TWI345044B - Heat-generating component cooling structure - Google Patents

Description

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . The cooling structure of the heating element. [Prior Art] Both the power supply unit and the electronic load unit are provided with a plurality of electric appliances and many of them are heated by the passage of current. These components are referred to below as heat generating components. The heat generating component is preferably cooled. An example of a cooling technique used in the past is forced air cooling. A power supply device of the Japanese Patent Laid-Open Publication No. 2003-244958 has a rectangular parallelepiped heat sink, and the first and second chassis are mounted on both sides thereof, and the first and second chassis are formed. There is a window. The semiconductor modules of the heat-sink components are respectively mounted on the heat sink in a protruding manner. On the surface in contact with the heat sink of the second chassis, and the surface on the opposite side, a printed circuit board is interposed. The semiconductor module is electrically connected to the printed circuit board by its connection terminal. These heat sinks, the i-th and second chassis, and the printed electrical board form a frame. The side of this frame is covered by the casing and covered by the front and back panels respectively. Installed on the back panel of the above box, the fan. The first and second chassis on both sides of the heat sink form a passage for the gas semiconductor module. The connection terminals of the semiconductor module are respectively located between the 笫7 chassis and the associated printed substrate and between the second chassis and the phase 1 printed substrate, and are exposed to the outside air sucked by the blower. The connection terminals of the semiconductor module of the power supply device are often affected by the contamination components of the gas outside the power supply device, so that the insulation of the semiconductor package may be deteriorated. Insulation of each semiconductor module for this purpose = 1345044

3: 2_e~7^~ 曰 曰 repair (more) is replacing page I Patent No. 9412904 〗 Patent application Supplementary, revised, no scribe line correction page - three times large distance configuration. However, when this power supply is used, the power supply unit will be placed in the electroplating; the equipment will be smog and fogged. Therefore, even if the insulation distance is increased, the liquid containing solution may cause the semiconductor module to malfunction. In addition, the power supply & makes: = when welding 'in the iron powder branch electric dust floating ring ^ dust will be sucked into the power supply device stacked on the semi-conducting V electricity ii and occur _, the village is missing half (four) Chi The purpose of the terminal = Ming is to provide a cooling structure for the heating element, and the use of the heating element in the event of a fault is easy to occur. The invention also discloses that the heating structure of the heating element of the present invention is partially thermally conductive. Braided radiator. This cylindrical heat sink has a passage through the one end to the other end inside. At one end of the cylindrical heat sink, a fan may be installed, and the fan may be installed in contact with one end of the cylindrical heat sink, or the cylindrical heat sink may be slightly spaced apart. The heat-dissipating component of the electrical circuit is mounted on the outer surface of the cylindrical heat sink by an external blade L in the passage of the cylindrical heat sink. = It is better to install a heat sink for the same heat sink. At the same time, an antifouling metal such as an oxide layer of titanium is formed in the above-mentioned passage. This cooling structure is preferably housed in the casing. Air flow holes are formed in the opposite faces of the housing from one end and the other end of the barrel heat sink, respectively. Further, the heat generating component may have a conductive portion that can be energized to the heat generating component, for example, a creeper. At this time, the conductive portion is located outside the cylindrical heat sink. Table 1345044 2, 8 repair (more) is replacing the patent application of wj g 94129041. _ Supplementary, corrected, and unlined instructions are corrected in triplicate. Heated two-plate configuration [Embodiment] Figure! The cooling structure of the 8H real-like heat when bursting, such as "jin does not have the same radiator 2. The cylindrical heat sink 2 is provided with a heat conducting structure in which a heat sink of a protective point is combined. 2. The heat dissipation H 2 of the four metal flat portions 4, 6, 8, 1 (1) is perpendicular to each other, and the adjacent portions are fixed by the #gJ and the ports are fixed to each other. In the inside of the heat sink 2, the end portion and the rear end portion of the heat sink 2 are formed, for example, the front portion and the rear portion form a passage σ of opening σ / : ": 6, 8 on the side of the passage 12, forming more == 6a, 8a, l〇a. The fins are formed along the length of the passage 12 to form the flat portions 4, 6, 8, 1G, for example, the pressure is extended. The metal is placed on the back of the cylindrical heat sink 2, leaving a space. The air blower is equipped with a rectangular parallelepiped frame a which is flatter than the heat sink 2. The front edge of the frame 16a is formed with the cylindrical heat sink 2. The center of the frame i6a is formed through the front and rear direction = edge = this The center of the shaped hole 16b is formed to coincide with the center of the cylindrical heat sink & the road 12 is provided. The center of the circular hole 16b is provided with a rotating blade 16d. Therefore, rotating the blade 16d can make up to 160% 2 The front surface is discharged into the heat sink 2 through the passage 12. The heat exchanger 'heat sink 2 and the blower η, as shown in Fig. 2, are inside the assembly. The front panel 18 and the rear panel 2 are attached to the front panel. Separate == body

