TW200701854A - Communication circuit module - Google Patents

Communication circuit module

Info

Publication number
TW200701854A
TW200701854A TW094121368A TW94121368A TW200701854A TW 200701854 A TW200701854 A TW 200701854A TW 094121368 A TW094121368 A TW 094121368A TW 94121368 A TW94121368 A TW 94121368A TW 200701854 A TW200701854 A TW 200701854A
Authority
TW
Taiwan
Prior art keywords
substrate
ground plane
circuit structure
circuit module
block layer
Prior art date
Application number
TW094121368A
Other languages
English (en)
Other versions
TWI287421B (en
Inventor
Cheng-Yen Shih
Original Assignee
Delta Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delta Electronics Inc filed Critical Delta Electronics Inc
Priority to TW094121368A priority Critical patent/TWI287421B/zh
Priority to JP2006137461A priority patent/JP2007013109A/ja
Priority to US11/472,480 priority patent/US20060291178A1/en
Publication of TW200701854A publication Critical patent/TW200701854A/zh
Application granted granted Critical
Publication of TWI287421B publication Critical patent/TWI287421B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transceivers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
TW094121368A 2005-06-27 2005-06-27 Communication circuit module TWI287421B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094121368A TWI287421B (en) 2005-06-27 2005-06-27 Communication circuit module
JP2006137461A JP2007013109A (ja) 2005-06-27 2006-05-17 通信回路モジュール
US11/472,480 US20060291178A1 (en) 2005-06-27 2006-06-22 High frequency circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094121368A TWI287421B (en) 2005-06-27 2005-06-27 Communication circuit module

Publications (2)

Publication Number Publication Date
TW200701854A true TW200701854A (en) 2007-01-01
TWI287421B TWI287421B (en) 2007-09-21

Family

ID=37567087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121368A TWI287421B (en) 2005-06-27 2005-06-27 Communication circuit module

Country Status (3)

Country Link
US (1) US20060291178A1 (zh)
JP (1) JP2007013109A (zh)
TW (1) TWI287421B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556693B (zh) * 2011-06-24 2016-11-01 微晶片科技德國公司 包含一電容感測器之一電極組態之印刷電路板
TWI680545B (zh) * 2017-05-25 2019-12-21 美商Ｔｔ電子公司 具有有內建媒介通道的印刷電路板基板之感測器裝置

