設けてあり、この受電した電源でZ軸サーボモータ等を駆動する。   Four coating heads 8A to 8D are supported on the portal frame 2A, and four coating heads 8E to 8H are also supported on the portal frame 5B. As will be described in detail later, each coating head moves in the Y-axis direction by driving a Y-axis linear motor. Further, a part including a paste storage cylinder such as a coating nozzle provided in the coating head is moved in the Z-axis direction by a Z-axis servo motor. Each head is provided with a secondary power receiving coil 9, and a Z-axis servo motor or the like is driven by the received power.

主制御部10は各門型フレーム2、各塗布ヘッド8の位置制御や、各種センサ信号、画像信号の処理、及び電源のON・OFFを制御を行う。図示していないが、主制御部10の内部には、マイクロコンピュータとRAMを備えている。   The main control unit 10 controls the position of each portal frame 2 and each coating head 8, processes various sensor signals and image signals, and controls power ON / OFF. Although not shown, the main control unit 10 includes a microcomputer and a RAM.

門型フレーム2と架台1との間には制御信号等の送信、受信を行う空間光通信機11,12が設けてある。この空間光通信機は、X軸方向に光を発信し受信する構成としてあり、架台側に設けた光通信手段11Aと11Bと門型フレーム側に設けた光通信手段12Aと12B間で通信を行う。また、この空間光通信機は、図に示すように架台側の光通信手段11Bを下に、光通信手段11Aが上に位置するように上下に配置してある。すなわち、門型フレーム2B側の光通信手段が下側に、門型フレーム2A側の光通信手段を上側に位置するように配置することで、同方向に配置しても光を遮断しないようにしてある。また、各組毎に変調周波数を変えており、互いに干渉が生じないようにしてある。   Spatial optical communication devices 11 and 12 for transmitting and receiving control signals and the like are provided between the portal frame 2 and the gantry 1. This spatial light communication device is configured to transmit and receive light in the X-axis direction, and communicates between the optical communication means 11A and 11B provided on the gantry side and the optical communication means 12A and 12B provided on the portal frame side. Do. In addition, as shown in the figure, this spatial optical communication device is arranged vertically so that the optical communication means 11B on the gantry side is located below and the optical communication means 11A is located above. That is, the optical communication means on the portal frame 2B side is arranged on the lower side and the optical communication means on the portal frame 2A side is arranged on the upper side so that the light is not blocked even if arranged in the same direction. It is. Also, the modulation frequency is changed for each group so that interference does not occur.

なお、光通信手段11Aと11B及び光通信手段12Aと12Bとの干渉を確実に避けるためには、光通信手段11Aを現状の位置にして、光通信手段11Bを反対側の端部に設け、門型フレーム2Bに設ける光通信手段12Bが門型フレーム2Aの光通信手段11Bと逆向きに配置すればよい。   In order to reliably avoid the interference between the optical communication units 11A and 11B and the optical communication units 12A and 12B, the optical communication unit 11A is provided at the current position, and the optical communication unit 11B is provided at the opposite end, What is necessary is just to arrange | position the optical communication means 12B provided in the portal frame 2B in the opposite direction to the optical communication means 11B of the portal frame 2A.

さらに、門型フレームと塗布ヘッド間にも空間光通信機13,14が塗布ヘッド毎に信号のやり取りができるように塗布ヘッドの数だけ設けてある。光通信手段13A〜Dは門型フレーム2A、光通信手段13E〜Hは門型フレーム2Bに設置されている。また、光通信手段14A〜Hは各塗布ヘッド8A〜Hに門型フレー側の光通信手段13A〜Hに対向して設置されている。光通信手段13A〜Hはそれぞれ対向する光通信手段14A〜Hと通信を行い、通信方向はY軸方向である。空間光通信機13と14間の通信においても各組毎に変調周波数を変えてある為、干渉は生じない。   Further, the space optical communication devices 13 and 14 are provided between the portal frame and the coating head as many as the number of coating heads so that signals can be exchanged for each coating head. The optical communication means 13A to D are installed in the portal frame 2A, and the optical communication means 13E to H are installed in the portal frame 2B. The optical communication means 14A to H are installed on the coating heads 8A to H so as to face the optical communication means 13A to H on the portal frame side. The optical communication units 13A to 13H communicate with the opposing optical communication units 14A to 14H, respectively, and the communication direction is the Y-axis direction. Even in the communication between the spatial light communication devices 13 and 14, since the modulation frequency is changed for each group, no interference occurs.

すなわち、本実施例では架台と門型フレーム、門型フレームと塗布ヘッドの間の給電に2段に非接触給電方式を採用すると共に、信号のやり取りも2段の空間光伝送方式を採用したものである。   That is, in this embodiment, a non-contact power feeding system is used for feeding between the gantry and the gate frame, and the gate frame and the coating head, and a two-stage spatial light transmission system is used for signal exchange. It is.

基板16は架台1上に設けた移動台(図示せず)上に設けた基板保持機構15によって、吸着保持する構成としてある。この基板保持機構15は図示していないθ軸サーボモータを回転駆動することによってX、Y平面内での傾きを補正できる構造になっている。なお基板の移動台は基板16を門型フレームの間に設置するために設けてあり、本図ではX軸方向に移動できるようにしてあるが、Y軸方向としても良い。   The substrate 16 is configured to be sucked and held by a substrate holding mechanism 15 provided on a moving table (not shown) provided on the gantry 1. The substrate holding mechanism 15 has a structure capable of correcting the inclination in the X and Y planes by rotationally driving a θ-axis servo motor (not shown). In addition, although the board | substrate movement stand is provided in order to install the board | substrate 16 between portal frames, and it can move to the X-axis direction in this figure, it is good also as a Y-axis direction.

図2は図1における塗布ヘッドの部分を示す図である。図2(a)はY軸方向から見た側面図であり、図2(b)は塗布ヘッド内部系統図である。煩雑を避けるために(a)においては機器間のケーブルを図示していない。図2は代表例として、門型フレーム2Aの1つの塗布ヘッドについて示してあるが、他の塗布ヘッドについても同様の構成である。   FIG. 2 is a view showing a portion of the coating head in FIG. FIG. 2A is a side view seen from the Y-axis direction, and FIG. 2B is an internal system diagram of the coating head. In order to avoid complications, the cable between the devices is not shown in FIG. FIG. 2 shows one coating head of the portal frame 2A as a representative example, but the other coating heads have the same configuration.

図2(a)において、門型フレーム2Aの上面にはマグネット2a1が設けてあり、門型フレーム2Aの一方の側面にはリニアスケール2a2が設けてある。また、門型フレーム2AにはY軸用リミットセンサ2a3が設けてある。さらに、門型フレーム2Aには、他方の側面に1箇所、上面2箇所にマグネット2a1を挟む形でリニアガイド2a4が設けてある。   In FIG. 2A, a magnet 2a1 is provided on the upper surface of the portal frame 2A, and a linear scale 2a2 is provided on one side surface of the portal frame 2A. The portal frame 2A is provided with a Y-axis limit sensor 2a3. Further, the portal frame 2A is provided with a linear guide 2a4 in such a manner that the magnet 2a1 is sandwiched between one location on the other side and two locations on the top surface.

塗布ヘッド8Aには、カバー3Aを挟む形で下面基台8a8と上面基台8a9が設けてあり上面基台と下面基台とはノズル支持部材8abで連結してある。上面基台8a9上には、二次受電コイル9Aが設けてある。   The coating head 8A is provided with a lower surface base 8a8 and an upper surface base 8a9 so as to sandwich the cover 3A, and the upper surface base and the lower surface base are connected by a nozzle support member 8ab. A secondary power receiving coil 9A is provided on the upper surface base 8a9.

下面基台8a8の門型フレームの面する面にはリニアガイド2a4に沿って移動できるようにガイドが設けてある。また、下面基台の門型フレーム上面に設けたマグネットに対向するようにY軸用電気子コイル8a4が設けてある。また、下面基台8a8の上部には、二次受電コイル9Aから、塗布ヘッド部給電線9a1を通して供給される高周波電力を整流し、電圧調整を行う受電ユニット8a1が設けてある。さらに、下面基台8a8の上面側には、Y軸電気子コイル8a4へ流す電圧を制御してY軸方向の移動を制御するY軸モータドライバ8a2と、Z軸モータ8a5を制御するZ軸モータドライバ8a3が設けてある。さらに、下面基台8a8の下面側には、門型フレーム側に設けたリニアスケール2a2に対向する位置にY軸位置検出器8a6が設けてある。   A guide is provided on the surface of the lower surface base 8a8 facing the portal frame so as to be movable along the linear guide 2a4. Also, a Y-axis armature coil 8a4 is provided so as to face the magnet provided on the upper surface of the portal frame of the lower surface base. In addition, a power receiving unit 8a1 that rectifies high-frequency power supplied from the secondary power receiving coil 9A through the coating head unit power supply line 9a1 and performs voltage adjustment is provided on the lower surface base 8a8. Further, on the upper surface side of the lower surface base 8a8, a Y-axis motor driver 8a2 for controlling the movement in the Y-axis direction by controlling a voltage applied to the Y-axis armature coil 8a4, and a Z-axis motor for controlling the Z-axis motor 8a5 A driver 8a3 is provided. Furthermore, a Y-axis position detector 8a6 is provided on the lower surface side of the lower surface base 8a8 at a position facing the linear scale 2a2 provided on the portal frame side.

