TW200636232A - Electron beam device - Google Patents

Electron beam device

Info

Publication number
TW200636232A
TW200636232A TW095105569A TW95105569A TW200636232A TW 200636232 A TW200636232 A TW 200636232A TW 095105569 A TW095105569 A TW 095105569A TW 95105569 A TW95105569 A TW 95105569A TW 200636232 A TW200636232 A TW 200636232A
Authority
TW
Taiwan
Prior art keywords
electron beam
sub
area
areas
image
Prior art date
Application number
TW095105569A
Other languages
English (en)
Other versions
TWI458967B (zh
Inventor
Mamoru Nakasuji
Nobuharu Noji
Tohru Satake
Hirosi Sobukawa
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005041063A external-priority patent/JP2006226833A/ja
Priority claimed from JP2005077136A external-priority patent/JP2006260957A/ja
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of TW200636232A publication Critical patent/TW200636232A/zh
Application granted granted Critical
Publication of TWI458967B publication Critical patent/TWI458967B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/244—Detectors; Associated components or circuits therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
    • G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/22—Optical or photographic arrangements associated with the tube
    • H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
    • H01J37/29—Reflection microscopes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136254—Checking; Testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/15—Means for deflecting or directing discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248—Components associated with the control of the tube
    • H01J2237/2482—Optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/26—Electron or ion microscopes
    • H01J2237/28—Scanning microscopes
    • H01J2237/2813—Scanning microscopes characterised by the application
    • H01J2237/2817—Pattern inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Measurement Of Radiation (AREA)
TW095105569A 2005-02-17 2006-02-17 電子射線裝置 TWI458967B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005041063A JP2006226833A (ja) 2005-02-17 2005-02-17 欠陥検査装置及び欠陥検査装置を用いたデバイス製造方法
JP2005077136A JP2006260957A (ja) 2005-03-17 2005-03-17 電子線装置

Publications (2)

Publication Number Publication Date
TW200636232A true TW200636232A (en) 2006-10-16
TWI458967B TWI458967B (zh) 2014-11-01

Family

ID=36916538

Family Applications (3)

Application Number Title Priority Date Filing Date
TW101142358A TW201307833A (zh) 2005-02-17 2006-02-17 電子射線裝置
TW103134994A TWI519779B (zh) 2005-02-17 2006-02-17 電子射線裝置
TW095105569A TWI458967B (zh) 2005-02-17 2006-02-17 電子射線裝置

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW101142358A TW201307833A (zh) 2005-02-17 2006-02-17 電子射線裝置
TW103134994A TWI519779B (zh) 2005-02-17 2006-02-17 電子射線裝置

Country Status (4)

Country Link
US (1) US9390886B2 (zh)
KR (2) KR101377106B1 (zh)
TW (3) TW201307833A (zh)
WO (1) WO2006088141A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI488209B (zh) * 2010-05-07 2015-06-11 Integrated Circuit Testing 具有色散補償的電子光束裝置，及其操作方法
US9194826B2 (en) 2007-04-16 2015-11-24 Ebara Corporation Electron beam apparatus and sample observation method using the same
TWI648535B (zh) * 2016-07-27 2019-01-21 日商紐富來科技股份有限公司 帶電粒子束檢查裝置及帶電粒子束檢查方法
TWI673748B (zh) * 2014-12-22 2019-10-01 美商應用材料股份有限公司 用於檢查基板的設備、用於檢查基板的方法

