TW200636886A - Conductive bump structure for semiconductor device and fabrication method thereof - Google Patents
Conductive bump structure for semiconductor device and fabrication method thereofInfo
- Publication number
- TW200636886A TW200636886A TW094111456A TW94111456A TW200636886A TW 200636886 A TW200636886 A TW 200636886A TW 094111456 A TW094111456 A TW 094111456A TW 94111456 A TW94111456 A TW 94111456A TW 200636886 A TW200636886 A TW 200636886A
- Authority
- TW
- Taiwan
- Prior art keywords
- bump
- semiconductor device
- fabrication method
- ubm
- conductive bump
- Prior art date
Links
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Wire Bonding (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094111456A TWI288447B (en) | 2005-04-12 | 2005-04-12 | Conductive bump structure for semiconductor device and fabrication method thereof |
US11/401,882 US20060246706A1 (en) | 2005-04-12 | 2006-04-12 | Conductive bump structure for semiconductor device and fabrication method thereof |
US12/851,971 US20100297842A1 (en) | 2005-04-12 | 2010-08-06 | Conductive bump structure for semiconductor device and fabrication method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094111456A TWI288447B (en) | 2005-04-12 | 2005-04-12 | Conductive bump structure for semiconductor device and fabrication method thereof |
Publications (2)
Publication Number | Publication Date |
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TW200636886A true TW200636886A (en) | 2006-10-16 |
TWI288447B TWI288447B (en) | 2007-10-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW094111456A TWI288447B (en) | 2005-04-12 | 2005-04-12 | Conductive bump structure for semiconductor device and fabrication method thereof |
Country Status (2)
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US (2) | US20060246706A1 (zh) |
TW (1) | TWI288447B (zh) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080003803A1 (en) * | 2006-06-30 | 2008-01-03 | Pei-Haw Tsao | Semiconductor package substrate for flip chip packaging |
JP5162851B2 (ja) * | 2006-07-14 | 2013-03-13 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
US7786579B2 (en) * | 2007-05-23 | 2010-08-31 | International Business Machines Corporation | Apparatus for crack prevention in integrated circuit packages |
JP5627835B2 (ja) * | 2007-11-16 | 2014-11-19 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
US20090174069A1 (en) * | 2008-01-04 | 2009-07-09 | National Semiconductor Corporation | I/o pad structure for enhancing solder joint reliability in integrated circuit devices |
KR100979497B1 (ko) * | 2008-06-17 | 2010-09-01 | 삼성전기주식회사 | 웨이퍼 레벨 패키지 및 그 제조방법 |
JP5427394B2 (ja) * | 2008-11-21 | 2014-02-26 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 半導体装置の製造方法 |
JP5269563B2 (ja) * | 2008-11-28 | 2013-08-21 | 新光電気工業株式会社 | 配線基板とその製造方法 |
TWI397983B (zh) * | 2008-12-31 | 2013-06-01 | Ind Tech Res Inst | 封裝載板與接合結構 |
JP2011165862A (ja) * | 2010-02-09 | 2011-08-25 | Sony Corp | 半導体装置、チップ・オン・チップの実装構造、半導体装置の製造方法及びチップ・オン・チップの実装構造の形成方法 |
US20120211884A1 (en) * | 2011-02-23 | 2012-08-23 | Frank Stepniak | Wafer chip scale package connection scheme |
TWI463621B (zh) * | 2011-11-04 | 2014-12-01 | 矽品精密工業股份有限公司 | 封裝基板結構及其製法 |
CN102543101A (zh) * | 2012-03-16 | 2012-07-04 | 新乡医学院 | 一种硬盘磁头焊盘及其制备方法 |
US9620468B2 (en) * | 2012-11-08 | 2017-04-11 | Tongfu Microelectronics Co., Ltd. | Semiconductor packaging structure and method for forming the same |
CN102915986B (zh) * | 2012-11-08 | 2015-04-01 | 南通富士通微电子股份有限公司 | 芯片封装结构 |
US9589815B2 (en) * | 2012-11-08 | 2017-03-07 | Nantong Fujitsu Microelectronics Co., Ltd. | Semiconductor IC packaging methods and structures |
JP5867484B2 (ja) * | 2013-11-14 | 2016-02-24 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
US9219044B2 (en) * | 2013-11-18 | 2015-12-22 | Applied Materials, Inc. | Patterned photoresist to attach a carrier wafer to a silicon device wafer |
US9202793B1 (en) | 2013-12-26 | 2015-12-01 | Stats Chippac Ltd. | Integrated circuit packaging system with under bump metallization and method of manufacture thereof |
US9472515B2 (en) | 2014-03-11 | 2016-10-18 | Intel Corporation | Integrated circuit package |
US10325853B2 (en) * | 2014-12-03 | 2019-06-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming semiconductor packages having through package vias |
US20170338204A1 (en) * | 2016-05-17 | 2017-11-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device and Method for UBM/RDL Routing |
KR20180136148A (ko) * | 2017-06-14 | 2018-12-24 | 에스케이하이닉스 주식회사 | 범프를 구비하는 반도체 장치 |
US10651052B2 (en) | 2018-01-12 | 2020-05-12 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
US20220165625A1 (en) * | 2020-11-20 | 2022-05-26 | Intel Corporation | Universal electrically inactive devices for integrated circuit packages |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5466635A (en) * | 1994-06-02 | 1995-11-14 | Lsi Logic Corporation | Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating |
US5943597A (en) * | 1998-06-15 | 1999-08-24 | Motorola, Inc. | Bumped semiconductor device having a trench for stress relief |
US6974659B2 (en) * | 2002-01-16 | 2005-12-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of forming a solder ball using a thermally stable resinous protective layer |
TW531869B (en) * | 2002-02-27 | 2003-05-11 | Advanced Semiconductor Eng | Manufacturing process of lead-free soldering bump |
TWI281718B (en) * | 2002-09-10 | 2007-05-21 | Advanced Semiconductor Eng | Bump and process thereof |
-
2005
- 2005-04-12 TW TW094111456A patent/TWI288447B/zh not_active IP Right Cessation
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2006
- 2006-04-12 US US11/401,882 patent/US20060246706A1/en not_active Abandoned
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2010
- 2010-08-06 US US12/851,971 patent/US20100297842A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
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US20100297842A1 (en) | 2010-11-25 |
TWI288447B (en) | 2007-10-11 |
US20060246706A1 (en) | 2006-11-02 |
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