ノズル支持部材8abにはZ軸ガイド8a10が設けてあり、このZ軸ガイド8a10にはZ軸テーブル8a11が設けてあり、Z軸モータ8a5を駆動してZ軸テーブルが移動される。このZ軸テーブル8a11の移動量はZ軸位置検出器8a7により検出され、この検出結果はZ軸モータドライバ8a3における制御に用いられる。このZ軸テーブル8a11にはペースト吐出ノズル8a13を備えたペースト収納筒8a12と、基板とノズルとの間隔を測定する距離計8a14と、基板の位置を検出するための位置認識カメラ8a15が設けてある。   The nozzle support member 8ab is provided with a Z-axis guide 8a10. The Z-axis guide 8a10 is provided with a Z-axis table 8a11. The Z-axis motor 8a5 is driven to move the Z-axis table. The movement amount of the Z-axis table 8a11 is detected by the Z-axis position detector 8a7, and the detection result is used for control in the Z-axis motor driver 8a3. The Z-axis table 8a11 is provided with a paste storage cylinder 8a12 having a paste discharge nozzle 8a13, a distance meter 8a14 for measuring the distance between the substrate and the nozzle, and a position recognition camera 8a15 for detecting the position of the substrate. .

図2(b)において、二次受電コイル二次側巻線兼塗布ヘッド部給電線9a1は、二次受電コイル9Aで給電線7Aより高周波電力を受電し、受電ユニット8a1送電するためのものである。受電ユニット8a1からはY軸モータドライバ動力線9a2からY軸モータドライバ8a2に送電するY軸モータドライバ動力線9a2と、Z軸モータドライバ8a3に送電するZ軸モータドライバ動力線9a3が接続されている。Y軸モータドライバ8a2からはY軸電気子コイル8a4へ接続するY軸モータ動力線9a4と、Y軸位置検出器8a6からの信号を受信するためにY軸リニアエンコーダ信号線14a5が設けてある。Z軸モータドライバ8a3からはZ軸モータ8a5に電力を供給するZ軸モータ動力線9a5と、Z軸モータに設けてあるエンコーダからの信号を受信するためのZ軸エンコーダ信号線14a6が接続されている。また、受電ユニット8a1からは、距離計8a14や位置認識カメラ8a15へ電力を供給するセンサ駆動用動力線9a6が接続されている。なお、空間光通信手段14AからY軸モータドライバ8a2、Z軸モータドライバ8a3、及び各検知センサに信号ケーブル14a1〜14a4,14a7、14a8が接続されている。このように配線することで、接続線の可動部が低減され、配線のこすれ等による発塵を防止している。また、信号のやり取りもそれぞれ、対応する機器毎に変調周波数を変えることで、混信をなくして確実に情報が伝わるようにしてある。   In FIG. 2 (b), the secondary power receiving coil secondary winding / coating head power supply line 9a1 receives high-frequency power from the power receiving line 7A by the secondary power receiving coil 9A and transmits power to the power receiving unit 8a1. is there. A Y-axis motor driver power line 9a2 for transmitting power from the Y-axis motor driver power line 9a2 to the Y-axis motor driver 8a2 and a Z-axis motor driver power line 9a3 for transmitting power to the Z-axis motor driver 8a3 are connected from the power receiving unit 8a1. . The Y-axis motor driver 8a2 is provided with a Y-axis motor power line 9a4 connected to the Y-axis armature coil 8a4 and a Y-axis linear encoder signal line 14a5 for receiving a signal from the Y-axis position detector 8a6. A Z-axis motor power line 9a5 for supplying power to the Z-axis motor 8a5 and a Z-axis encoder signal line 14a6 for receiving a signal from an encoder provided in the Z-axis motor are connected from the Z-axis motor driver 8a3. Yes. The power receiving unit 8a1 is connected to a sensor driving power line 9a6 for supplying electric power to the distance meter 8a14 and the position recognition camera 8a15. Signal cables 14a1 to 14a4, 14a7, and 14a8 are connected from the spatial light communication means 14A to the Y-axis motor driver 8a2, the Z-axis motor driver 8a3, and the detection sensors. By wiring in this way, the movable part of the connection line is reduced and dust generation due to rubbing of the wiring or the like is prevented. In addition, in the exchange of signals, the modulation frequency is changed for each corresponding device, so that information can be reliably transmitted without interference.

図3は一次受電コイル部の詳細図である。一次受電コア6は直方体に二つ窓が開いた形状になっており、その窓部を一次給電線2が貫通する。一次給電線は往復電線となっており高周波電源1より架台端部に設けてある第1の給電線支持部材を通過し、一次受電コア6の片側の窓を通過し、架台逆端の第2の給電線支持部材にて折り返し、一次給電コア6のもう一方の窓を貫通し、第1の給電線支持部材を通過して、高周波電源に戻るという構造になっている。二次給電線7となる二次側巻線は、一次受電コア6の窓上部に巻きつける。図示したように片側の窓を右回りで巻き、もう一方の窓を左巻きで巻き直列に接続することにより、両窓の巻線に誘導される電圧を打ち消すこと無く二次給電線に伝達することが出来る。また、図3のように窓上部に集中して巻線することにより、窓部のスペースを広く使う事が出来、一次給電線2と一次受電コア6の接触の危険性を下げることが出来る。二次受電コイル9も一次受電コイルと同様の形状をしており、図3において5を7a、7aを9a1と読み替えると二次受電コイル9を表す図となる。   FIG. 3 is a detailed view of the primary power receiving coil section. The primary power receiving core 6 has a shape in which two windows are opened in a rectangular parallelepiped, and the primary power supply line 2 passes through the window. The primary power supply line is a reciprocating electric wire, passes from the high-frequency power source 1 through the first power supply line support member provided at the gantry end, passes through the window on one side of the primary power receiving core 6, and passes through the second at the opposite end of the gantry. The feed line support member is folded back, passes through the other window of the primary feed core 6, passes through the first feed line support member, and returns to the high frequency power source. The secondary winding serving as the secondary feeder 7 is wound around the upper part of the window of the primary power receiving core 6. As shown in the figure, one side of the window is wound clockwise and the other window is wound counterclockwise and connected in series so that the voltage induced in the windings of both windows is transmitted to the secondary feeder without canceling. I can do it. Further, by concentrating the coil on the upper part of the window as shown in FIG. 3, the space of the window can be widely used, and the risk of contact between the primary power supply line 2 and the primary power receiving core 6 can be reduced. The secondary power receiving coil 9 has the same shape as the primary power receiving coil. In FIG. 3, when 5 is read as 7 a and 7 a is read as 9 a 1, the secondary power receiving coil 9 is represented.

ペースト塗布機の動作について説明する。図4に本実施例での装置の動作フローチャートを示す。図4において、まず、電源を投入する(ステップ100)。次に、塗布機の初期設定が実行される(ステップ200)。この初期設定工程では、図1において、各軸移動用のモータ及びZ軸移動テーブル9を各モータドライバからの指令により駆動して、基板保持機構15をθ方向に移動させて所定の基準位置に位置決めする。また、ノズル8a13(図2)を、そのペースト吐出口がペースト塗布を開始する位置(即ち、ペースト塗布開始点)となるように、所定の原点位置に設定する。さらに、ペーストパターンデータや基板位置データ、ペースト吐出終了位置データの設定を行うものである。   The operation of the paste applicator will be described. FIG. 4 shows an operation flowchart of the apparatus in the present embodiment. In FIG. 4, first, power is turned on (step 100). Next, initial setting of the coating machine is executed (step 200). In this initial setting step, in FIG. 1, the motor for moving each axis and the Z-axis moving table 9 are driven by a command from each motor driver, and the substrate holding mechanism 15 is moved in the θ direction to a predetermined reference position. Position. Further, the nozzle 8a13 (FIG. 2) is set to a predetermined origin position so that the paste discharge port becomes a position where paste application starts (that is, a paste application start point). Furthermore, paste pattern data, substrate position data, and paste discharge end position data are set.

かかるデータの入力は、図示しないキーボードから主制御部10(図1)に入力され、主制御部から各モータドライバ等に指示されて行われ、これらのデータは主制御部10内のマイクロコンピュータに内蔵されたRAMに格納される。   Such data is input to the main control unit 10 (FIG. 1) from a keyboard (not shown), and is instructed to each motor driver by the main control unit. These data are input to the microcomputer in the main control unit 10. It is stored in the built-in RAM.

この初期設定工程(ステップ200)が終了すると、次に、基板16を基板吸着機構15(図1)に搭載して保持させる(ステップ300)。続いて、基板予備位置決め処理(ステップ400)を行う。この処理では、基板保持機構15に搭載された基板に設けてある位置決め用マークを画像認識カメラ8a15で撮影し、位置決め用マークの重心位置を画像処理で求めて基板16のθ方向での傾きを検出し、これに応じて図示していないθ軸サーボモータを駆動し、このθ方向の傾きを補正する。以上により、基板予備位置決め処理(ステップ400)を終了する。   When this initial setting step (step 200) is completed, the substrate 16 is then mounted and held on the substrate suction mechanism 15 (FIG. 1) (step 300). Subsequently, substrate preliminary positioning processing (step 400) is performed. In this process, the positioning mark provided on the substrate mounted on the substrate holding mechanism 15 is photographed by the image recognition camera 8a15, the center of gravity position of the positioning mark is obtained by image processing, and the inclination of the substrate 16 in the θ direction is determined. According to this detection, a θ-axis servo motor (not shown) is driven in accordance with this, and the inclination in the θ direction is corrected. Thus, the substrate preliminary positioning process (step 400) is completed.

次に、ペーストパターン描画処理(ステップ500)を行う。この処理では、基板の塗布開始位置にノズル8a13の吐出口を位置移動させ、ノズル位置の比較・調整移動を行う。次に、サーボモータ8a5およびZ軸移動テーブル8a11を動作させてノズル8a13の高さをペーストパターン描画高さに設定する。ノズルの初期移動距離データに基づいてノズル8a13を初期移動距離分下降させる。続く動作では、基板表面高さを距離計8a14により測定し、ノズル8a13先端がペーストパターンを描画する高さに設定されているか否かを確認する。そして、描画高さに設定できていない場合は、ノズル8a13を微小距離下降させ、上記の基板16表面計測とノズル8a13の微小距離下降の動作を繰返し行って、ノズル8a13先端の高さを、ペーストパターンを塗布描画する位置になるように設定する。   Next, paste pattern drawing processing (step 500) is performed. In this process, the discharge port of the nozzle 8a13 is moved to the substrate application start position, and the nozzle position is compared and adjusted. Next, the servo motor 8a5 and the Z-axis movement table 8a11 are operated to set the height of the nozzle 8a13 to the paste pattern drawing height. The nozzle 8a13 is lowered by the initial moving distance based on the initial moving distance data of the nozzle. In the subsequent operation, the substrate surface height is measured by the distance meter 8a14, and it is confirmed whether or not the tip of the nozzle 8a13 is set to a height at which the paste pattern is drawn. If the drawing height cannot be set, the nozzle 8a13 is lowered by a minute distance, and the above-described measurement of the surface of the substrate 16 and the minute distance descent operation of the nozzle 8a13 are repeated to determine the height of the tip of the nozzle 8a13 as the paste. The pattern is set so as to be applied and drawn.

以上の処理が終了すると、次に、主制御部10のマイクロコンピュータのRAMに格納されたペーストパターンデータに基づいてX、Y軸リニアモータ8a4が駆動される。これにより、ノズル8a13のペースト吐出口が基板7に対向した状態で、このペーストパターンデータに応じて、X、Y方向に移動する。同時に、ペースト収納筒8a13に設定した気圧を印加して、ノズル8a13のペースト吐出口からのペーストの吐出を開始する。これにより、基板7へのペーストパターンの塗布が開始される。   When the above processing is completed, the X and Y axis linear motor 8a4 is then driven based on the paste pattern data stored in the RAM of the microcomputer of the main control unit 10. Thereby, the paste discharge port of the nozzle 8a13 moves in the X and Y directions according to the paste pattern data in a state where the paste discharge port faces the substrate 7. At the same time, the set atmospheric pressure is applied to the paste storage cylinder 8a13, and the discharge of the paste from the paste discharge port of the nozzle 8a13 is started. Thereby, application of the paste pattern to the substrate 7 is started.

そして、先に説明したように、主制御部10のマイクロコンピュータは距離計8a14からのノズル8a13のペースト吐出口と基板16の表面との間隔の実測デ−タを入力し、基板16の表面のうねりを測定して、この測定値に応じてZ軸サーボモータ8a5を駆動して、基板7の表面からのノズル8a13の設定高さを一定に維持する。これにより、所望の塗布量でペーストパターンを塗布することができる。   As described above, the microcomputer of the main control unit 10 inputs the measured data of the distance between the paste discharge port of the nozzle 8a13 and the surface of the substrate 16 from the distance meter 8a14, and Waviness is measured, and the Z-axis servomotor 8a5 is driven according to the measured value, and the set height of the nozzle 8a13 from the surface of the substrate 7 is kept constant. Thereby, a paste pattern can be apply | coated with a desired application amount.

以上のようにして、ペーストパターンの描画が進むが、ノズル8a13のペースト吐出口が基板16上の上記ペーストパターンデータによって決まる描画パターンの終端であるか否かの判断により、終端でなければ、再び基板の表面うねりの測定処理に戻る。そして、上記の塗布描画を繰り返して、ペーストパターン形成が描画パターンの終端に達するまで継続する。描画パターンの終端に達すると、Z軸サーボモータ8a5を駆動してノズル8a13を上昇させ、ペーストパターン描画工程(ステップ500)が終了する。   As described above, the drawing of the paste pattern proceeds. If it is determined that the paste discharge port of the nozzle 8a13 is the end of the drawing pattern determined by the paste pattern data on the substrate 16, if it is not the end, the process again. Return to the measurement process of the surface waviness of the substrate. Then, the coating drawing is repeated until the paste pattern formation reaches the end of the drawing pattern. When the end of the drawing pattern is reached, the Z-axis servo motor 8a5 is driven to raise the nozzle 8a13, and the paste pattern drawing step (step 500) is completed.

次に、基板排出処置(ステップ600)に進み、基板16の保持を解除し、装置外に排出する。そして、以上の全工程を停止するか否かを判定し(ステップ700)、複数枚の基板に同じパターンでペースト膜を形成する場合には、基板搭載処理(ステップ300)から繰り返され、全ての基板についてかかる一連の処理が終了すると、作業が全て終了(ステップ800)となる。   Next, the process proceeds to a substrate discharge process (step 600), the holding of the substrate 16 is released, and the substrate is discharged out of the apparatus. Then, it is determined whether or not to stop all the above processes (step 700). When the paste film is formed with the same pattern on a plurality of substrates, the process is repeated from the substrate mounting process (step 300). When such a series of processes for the substrate is completed, all the operations are completed (step 800).

それでは、非接触給電を用いた動力系統の動作について説明する。図1、2において、一次給電線5に流れる高周波電流が一次給電線5の周囲に高周波磁界を生じさせる。その高周波磁界は高透磁率の一次給電コア6aに集約され、コア内に磁束が生じる。この磁束は一次受電コア6aに巻きつけられた二次給電線7aに鎖交する。電磁誘導により、二次給電線7aに高周波電圧が誘導され、二次給電線7aに高周波電流が生じる。二次受電コイル9aにおいても同様に受電コア内に高周波の磁束が生じ、電磁誘導によって、二次受電コア巻線兼塗布ヘッド部給電線9a1に高周波電圧が誘導され、9a1に高周波電流が生じる。供給された高周波電力を各塗布ヘッド8Aに備えられた受電ユニット8a1により、整流して直流に変換し、モータドライバの定格電圧範囲に電圧を調整する。この受電ユニット8a1からY軸モータドライバ8a2、Z軸モータドライバ8a3にY軸モータドライバ動力線9a2、Z軸モータドライバ動力線9a3を通して必要電力を供給する。各モータドライバよりY軸リニアモータ電気子コイル8a4、Z軸サーボモータ8a5にY軸モータ動力線9a4、Z軸モータドライバ動力線9a5を通して必要電力を供給する。また、画像認識用カメラ8a14やレーザー距離計8a15に供給する電力は、必要電圧が低い為、受電ユニット8a1にてモータドライバ用電圧よりさらに電圧を下げ、周辺機器用動力線9a6にて供給する。このように架台―門型間、門型―塗布ヘッド間の可動部分における動力ケーブルを省配線化することができる。   Now, the operation of the power system using non-contact power feeding will be described. 1 and 2, the high-frequency current flowing through the primary power supply line 5 generates a high-frequency magnetic field around the primary power supply line 5. The high-frequency magnetic field is concentrated in the high permeability primary power supply core 6a, and magnetic flux is generated in the core. This magnetic flux is linked to the secondary power supply line 7a wound around the primary power receiving core 6a. By electromagnetic induction, a high frequency voltage is induced in the secondary power supply line 7a, and a high frequency current is generated in the secondary power supply line 7a. Similarly, in the secondary power receiving coil 9a, a high frequency magnetic flux is generated in the power receiving core, and a high frequency voltage is induced in the secondary power receiving core winding / coating head power supply line 9a1 by electromagnetic induction, and a high frequency current is generated in 9a1. The supplied high frequency power is rectified and converted into direct current by the power receiving unit 8a1 provided in each coating head 8A, and the voltage is adjusted to the rated voltage range of the motor driver. The power receiving unit 8a1 supplies necessary power to the Y-axis motor driver 8a2 and the Z-axis motor driver 8a3 through the Y-axis motor driver power line 9a2 and the Z-axis motor driver power line 9a3. Each motor driver supplies necessary power to the Y-axis linear motor armature coil 8a4 and the Z-axis servo motor 8a5 through the Y-axis motor power line 9a4 and the Z-axis motor driver power line 9a5. Further, since the power supplied to the image recognition camera 8a14 and the laser distance meter 8a15 has a low required voltage, the power receiving unit 8a1 further lowers the voltage from the motor driver voltage and supplies it through the peripheral device power line 9a6. In this way, the power cables in the movable part between the gantry and the gate type and between the gate type and the coating head can be reduced in wiring.

次に空間光通信を用いた信号系統について説明する。まず、主制御部4からの信号を、制御信号ケーブルCCを介して門型−架台間光通信機(架台側)11A、11Bに送る。次に11A、Bにより上記信号を光信号に変換し変調して、対向する門型−架台間光通信機(門型側)12A、Bに投光する。12A、Bにおいて、受光した光信号を復調して、電気信号に変換し、門型フレーム内の通常信号ケーブルで門型ヘッド間光通信機(門型側)13A〜D、13E〜Hにモータドライバ制御信号を送る。13A〜Hにて受信した電気信号を光信号に変換して、対向するヘッド側光通信機14A〜Hに投光する。ヘッド側光通信機14にて、受光した光信号を復調し、電気信号に変換して塗布ヘッド部内のモータドライバ8a4、8a5に、モータドライバ信号線14a1、14a2を通じて通信する。Y、Z軸モータドライバ8a3、8a4からのモータレディ信号、アラーム信号等の制御信号、リミットセンサ8a6、8a7の信号、位置認識カメラ8a14からの画像信号、距離計8a15の距離信号を主制御部4に戻す場合は、上記経路と逆の経路を通って主制御部4に送信される。このように架台―門型間、門型―塗布ヘッド間の通信部分における信号ケーブルを省配線化することができる。   Next, a signal system using spatial light communication will be described. First, a signal from the main control unit 4 is sent to the gate-to-frame optical communication devices (mounting side) 11A and 11B via the control signal cable CC. Next, the signals are converted into optical signals by 11A and 11B, modulated, and projected onto the opposing gate-to-frame optical communication devices (gate-type side) 12A and 12B. In 12A and B, the received optical signal is demodulated and converted into an electrical signal, and motors are connected to the portal head-to-head optical communication devices (gate-type side) 13A to D and 13E to H through the normal signal cable in the portal frame. Send driver control signal. The electrical signals received by 13A to H are converted into optical signals and projected to the opposing head side optical communication devices 14A to 14H. The head-side optical communication device 14 demodulates the received optical signal, converts it into an electrical signal, and communicates with the motor drivers 8a4 and 8a5 in the coating head section through the motor driver signal lines 14a1 and 14a2. The main control unit 4 receives motor ready signals from the Y and Z axis motor drivers 8a3 and 8a4, control signals such as alarm signals, signals from the limit sensors 8a6 and 8a7, image signals from the position recognition camera 8a14, and distance signals from the distance meter 8a15. When returning to, it is transmitted to the main control unit 4 through a path opposite to the above path. In this way, it is possible to reduce the wiring of the signal cable in the communication part between the gantry and the gate type and between the gate type and the coating head.