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JP4741408B2 (ja) 2006-04-27 2011-08-03 株式会社荏原製作所 試料パターン検査装置におけるｘｙ座標補正装置及び方法
EP2113092B1 (en) * 2006-12-18 2014-08-27 Datalogic IP TECH S.r.l. Aiming device
US8080790B2 (en) * 2008-03-05 2011-12-20 Hitachi High-Technologies Corporation Scanning electron microscope
JP2013125652A (ja) * 2011-12-14 2013-06-24 Samsung Yokohama Research Institute Co Ltd 電子線装置
JP5942411B2 (ja) * 2011-12-15 2016-06-29 富士ゼロックス株式会社 送風管、送風装置及び画像形成装置
JP5919813B2 (ja) * 2011-12-27 2016-05-18 富士ゼロックス株式会社 送風管、送風装置及び画像形成装置
JP6724145B2 (ja) 2016-01-27 2020-07-15 エーエスエムエル ネザーランズ ビー．ブイ． 複数の荷電粒子ビームの装置
JP6865646B2 (ja) 2016-11-30 2021-04-28 住友化学株式会社 欠陥検査装置、欠陥検査方法、及びセパレータ捲回体の製造方法
CN108132262A (zh) * 2016-11-30 2018-06-08 住友化学株式会社 缺陷检查装置、缺陷检查方法及隔膜卷绕体的制造方法
US10777377B2 (en) * 2017-02-05 2020-09-15 Kla-Tencor Corporation Multi-column spacing for photomask and reticle inspection and wafer print check verification
KR102327112B1 (ko) 2017-04-05 2021-11-16 가부시키가이샤 포토 일렉트론 소울 전자선 발생 장치, 및, 전자선 적용 장치
CN111328425A (zh) * 2017-11-10 2020-06-23 Asml荷兰有限公司 电子束检查工具和用于定位载物台的方法
US11087950B2 (en) * 2018-05-29 2021-08-10 Kla-Tencor Corporation Charge control device for a system with multiple electron beams
TWI696206B (zh) * 2018-09-27 2020-06-11 日商Ｐｈｏｔｏ Ｅｌｅｃｔｒｏｎ Ｓｏｕｌ股份有限公司 電子射線產生裝置以及電子射線應用裝置
JP7234052B2 (ja) 2019-06-28 2023-03-07 株式会社ニューフレアテクノロジー マルチ電子ビーム画像取得装置及びマルチ電子ビーム画像取得方法
US11335608B2 (en) 2020-04-15 2022-05-17 Kla Corporation Electron beam system for inspection and review of 3D devices

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JP3980404B2 (ja) * 2002-05-15 2007-09-26 株式会社荏原製作所 電子線装置及び該装置を用いたデバイス製造方法
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JP4308504B2 (ja) * 2002-11-21 2009-08-05 株式会社荏原製作所 電子線装置及びその装置を用いたデバイス製造方法
JP4642362B2 (ja) * 2003-06-06 2011-03-02 株式会社荏原製作所 基板位置合わせ方法、基板表面検査方法、基板位置決め方法、半導体デバイス製造方法、基板位置合わせ装置及び基板表面検査装置
US7248353B2 (en) * 2003-05-30 2007-07-24 Ebara Corporation Method and apparatus for inspecting samples, and method for manufacturing devices using method and apparatus for inspecting samples
JP4564728B2 (ja) * 2003-07-25 2010-10-20 株式会社日立ハイテクノロジーズ 回路パターンの検査装置
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9194826B2 (en) 2007-04-16 2015-11-24 Ebara Corporation Electron beam apparatus and sample observation method using the same
TWI488209B (zh) * 2010-05-07 2015-06-11 Integrated Circuit Testing 具有色散補償的電子光束裝置，及其操作方法
TWI673748B (zh) * 2014-12-22 2019-10-01 美商應用材料股份有限公司 用於檢查基板的設備、用於檢查基板的方法
TWI648535B (zh) * 2016-07-27 2019-01-21 日商紐富來科技股份有限公司 帶電粒子束檢查裝置及帶電粒子束檢查方法

Also Published As

Publication number Publication date
KR20120101157A (ko) 2012-09-12
TW201506390A (zh) 2015-02-16
KR101377106B1 (ko) 2014-03-25
KR20070116602A (ko) 2007-12-10
US20100213370A1 (en) 2010-08-26
KR101279028B1 (ko) 2013-07-02
WO2006088141A1 (ja) 2006-08-24
TWI519779B (zh) 2016-02-01
US9390886B2 (en) 2016-07-12
TW201307833A (zh) 2013-02-16
TWI458967B (zh) 2014-11-01

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