TW200644227A - Solid-state image pick-up device - Google Patents
Solid-state image pick-up deviceInfo
- Publication number
- TW200644227A TW200644227A TW095110504A TW95110504A TW200644227A TW 200644227 A TW200644227 A TW 200644227A TW 095110504 A TW095110504 A TW 095110504A TW 95110504 A TW95110504 A TW 95110504A TW 200644227 A TW200644227 A TW 200644227A
- Authority
- TW
- Taiwan
- Prior art keywords
- antireflection film
- photo
- detecting section
- state image
- image pick
- Prior art date
Links
- 238000002955 isolation Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 230000035945 sensitivity Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005092865A JP2006278539A (ja) | 2005-03-28 | 2005-03-28 | Mos型固体撮像装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200644227A true TW200644227A (en) | 2006-12-16 |
Family
ID=37195516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095110504A TW200644227A (en) | 2005-03-28 | 2006-03-27 | Solid-state image pick-up device |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060244088A1 (zh) |
JP (1) | JP2006278539A (zh) |
KR (1) | KR20060104936A (zh) |
CN (1) | CN1855519A (zh) |
TW (1) | TW200644227A (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4992446B2 (ja) * | 2006-02-24 | 2012-08-08 | ソニー株式会社 | 固体撮像装置及びその製造方法、並びにカメラ |
KR100826407B1 (ko) * | 2006-10-12 | 2008-05-02 | 삼성전기주식회사 | 자외선 수광용 포토 다이오드 및 이를 포함하는 이미지센서 |
TWI366916B (en) | 2006-12-19 | 2012-06-21 | Sony Corp | Solid-state imaging device and imaging apparatus |
TWI436474B (zh) * | 2007-05-07 | 2014-05-01 | Sony Corp | A solid-state image pickup apparatus, a manufacturing method thereof, and an image pickup apparatus |
US20100148230A1 (en) * | 2008-12-11 | 2010-06-17 | Stevens Eric G | Trench isolation regions in image sensors |
KR101776955B1 (ko) | 2009-02-10 | 2017-09-08 | 소니 주식회사 | 고체 촬상 장치와 그 제조 방법, 및 전자 기기 |
JP5564918B2 (ja) * | 2009-12-03 | 2014-08-06 | ソニー株式会社 | 撮像素子およびカメラシステム |
JP2011135100A (ja) * | 2011-03-22 | 2011-07-07 | Sony Corp | 固体撮像装置及び電子機器 |
JP2014053591A (ja) * | 2012-08-08 | 2014-03-20 | Sony Corp | 撮像素子、撮像装置、製造装置および方法 |
CN105206631A (zh) * | 2014-06-23 | 2015-12-30 | 上海箩箕技术有限公司 | 感光像素阵列、环境光传感器和距离传感器 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3285981B2 (ja) * | 1993-01-14 | 2002-05-27 | 浜松ホトニクス株式会社 | 半導体受光素子 |
JP4089123B2 (ja) * | 2000-02-29 | 2008-05-28 | ソニー株式会社 | 液晶表示装置及びその製造方法 |
JP3910817B2 (ja) * | 2000-12-19 | 2007-04-25 | ユーディナデバイス株式会社 | 半導体受光装置 |
JP2004079901A (ja) * | 2002-08-21 | 2004-03-11 | Nec Electronics Corp | 半導体装置及びその製造方法 |
JP3840214B2 (ja) * | 2003-01-06 | 2006-11-01 | キヤノン株式会社 | 光電変換装置及び光電変換装置の製造方法及び同光電変換装置を用いたカメラ |
JP2004335588A (ja) * | 2003-05-01 | 2004-11-25 | Renesas Technology Corp | 固体撮像装置及びその製造方法 |
US7211829B2 (en) * | 2004-03-01 | 2007-05-01 | Matsushita Electric Industrial Co., Ltd | Semiconductor photodetector device |
KR100688497B1 (ko) * | 2004-06-28 | 2007-03-02 | 삼성전자주식회사 | 이미지 센서 및 그 제조방법 |
-
2005
- 2005-03-28 JP JP2005092865A patent/JP2006278539A/ja not_active Withdrawn
-
2006
- 2006-03-27 CN CNA2006100682896A patent/CN1855519A/zh active Pending
- 2006-03-27 TW TW095110504A patent/TW200644227A/zh unknown
- 2006-03-28 US US11/390,246 patent/US20060244088A1/en not_active Abandoned
- 2006-03-28 KR KR1020060028005A patent/KR20060104936A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR20060104936A (ko) | 2006-10-09 |
US20060244088A1 (en) | 2006-11-02 |
JP2006278539A (ja) | 2006-10-12 |
CN1855519A (zh) | 2006-11-01 |
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