以上のように、ペースト塗布装置の可動部は、X軸方向又はY軸方向に直線移動するために、給電線を略直線的に配置してそこを給電コアが移動できるので、可動部に追従するケーブル本数を削減できると共に、従来に信号線に変えて空間光通信機を固定部側及び可動部側に配置しても信号を遮断することなく伝送できる。このために、電源線や信号線を大幅に低減できため、ケーブル同士の摩擦により発生する塵埃の拡散を防止すると共に、可動部に追従するケーブル重量による位置制御精度の低下を防ぐことができる。これにより、基板面に塗布するペーストに塵埃が混入することなく精度の良い塗布を実現することができる。更に、本発明は、複数の可動部において非接触で給電、通信できることを特徴としているが、複数可動部を持つ装置において、一つの可動部のみに適用することが出来ることは言うまでも無い。   As described above, since the movable part of the paste coating apparatus moves linearly in the X-axis direction or the Y-axis direction, the power supply core can be moved substantially linearly, and the power supply core can move there. The number of cables to be used can be reduced, and signals can be transmitted without being interrupted even if the spatial optical communication device is arranged on the fixed part side and the movable part side instead of the signal line. For this reason, since power supply lines and signal lines can be significantly reduced, it is possible to prevent diffusion of dust generated by friction between cables and to prevent a decrease in position control accuracy due to the weight of the cable following the movable part. As a result, it is possible to realize highly accurate application without dust being mixed into the paste applied to the substrate surface. Furthermore, although the present invention is characterized in that power can be fed and communicated in a plurality of movable parts in a non-contact manner, it goes without saying that it can be applied to only one movable part in an apparatus having a plurality of movable parts.

本発明によるペ−スト塗布機の一実施形態を示す斜視図である。It is a perspective view which shows one Embodiment of the paste coating device by this invention. 図1に示した実施形態での塗布ヘッドの構造を示す斜視図と、塗布ヘッド内の系統図である。It is the perspective view which shows the structure of the coating head in embodiment shown in FIG. 1, and the systematic diagram in a coating head. 一次受電コイルの詳細斜視図である。It is a detailed perspective view of a primary power receiving coil. 図1に示した実施形態での全体動作を示すフロ−チャ−トである。2 is a flowchart showing the overall operation in the embodiment shown in FIG.

符号の説明Explanation of symbols

1…装置架台、2A、2B…門型フレーム、2a1…マグネット、2a2…リニアスケール、2a3…Y軸リミットセンサ、2a4…リニアガイド、3A、3B…門型カバー、4…高周波電源、5…一次給電線、6A、B…一次受電コア、7A、B…一次受電コア巻線兼二次給電線、8A〜8H…塗布ヘッド、8a1…受電ユニット、8a2…Y軸モータドライバ、8a3…X軸モータドライバ、8a4…Y軸用電気子コイル、8a5…Z軸モータ、8a6…Y軸位置検出器、8a7…Z軸位置検出器、8a8…下面基台、8a9…上面基台、8a10…Z軸ガイド、8a11…Z軸テーブル、8a12…ペースト収納筒、8a13…ノズル、8a14…距離計、8a15…位置認識カメラ、9A〜9H…二次受電コイル、9a1…二次受電コイル巻線兼塗布ヘッド部給電線、9a2…Y軸モータドライバ動力線、9a3…Z軸モータドライバ動力線、9a4…Y軸モータ動力線、9a5…Z軸モータ動力線、9a6…周辺機器用動力線、10…主制御部、11…門型−架台間光通信機(架台側)、12…門型−架台間光通信機(門型側)、13…ヘッド−門型間光通信機(門型側)、14…ヘッド−門型間光通信機(ヘッド側)、14a1…Y軸モータドライバ信号線、14a2…Z軸モータドライバ信号線、14a3…Y軸位置センサ信号線、14a4…Z軸位置センサ信号線、14a5…Y軸エンコーダ信号線、14a6…Z軸エンコーダ信号線、14a7…距離計用信号線、14a8…位置認識カメラ用信号線、15…基板保持機構、16…基板。
DESCRIPTION OF SYMBOLS 1 ... Device mount, 2A, 2B ... Portal frame, 2a1 ... Magnet, 2a2 ... Linear scale, 2a3 ... Y axis limit sensor, 2a4 ... Linear guide, 3A, 3B ... Portal cover, 4 ... High frequency power supply, 5 ... Primary Power supply line, 6A, B ... primary power receiving core, 7A, B ... primary power receiving core winding and secondary power supply line, 8A-8H ... coating head, 8a1 ... power receiving unit, 8a2 ... Y-axis motor driver, 8a3 ... X-axis motor Driver, 8a4 ... Y-axis armature coil, 8a5 ... Z-axis motor, 8a6 ... Y-axis position detector, 8a7 ... Z-axis position detector, 8a8 ... Lower surface base, 8a9 ... Upper surface base, 8a10 ... Z-axis guide , 8a11 ... Z-axis table, 8a12 ... Paste storage cylinder, 8a13 ... Nozzle, 8a14 ... Distance meter, 8a15 ... Position recognition camera, 9A to 9H ... Secondary power receiving coil, 9a1 ... Secondary power receiving Wire winding / coating head feeding line, 9a2 ... Y-axis motor driver power line, 9a3 ... Z-axis motor driver power line, 9a4 ... Y-axis motor power line, 9a5 ... Z-axis motor power line, 9a6 ... power for peripheral devices Lines 10, main control unit 11, gate-frame-to-frame optical communication device (base side), 12 gate-to-frame optical communication device (gate-type side), 13 head-to-gate optical communication device ( Portal side), 14 ... head-to-gate type optical communication device (head side), 14a1 ... Y-axis motor driver signal line, 14a2 ... Z-axis motor driver signal line, 14a3 ... Y-axis position sensor signal line, 14a4 ... Z Axis position sensor signal line, 14a5 ... Y-axis encoder signal line, 14a6 ... Z-axis encoder signal line, 14a7 ... Distance meter signal line, 14a8 ... Position recognition camera signal line, 15 ... Substrate holding mechanism, 16 ... Substrate.

Claims (3)

一方向に往復動可能な門型フレームと、前記門型フレームの長手方向に移動可能な塗布ヘッドを複数設け、前記塗布ヘッドの設けてあるノズルの吐出口に対向するように設けられたテ−ブル上に基板を載置し、ペースト収納筒に充填したペーストを前記吐出口から前記基板上に吐出させながら前記基板と前記ノズルとの相対位置関係を変化させることにより、前記基板上に所望形状のペーストパタ−ンを塗布するペースト塗布機において、
前記門型フレームへの給電するために、架台側に直線状に配置した給電線と門型フレーム側に設けた受電コア間で磁気結合を利用して非接触給電する構成とし、移動する門型フレームと制御信号のやり取りを行う光無線通信を設けたことを特徴とするペースト塗布機。
A plurality of portal frames that can reciprocate in one direction and a plurality of coating heads that can move in the longitudinal direction of the portal frame are provided, and a tape provided so as to face the discharge port of the nozzle on which the coating head is provided. The substrate is placed on the bull, and the paste filled in the paste storage cylinder is ejected from the ejection port onto the substrate, and the relative positional relationship between the substrate and the nozzle is changed, so that a desired shape is formed on the substrate. In a paste application machine for applying the paste pattern of
In order to supply power to the portal frame, it is configured to perform non-contact power supply using magnetic coupling between a power supply line arranged linearly on the gantry side and a power receiving core provided on the portal frame side. A paste application machine provided with optical wireless communication for exchanging control signals with a frame.
請求項1に記載のペースト塗布機において、
前記門型フレームに設けた複数の塗布ヘッドに受電コアを設け、門型フレームの長手方向に給電線を配置して、各塗布ヘッドに電力を非接触給電で供給し、前記門型フレームと塗布ヘッド間で信号のやり取りを行う空間光通信機を設けたことを特徴とするペースト塗布機。
In the paste applicator according to claim 1,
A plurality of coating heads provided on the portal frame are provided with power receiving cores, power supply lines are arranged in the longitudinal direction of the portal frame, and electric power is supplied to each coating head by non-contact power feeding. A paste applicator comprising a spatial light communication device for exchanging signals between heads.
請求項1又は請求項2に記載のペースト塗布機において、
前記受電コアには2つの窓が貫通するように設けられ、その窓内を給電線が貫通して配置されていることを特徴とするペースト塗布機。
In the paste applicator according to claim 1 or 2,
A paste applicator, wherein the power receiving core is provided with two windows extending therethrough, and a feed line is disposed through the window.
JP2005147500A 2005-05-20 2005-05-20 Paste applicator Expired - Fee Related JP4815872B2 (en)

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