TW200644142A - A method of inspecting semiconductor wafers taking the SAW design into account - Google Patents

A method of inspecting semiconductor wafers taking the SAW design into account

Info

Publication number
TW200644142A
TW200644142A TW095115538A TW95115538A TW200644142A TW 200644142 A TW200644142 A TW 200644142A TW 095115538 A TW095115538 A TW 095115538A TW 95115538 A TW95115538 A TW 95115538A TW 200644142 A TW200644142 A TW 200644142A
Authority
TW
Taiwan
Prior art keywords
wafer
area
account
semiconductor wafers
inspecting semiconductor
Prior art date
Application number
TW095115538A
Other languages
English (en)
Inventor
Michael Heiden
Albert Kreh
Original Assignee
Vistec Semicondcutor Systems Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vistec Semicondcutor Systems Gmbh filed Critical Vistec Semicondcutor Systems Gmbh
Publication of TW200644142A publication Critical patent/TW200644142A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW095115538A 2005-06-10 2006-05-02 A method of inspecting semiconductor wafers taking the SAW design into account TW200644142A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005027120A DE102005027120A1 (de) 2005-06-10 2005-06-10 Verfahren zur Inspektion von Halbleiterwafern unter Berücksichtigung des Saw-Designs

Publications (1)

Publication Number Publication Date
TW200644142A true TW200644142A (en) 2006-12-16

Family

ID=37440050

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115538A TW200644142A (en) 2005-06-10 2006-05-02 A method of inspecting semiconductor wafers taking the SAW design into account

Country Status (4)

Country Link
US (1) US20060279729A1 (zh)
JP (1) JP2006344975A (zh)
DE (1) DE102005027120A1 (zh)
TW (1) TW200644142A (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080243292A1 (en) * 2007-03-30 2008-10-02 Tzu-Yin Chiu Method of defect detection based on wafer rotation
US7924420B2 (en) * 2007-06-18 2011-04-12 Applied Materials South East Asia Pte. Ltd. Optical inspection including partial scanning of wafers
DE102007060355A1 (de) 2007-12-12 2009-06-25 Vistec Semiconductor Systems Gmbh Verfahren und Vorrichtung zur Verarbeitung der von mindestens einer Kamera aufgenommenen Bilddaten der Oberfläche eines Wafers
DE102011051355A1 (de) * 2011-06-27 2012-12-27 Hseb Dresden Gmbh Inspektionsvorrichtung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020957A (en) * 1998-04-30 2000-02-01 Kla-Tencor Corporation System and method for inspecting semiconductor wafers
JP2001005970A (ja) * 1999-06-24 2001-01-12 Canon Inc 欠陥情報処理装置及び方法
US6763130B1 (en) * 1999-07-21 2004-07-13 Applied Materials, Inc. Real time defect source identification
JP2003149169A (ja) * 2001-11-16 2003-05-21 Tokyo Seimitsu Co Ltd ウエハ欠陥検査装置
US7042564B2 (en) * 2002-08-08 2006-05-09 Applied Materials, Israel, Ltd. Wafer inspection methods and an optical inspection tool
US7525659B2 (en) * 2003-01-15 2009-04-28 Negevtech Ltd. System for detection of water defects
DE10307358B3 (de) * 2003-02-21 2004-10-07 Leica Microsystems Semiconductor Gmbh Verfahren und Vorrichtung zum Scannen eines Halbleiter-Wafers
JP4185789B2 (ja) * 2003-03-12 2008-11-26 株式会社日立ハイテクノロジーズ パターン検査方法及びその装置
US20050112474A1 (en) * 2003-11-20 2005-05-26 Micronic Laser Systems Ab Method involving a mask or a reticle
US7212017B2 (en) * 2003-12-25 2007-05-01 Ebara Corporation Electron beam apparatus with detailed observation function and sample inspecting and observing method using electron beam apparatus
DE102005011237B3 (de) * 2005-03-11 2006-08-03 Leica Microsystems Semiconductor Gmbh Verfahren zur Bestimmung von Defekten in Bildern
US8041103B2 (en) * 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7659973B2 (en) * 2006-05-26 2010-02-09 Applied Materials Southeast Asia, Pte Ltd. Wafer inspection using short-pulsed continuous broadband illumination
US7486391B2 (en) * 2006-09-13 2009-02-03 Samsung Austin Semiconductor, L.P. System and method for haze control in semiconductor processes

Also Published As

Publication number Publication date
JP2006344975A (ja) 2006-12-21
US20060279729A1 (en) 2006-12-14
DE102005027120A1 (de) 2006-12-14

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