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US7901400B2 (en) 1998-10-23 2011-03-08 Covidien Ag Method and system for controlling output of RF medical generator
US7137980B2 (en) 1998-10-23 2006-11-21 Sherwood Services Ag Method and system for controlling output of RF medical generator
US7364577B2 (en) 2002-02-11 2008-04-29 Sherwood Services Ag Vessel sealing system
US7044948B2 (en) 2002-12-10 2006-05-16 Sherwood Services Ag Circuit for controlling arc energy from an electrosurgical generator
US7722601B2 (en) 2003-05-01 2010-05-25 Covidien Ag Method and system for programming and controlling an electrosurgical generator system
EP1676108B1 (en) 2003-10-23 2017-05-24 Covidien AG Thermocouple measurement circuit
US7396336B2 (en) 2003-10-30 2008-07-08 Sherwood Services Ag Switched resonant ultrasonic power amplifier system
US7131860B2 (en) 2003-11-20 2006-11-07 Sherwood Services Ag Connector systems for electrosurgical generator
US7628786B2 (en) 2004-10-13 2009-12-08 Covidien Ag Universal foot switch contact port
US9474564B2 (en) 2005-03-31 2016-10-25 Covidien Ag Method and system for compensating for external impedance of an energy carrying component when controlling an electrosurgical generator
JP3949695B2 (ja) * 2005-09-26 2007-07-25 シャープ株式会社 受信装置
US8734438B2 (en) 2005-10-21 2014-05-27 Covidien Ag Circuit and method for reducing stored energy in an electrosurgical generator
US7947039B2 (en) 2005-12-12 2011-05-24 Covidien Ag Laparoscopic apparatus for performing electrosurgical procedures
CA2574934C (en) 2006-01-24 2015-12-29 Sherwood Services Ag System and method for closed loop monitoring of monopolar electrosurgical apparatus
US9186200B2 (en) 2006-01-24 2015-11-17 Covidien Ag System and method for tissue sealing
US8685016B2 (en) 2006-01-24 2014-04-01 Covidien Ag System and method for tissue sealing
CA2574935A1 (en) 2006-01-24 2007-07-24 Sherwood Services Ag A method and system for controlling an output of a radio-frequency medical generator having an impedance based control algorithm
US8216223B2 (en) 2006-01-24 2012-07-10 Covidien Ag System and method for tissue sealing
US7513896B2 (en) 2006-01-24 2009-04-07 Covidien Ag Dual synchro-resonant electrosurgical apparatus with bi-directional magnetic coupling
EP1810634B8 (en) 2006-01-24 2015-06-10 Covidien AG System for tissue sealing
US8147485B2 (en) 2006-01-24 2012-04-03 Covidien Ag System and method for tissue sealing
US7651493B2 (en) 2006-03-03 2010-01-26 Covidien Ag System and method for controlling electrosurgical snares
US7651492B2 (en) 2006-04-24 2010-01-26 Covidien Ag Arc based adaptive control system for an electrosurgical unit
JP2008028612A (ja) * 2006-07-20 2008-02-07 Matsushita Electric Ind Co Ltd 通信装置およびそれを用いた電子機器
US7794457B2 (en) 2006-09-28 2010-09-14 Covidien Ag Transformer for RF voltage sensing
US8777941B2 (en) 2007-05-10 2014-07-15 Covidien Lp Adjustable impedance electrosurgical electrodes
US7834484B2 (en) 2007-07-16 2010-11-16 Tyco Healthcare Group Lp Connection cable and method for activating a voltage-controlled generator
US8152800B2 (en) * 2007-07-30 2012-04-10 Vivant Medical, Inc. Electrosurgical systems and printed circuit boards for use therewith
US8216220B2 (en) 2007-09-07 2012-07-10 Tyco Healthcare Group Lp System and method for transmission of combined data stream
US8512332B2 (en) 2007-09-21 2013-08-20 Covidien Lp Real-time arc control in electrosurgical generators
US8226639B2 (en) 2008-06-10 2012-07-24 Tyco Healthcare Group Lp System and method for output control of electrosurgical generator
US20100167427A1 (en) * 2008-12-31 2010-07-01 Texas Instruments Incorporated Passive device trimming
US8262652B2 (en) 2009-01-12 2012-09-11 Tyco Healthcare Group Lp Imaginary impedance process monitoring and intelligent shut-off
JP2011035170A (ja) * 2009-07-31 2011-02-17 Olympus Corp 多層積層回路
JP5126286B2 (ja) * 2010-05-20 2013-01-23 株式会社村田製作所 積層型高周波モジュール
CN102695358B (zh) * 2011-03-25 2015-04-08 中山市云创知识产权服务有限公司 印刷电路板
US9872719B2 (en) 2013-07-24 2018-01-23 Covidien Lp Systems and methods for generating electrosurgical energy using a multistage power converter
US9636165B2 (en) 2013-07-29 2017-05-02 Covidien Lp Systems and methods for measuring tissue impedance through an electrosurgical cable
TW201817280A (zh) 2016-07-06 2018-05-01 亮銳公司 用於整合式發光二極體驅動器之印刷電路板

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6452117B2 (en) * 1999-08-26 2002-09-17 International Business Machines Corporation Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
US6614325B1 (en) * 2000-08-31 2003-09-02 Northrop Grumman Corporation RF/IF signal distribution network utilizing broadside coupled stripline
JP2003188338A (ja) * 2001-12-13 2003-07-04 Sony Corp 回路基板装置及びその製造方法
JP4001782B2 (ja) * 2002-06-13 2007-10-31 三菱電機株式会社 利得形状調節方法及びシステム
US6995322B2 (en) * 2003-01-30 2006-02-07 Endicott Interconnect Technologies, Inc. High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI556693B (zh) * 2011-06-24 2016-11-01 微晶片科技德國公司 包含一電容感測器之一電極組態之印刷電路板
US9702902B2 (en) 2011-06-24 2017-07-11 Microchip Technology Incorporated Printed circuit board comprising an electrode configuration of a capacitive sensor
TWI680545B (zh) * 2017-05-25 2019-12-21 美商Ｔｔ電子公司 具有有內建媒介通道的印刷電路板基板之感測器裝置

Also Published As

Publication number Publication date
TWI287421B (en) 2007-09-21
JP2007013109A (ja) 2007-01-18
US20060291178A1 (en) 2006-12-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees