TW200708702A - Heat-generating component cooling structure - Google Patents

Heat-generating component cooling structure

Info

Publication number
TW200708702A
TW200708702A TW094129041A TW94129041A TW200708702A TW 200708702 A TW200708702 A TW 200708702A TW 094129041 A TW094129041 A TW 094129041A TW 94129041 A TW94129041 A TW 94129041A TW 200708702 A TW200708702 A TW 200708702A
Authority
TW
Taiwan
Prior art keywords
heat sink
heat
cooling structure
generating component
component cooling
Prior art date
Application number
TW094129041A
Other languages
Chinese (zh)
Other versions
TWI345044B (en
Inventor
Hideo Ishii
Masao Katooka
Kazunori Nakata
Yuji Ikejiri
Original Assignee
Sansha Electric Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sansha Electric Mfg Co Ltd filed Critical Sansha Electric Mfg Co Ltd
Priority to TW94129041A priority Critical patent/TWI345044B/en
Publication of TW200708702A publication Critical patent/TW200708702A/en
Application granted granted Critical
Publication of TWI345044B publication Critical patent/TWI345044B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of the heat sink and is adapted to cause air to flow through the interior path. Fins are disposed in the path in the heat sink. Heat-generating components of an electrical circuit are mounted on an outer surface of the heat sink.
TW94129041A 2005-08-25 2005-08-25 Heat-generating component cooling structure TWI345044B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94129041A TWI345044B (en) 2005-08-25 2005-08-25 Heat-generating component cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94129041A TWI345044B (en) 2005-08-25 2005-08-25 Heat-generating component cooling structure

Publications (2)

Publication Number Publication Date
TW200708702A true TW200708702A (en) 2007-03-01
TWI345044B TWI345044B (en) 2011-07-11

Family

ID=45074964

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94129041A TWI345044B (en) 2005-08-25 2005-08-25 Heat-generating component cooling structure

Country Status (1)

Country Link
TW (1) TWI345044B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421461B (en) * 2010-06-07 2014-01-01 Mitsubishi Electric Corp Heat sink and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI421461B (en) * 2010-06-07 2014-01-01 Mitsubishi Electric Corp Heat sink and method for manufacturing the same
US9915482B2 (en) 2010-06-07 2018-03-13 Mitsubishi Electric Corporation Heat sink, and method for producing same

Also Published As

Publication number Publication date
TWI345044B (en) 2011-07-11

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