TW200705964A - Solid-state imaging device - Google Patents
Solid-state imaging deviceInfo
- Publication number
- TW200705964A TW200705964A TW095105775A TW95105775A TW200705964A TW 200705964 A TW200705964 A TW 200705964A TW 095105775 A TW095105775 A TW 095105775A TW 95105775 A TW95105775 A TW 95105775A TW 200705964 A TW200705964 A TW 200705964A
- Authority
- TW
- Taiwan
- Prior art keywords
- solid
- image sensor
- state image
- cavity
- imaging device
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 3
- 239000012790 adhesive layer Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005047149A JP2006237134A (ja) | 2005-02-23 | 2005-02-23 | 固体撮像装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200705964A true TW200705964A (en) | 2007-02-01 |
Family
ID=36406075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095105775A TW200705964A (en) | 2005-02-23 | 2006-02-21 | Solid-state imaging device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060197864A1 (zh) |
| EP (1) | EP1696489A3 (zh) |
| JP (1) | JP2006237134A (zh) |
| KR (1) | KR100819041B1 (zh) |
| CN (1) | CN1825610A (zh) |
| TW (1) | TW200705964A (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4923967B2 (ja) * | 2006-11-14 | 2012-04-25 | 凸版印刷株式会社 | 固体撮像装置及び電子機器 |
| CN102388455B (zh) * | 2009-04-15 | 2015-09-30 | 奥林巴斯医疗株式会社 | 半导体装置、半导体装置的制造方法 |
| GB0911171D0 (en) * | 2009-06-29 | 2009-08-12 | St Microelectronics Res & Dev | Improvements in or relating to a modular camera system and a method of manufacturing the same |
| KR101026830B1 (ko) * | 2009-07-24 | 2011-04-04 | 엘지이노텍 주식회사 | 카메라 모듈 |
| KR101032725B1 (ko) * | 2009-08-06 | 2011-05-06 | 엘지이노텍 주식회사 | 카메라 모듈 및 그 제조 방법 |
| JP6628093B2 (ja) * | 2016-04-28 | 2020-01-08 | コニカミノルタ株式会社 | 画像形成装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55159678A (en) * | 1979-05-31 | 1980-12-11 | Toshiba Corp | Solidstate image sensor |
| JP2001118967A (ja) * | 1999-10-19 | 2001-04-27 | Sanyo Electric Co Ltd | 固体撮像素子のパッケージ構造 |
| JP3880278B2 (ja) * | 2000-03-10 | 2007-02-14 | オリンパス株式会社 | 固体撮像装置及びその製造方法 |
| KR20020028115A (ko) * | 2000-10-07 | 2002-04-16 | 윤종용 | 마이크로 렌즈를 갖는 고체촬상소자모듈 및 패키징 방법 |
| JP2002299595A (ja) * | 2001-04-03 | 2002-10-11 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
| FR2824953B1 (fr) * | 2001-05-18 | 2004-07-16 | St Microelectronics Sa | Boitier semi-conducteur optique a lentille incorporee et blindage |
| JP3881888B2 (ja) * | 2001-12-27 | 2007-02-14 | セイコーエプソン株式会社 | 光デバイスの製造方法 |
| EP1357606A1 (en) * | 2002-04-22 | 2003-10-29 | Scientek Corporation | Image sensor semiconductor package |
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| US7214919B2 (en) * | 2005-02-08 | 2007-05-08 | Micron Technology, Inc. | Microelectronic imaging units and methods of manufacturing microelectronic imaging units |
-
2005
- 2005-02-23 JP JP2005047149A patent/JP2006237134A/ja active Pending
-
2006
- 2006-02-21 TW TW095105775A patent/TW200705964A/zh unknown
- 2006-02-21 US US11/359,848 patent/US20060197864A1/en not_active Abandoned
- 2006-02-22 EP EP06250936A patent/EP1696489A3/en not_active Withdrawn
- 2006-02-23 CN CNA2006100095187A patent/CN1825610A/zh active Pending
- 2006-02-23 KR KR1020060017709A patent/KR100819041B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060094054A (ko) | 2006-08-28 |
| US20060197864A1 (en) | 2006-09-07 |
| EP1696489A2 (en) | 2006-08-30 |
| EP1696489A3 (en) | 2007-01-24 |
| KR100819041B1 (ko) | 2008-04-02 |
| JP2006237134A (ja) | 2006-09-07 |
| CN1825610A (zh) | 2006-08-30 |
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