, .t) positive replacement page I 10Cr Λ, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The panel 20 has an air flow hole, and for example, a vent hole (not shown) is provided like the suction hole 26. The blower 14 and the radiator 2 are disposed such that the air supply 14 is spaced apart from the front side of the rear panel 2G with a slight interval therebetween, and the front surface of the radiator 2 is slightly spaced behind the front panel 18. Further, the side wall panels 22, 24 of the casing cover the periphery of the front surface and the rear surface of the heat sink 2. Due to the action of the blower 14, the air sucked in from the suction hole 26 is discharged through the passage 12 through the passage 12 of the radiator 2. The outer surface of the flat members 6, 8 of the heat sink 2 is located between the inner faces of the side wall panels 22, 24 opposite thereto, leaving a predetermined space. On the outer surface of the cylindrical heat sink 2, for example, a circuit such as a power supply circuit or an electronic load circuit is mounted on the outer surface of the flat members 6 and 8 via an electrically insulating film (not shown). One of the power supply circuits is shown in FIG. The AC power source, for example, the rectified voltage of the input rectifier circuit 30 that is rectified by the AC current of the commercial parent power source (not shown) is smoothed by the smoothing capacitor 32. The voltage between the both ends of the smoothing capacitor 32 is converted by the converter 34 into a high-frequency voltage supplied to the primary winding 36p of the high-frequency transformer 36. The converter 34 includes semiconductor switching elements, such as IGBTs 34a, 34b, 34c, 34d, which are driven by a driver 38. The high-frequency voltage 'induced by the secondary winding 36s of the high-frequency transformer 36 is rectified by the output terminal diodes 40a, 40b, and supplied to the output terminals 42p, 42n. The input rectification circuit 30, the smoothing capacitor 32, the output terminal diodes 40a, 40b, the IGBT 34a or even 34d in this power supply circuit are both 1345044

Patent Application No. 94,129, 941 Supplementary, Corrected, Unlined Manual Amendment Page in Triplicate belongs to the above-described heat generating component, and is shown as heat generating component 28. When the heat generating component 28 passes current, a large amount of heat is generated and heat is transferred from the outer surface of the heat sink 2 to the passage 12. The heat is discharged from the blower 14 through the air passing through the passage 12 from the discharge port. This suppresses the temperature rise of the heat generating component. Further, each of the heat generating components 28 has a conductive portion that can be energized, such as a live electric portion, and specifically has a connection terminal 28a. These connection terminals 28a do not protrude toward the outer side of the heat sink 2 at the side of the passage 12'. These connectors = 28a have a portion covered by the insulator and a non-covering portion not covered by the insulator. This non-covered portion is designed to check voltage or for easy exchange of components. Since the heat generating component 28 is not disposed on the side of the passage 12, such non-covered portions are not located on the side of the passage 12. Therefore, even if the air passing through the passage 12 contains a component which will cover the portion of the rot (4), it will invade the portion. Moreover, each of the heat generating components 28 is not directly in contact with the gas passing through the passage 12. Therefore, even if the air contains conductive dust, for example, containing iron shovel, the electrical dust does not retract from the connecting terminal 28a of each heat generating component 28. Partial contact will not cause leakage and other faults. Also known as the smear, t is formed with an antifouling metal, such as

It can prevent dust from adhering to the heat sink ^^, %, l〇a C = non-rears of the heat generating component where the cooling air flows, if the distance between the non-covering parts of the heat generating component, that is, the insulating distance, ^! The following 'When the cooling air contains conductivity ^, it will leak due to the accumulation of conductive dust. For this reason, in this embodiment, each heating element is crying, but the air is not flowing. 2 outside the device 2 ^ 6 in the edge of the cold 1 field 1 to keep the insulation of 6mm or more 1345044: single March 2 f repair) is replacing the page No. 94129041 patent application L--- supplement, correction without line The revised page of the manual is in triplicate. The driving portion 38 of the power supply circuit is provided on a printed circuit board (not shown) which is disposed at a position where the heat sink 2 is spaced apart from the outside. The cooling structure of the second embodiment of the present invention is the same as that of the first embodiment except that the shape of the heat sink 2a is different. The heat sink 2a has a bottom portion 50 as shown in FIG. The bottom portion 50 has a bottom wall 52 and inclined walls 54, 56 extending from both ends to the outside, and vertical walls 58, 60 extending from the front ends of the inclined walls 54, 56. The walls 58, 60 are perpendicular to the bottom wall 52. The walls 52, 54, 56, 58, 60 have a predetermined length perpendicular to the plane of the paper of Fig. 4. The fins 62, 56, and the bottom wall 52 are formed to extend from the inner surface to form fins 62 which are formed in parallel with each other and are spaced apart from the vertical walls 58, 60 by a predetermined interval. The fins 62 also have the predetermined length described above in the direction perpendicular to the sheet of Fig. 4. At the top of the vertical walls 58, 60, there are diagonal portions 64, 66, respectively. The diagonal portions 64, 66 are obtusely directed to the vertical walls and are arranged to be inclined obliquely upward toward the center of the bottom wall 52, respectively. These diagonal portions 64, 66 also extend a predetermined length in the vertical direction of the sheet of Fig. 4, and have flat portions 68, 70 on the outer side thereof. The inner ends of the flat portions 68, 70 are respectively provided with l-shaped members 72, 74, 76, 78. The L-shaped members 72, 74, 76, 78 are provided with heat sinks 80, 82, 84, 86, respectively. The heat sinks 80, 82, 84, 86 are configured not to be in contact with each other and are not in contact with the heat sink 62. A passage 12 is formed inside the heat sink 2a by the fins 62, 80, 82, 84, 86 and the upper wall 88. On the outer side of the heat sink 2a, for example, the planar members 68, 70 of the l-shaped members 74, 78 are vertically formed, and the heat generating components 28 are respectively mounted. Anti-fouling metal is also formed on the heat sinks 62, 80, 82, 84, 86, 10 I345044 •···· r / · 眢 Λ: 鸣 鸣 技, 941 292 411 Patent Application L------- ---------------^ Supplementary, corrected, and unlined instructions are amended in triplicate, such as titanium oxide. When the heat sink 2a is constructed as such, the heat sink 2a is not damaged even if it is flushed. The cooling structure according to the third embodiment of the present invention is the same as the structure of the first embodiment except for the shape of the heat sink 2b. Heat Dissipation One of the four metal flat members of the two (four) device 2, the member - is to mount the printed circuit board 90. Printed electricity = between the flat members 6 and 8 made of Λ, the outer surface of the circuit board 90 is provided with a heat generating component 28. Placed in

In each of the Jit embodiments, the circuit is represented by a power supply circuit, an electronic load circuit for the electric component of the heat generating component, or the air blower 14 is disposed in the embodiment of the diffuser tf at a slight interval. Further, in the above embodiment, the frame i6a:::: is formed so as to be adjacent to the periphery of the center 2 of the circular hole 16b of the circumferential surface (6) of the cylindrical heat dissipation, and the center of the frame U is caused by the circle ^ The hole becomes a passage with the cylindrical radiator 2, and the diameter of the Βθ, Γ _ circular hole l6b coincides with the wide production of the passage 12. Ren Yan, the front edge of the front face of the frame 16a, and the subsequent week is reduced to only, (4) the connection between the money device 2 and the cylindrical heat sink 2: the circular hole of the second center, formed as the diameter only and the width of the passage 丄2 Consistent-to-'-shaped hole 16b's straight cylinder Ϊ ί 方式 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' '

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cooling structure of a heat generating component according to a first embodiment of the present invention; Fig. 2 is a perspective view of a housing accommodating the cooling structure of Fig. 1; FIG. 4 is a longitudinal sectional view showing a cooling structure of a heat generating component according to a second embodiment of the present invention;

Fig. 5 is a perspective sectional view showing a cooling structure of a heat generating component according to a third embodiment of the present invention. [Description of main components] 1 cylindrical radiator 4, 6, 8, 10 metal flat members 4a, 6a, 8a, 10a heat sink 12 passage 14 blower

16a rectangular frame 16d blade 20 back panel 26 suction 2 8 a connection terminal 32 smoothing capacitor 36p primary winding 38 driver 42ρ, 42η output terminal 52 bottom wall 16b circular hole 18 front panel 22, 24 side wall panel 28 heating Member 30 input terminal rectifier circuit 34 converter 36s secondary winding 40a, 40b output terminal diode 50 bottom 54, 56 slant wall 5 12 1345044, female (more) is replacing page sound 94129041 patent application _______ supplementary, corrected Unlined manual revision page in triplicate 58, 60 vertical wall 62 heat sink 64'66 diagonal (10), 70 flat portion 72, 74, 76, 78 L-shaped member

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Claims (1)

1345044 If f 94129041 Patent application _ Supplementary, revised, unlined instructions, revised page, three copies of S, Supreme, and monthly repair (more) replacement page | X. Patent application: 1. A heating component a cooling structure comprising: a portion made of a thermally conductive material and a cylindrical heat sink extending from the first end surface to the second end surface; and the first end of the heat sink The air circulates in the passageway a blower' and a heat generating component mounted on the heat sink; wherein: the heat sink includes a bottom portion 50 and two opposite corner portions 64, 66 formed by the bottom portion; the bottom portion a bottom wall 52 and two vertical walls 58 and 60 extending perpendicularly from the opposite side of the bottom wall to the bottom wall; 1 two diagonal portions are respectively disposed on the tops of the two vertical walls and from the top The top portions of the two vertical walls are respectively inclined and directed toward a central portion of the bottom wall; and the heat generating component is disposed at a portion other than the passage and the bottom wall. 2. The cooling structure of the heat generating component of claim 1, wherein the heat generating component is mounted on an outer surface of the cylindrical heat sink. 3. The cooling structure of the heat generating component of claim 1, wherein a heat sink is provided in the passage of the cylindrical heat sink. 4. The cooling structure of the heat generating component of claim 1, wherein the barrier layer is provided with a layer containing an anticorrosive metal oxide. 5 14 f· PAGE 1345044 * * Supplementary to the patent application No. 94129041, the revised page without the scribe line, the correction sheet is in triplicate. 5. The cooling structure of the heat generating component of claim 1, wherein the heat generating component has power supply to the heat The conductive portion of the component, and the conductive portion is located outside the cylindrical heat sink. 6. An electric drive device comprising a cooling structure of a heat generating component as defined in claim 1, wherein the cooling structure is mounted in a housing, and the housing is provided with the first facing the cylindrical heat sink respectively And a stupid part of the second end face, and a vent is formed in each part. 15