TW200701855A - Substrate with composite dielectric distribution and multi-layer substrate - Google Patents
Substrate with composite dielectric distribution and multi-layer substrateInfo
- Publication number
- TW200701855A TW200701855A TW094137960A TW94137960A TW200701855A TW 200701855 A TW200701855 A TW 200701855A TW 094137960 A TW094137960 A TW 094137960A TW 94137960 A TW94137960 A TW 94137960A TW 200701855 A TW200701855 A TW 200701855A
- Authority
- TW
- Taiwan
- Prior art keywords
- dielectric
- substrate
- layer
- distributions
- composite dielectric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/081—Microstriplines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/156,350 US7349196B2 (en) | 2005-06-17 | 2005-06-17 | Composite distributed dielectric structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200701855A true TW200701855A (en) | 2007-01-01 |
TWI308855B TWI308855B (en) | 2009-04-11 |
Family
ID=37520116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094137960A TWI308855B (en) | 2005-06-17 | 2005-10-28 | Substrate with composite dielectric distribution and multi-layer substrate |
Country Status (3)
Country | Link |
---|---|
US (1) | US7349196B2 (zh) |
CN (1) | CN100431394C (zh) |
TW (1) | TWI308855B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI295102B (en) * | 2006-01-13 | 2008-03-21 | Ind Tech Res Inst | Multi-functional substrate structure |
US20090034156A1 (en) * | 2007-07-30 | 2009-02-05 | Takuya Yamamoto | Composite sheet |
US20090033359A1 (en) * | 2007-07-31 | 2009-02-05 | Broadcom Corporation | Programmable logic device with millimeter wave interface and method for use therewith |
US8723722B2 (en) * | 2008-08-28 | 2014-05-13 | Alliant Techsystems Inc. | Composites for antennas and other applications |
TWI402003B (zh) * | 2009-10-16 | 2013-07-11 | Princo Corp | 軟性多層基板之金屬層結構及其製造方法 |
KR20130033091A (ko) * | 2011-09-26 | 2013-04-03 | 에더트로닉스코리아 (주) | 무선통신기기에 설치되는 내장형 안테나 모듈 및 이의 제조방법 |
JP5477422B2 (ja) * | 2012-01-06 | 2014-04-23 | 株式会社村田製作所 | 高周波信号線路 |
KR102125905B1 (ko) * | 2013-04-25 | 2020-06-24 | 삼성디스플레이 주식회사 | 인쇄 회로 기판, 표시 장치 및 인쇄 회로 기판의 제조 방법 |
US9066424B2 (en) | 2013-07-15 | 2015-06-23 | Hong Kong Applied Science and Technology Research Institute Company Limited | Partitioned hybrid substrate for radio frequency applications |
TWI477209B (zh) * | 2014-04-08 | 2015-03-11 | Azotek Co Ltd | 複合基板 |
KR102068808B1 (ko) * | 2018-01-31 | 2020-01-22 | 삼성전기주식회사 | 커패시터 부품 |
US11574862B2 (en) * | 2019-04-23 | 2023-02-07 | Intel Corporation | Optimal signal routing performance through dielectric material configuration designs in package substrate |
KR20210081968A (ko) * | 2019-12-24 | 2021-07-02 | 삼성전자주식회사 | 회로 기판 및 이를 포함하는 전자 장치 |
WO2022264725A1 (ja) | 2021-06-16 | 2022-12-22 | 株式会社村田製作所 | 多層基板及び多層基板の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4759965A (en) | 1985-08-06 | 1988-07-26 | Canon Kabushiki Kaisha | Ceramic, preparation thereof and electronic circuit substrate by use thereof |
US5604017A (en) | 1990-04-12 | 1997-02-18 | Arlon, Inc. | Multi-dielectric laminates |
US5055966A (en) * | 1990-12-17 | 1991-10-08 | Hughes Aircraft Company | Via capacitors within multi-layer, 3 dimensional structures/substrates |
US5753968A (en) | 1996-08-05 | 1998-05-19 | Itt Industries, Inc. | Low loss ridged microstrip line for monolithic microwave integrated circuit (MMIC) applications |
US6015739A (en) * | 1997-10-29 | 2000-01-18 | Advanced Micro Devices | Method of making gate dielectric for sub-half micron MOS transistors including a graded dielectric constant |
US6068884A (en) * | 1998-04-28 | 2000-05-30 | Silcon Valley Group Thermal Systems, Llc | Method of making low κ dielectric inorganic/organic hybrid films |
KR100385976B1 (ko) | 1999-12-30 | 2003-06-02 | 삼성전자주식회사 | 회로기판 및 그 제조방법 |
EP1317775A4 (en) * | 2000-03-20 | 2009-01-28 | Bekaert Sa Nv | MATERIALS COMPRISING LOW DIELECTRIC CONSTANTS AND PROCESS FOR PRODUCING THE SAME |
US6753483B2 (en) * | 2000-06-14 | 2004-06-22 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
US6406945B1 (en) * | 2001-01-26 | 2002-06-18 | Chartered Semiconductor Manufacturing Ltd. | Method for forming a transistor gate dielectric with high-K and low-K regions |
JP2003017861A (ja) * | 2001-06-28 | 2003-01-17 | Kyocera Corp | 多層配線基板及びその製造方法 |
US6819540B2 (en) * | 2001-11-26 | 2004-11-16 | Shipley Company, L.L.C. | Dielectric structure |
WO2004079797A2 (en) | 2003-03-05 | 2004-09-16 | Achyut Dutta | High speed electronics interconnect and method of manufacture |
US7211881B2 (en) * | 2004-03-24 | 2007-05-01 | Hewlett-Packard Development Company, L.P. | Structure for containing desiccant |
US7290315B2 (en) * | 2004-10-21 | 2007-11-06 | Intel Corporation | Method for making a passive device structure |
-
2005
- 2005-06-17 US US11/156,350 patent/US7349196B2/en not_active Expired - Fee Related
- 2005-10-28 TW TW094137960A patent/TWI308855B/zh not_active IP Right Cessation
- 2005-11-08 CN CNB2005101176562A patent/CN100431394C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100431394C (zh) | 2008-11-05 |
CN1882218A (zh) | 2006-12-20 |
TWI308855B (en) | 2009-04-11 |
US20060285273A1 (en) | 2006-12-21 |
US7349196B2 (en) | 2008-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |