TW200634853A - Advanced anisotropic insulated conductive ball for electric connection, preparing method thereof and product using the same - Google Patents

Advanced anisotropic insulated conductive ball for electric connection, preparing method thereof and product using the same

Info

Publication number
TW200634853A
TW200634853A TW095103338A TW95103338A TW200634853A TW 200634853 A TW200634853 A TW 200634853A TW 095103338 A TW095103338 A TW 095103338A TW 95103338 A TW95103338 A TW 95103338A TW 200634853 A TW200634853 A TW 200634853A
Authority
TW
Taiwan
Prior art keywords
electric connection
conductive balls
insulation
present
product
Prior art date
Application number
TW095103338A
Other languages
English (en)
Inventor
Joo-Seok Oh
Eui-Deok Kim
Ki-Suk Park
Seoung-Whan Shin
Original Assignee
Hanwha Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanwha Chemical Corp filed Critical Hanwha Chemical Corp
Publication of TW200634853A publication Critical patent/TW200634853A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B33/00—Clay-wares
    • C04B33/02—Preparing or treating the raw materials individually or as batches
    • C04B33/04—Clay; Kaolin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
    • B28B3/00—Producing shaped articles from the material by using presses; Presses specially adapted therefor
    • B28B3/02—Producing shaped articles from the material by using presses; Presses specially adapted therefor wherein a ram exerts pressure on the material in a moulding space; Ram heads of special form
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B33/00—Clay-wares
    • C04B33/02—Preparing or treating the raw materials individually or as batches
    • C04B33/13—Compounding ingredients
    • C04B33/131—Inorganic additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW095103338A 2005-02-02 2006-01-27 Advanced anisotropic insulated conductive ball for electric connection, preparing method thereof and product using the same TW200634853A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050009658A KR100666611B1 (ko) 2005-02-02 2005-02-02 개선된 이방성 도전접속용 절연 도전성 입자, 이의제조방법 및 이를 이용한 제품

Publications (1)

Publication Number Publication Date
TW200634853A true TW200634853A (en) 2006-10-01

Family

ID=36777462

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103338A TW200634853A (en) 2005-02-02 2006-01-27 Advanced anisotropic insulated conductive ball for electric connection, preparing method thereof and product using the same

Country Status (6)

Country Link
US (1) US20090178826A1 (zh)
JP (1) JP2008530731A (zh)
KR (1) KR100666611B1 (zh)
CN (1) CN101142634A (zh)
TW (1) TW200634853A (zh)
WO (1) WO2006083117A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100861010B1 (ko) * 2006-12-22 2008-09-30 제일모직주식회사 절연성 도전 입자 및 이를 이용한 이방 도전성 필름
KR100815471B1 (ko) * 2006-12-26 2008-03-20 제일모직주식회사 고분자 수지 기재 입자 및 이를 함유한 이방 도전성 접속용도전 입자
CN104162392A (zh) * 2013-05-20 2014-11-26 孙红梅 一种核壳结构的多孔球及其制造方法和用途
KR101768282B1 (ko) * 2014-10-30 2017-08-14 삼성에스디아이 주식회사 이방 도전성 필름 및 이를 이용한 반도체 장치
JP7430610B2 (ja) 2020-08-31 2024-02-13 日本化学工業株式会社 被覆粒子及びその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62176139A (ja) 1986-01-29 1987-08-01 Fuji Xerox Co Ltd 異方導電材料およびこれを用いた半導体装置の実装方法
JPH04115407A (ja) * 1990-09-03 1992-04-16 Soken Kagaku Kk 異方導電性接着剤組成物
JPH07105716A (ja) * 1993-10-05 1995-04-21 Soken Kagaku Kk 被覆粒子および異方導電性接着剤
KR100313766B1 (ko) * 1999-12-30 2001-11-15 구자홍 전도성 입자의 제조방법 및 전도성 입자 구조
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
TWI232467B (en) * 2001-11-30 2005-05-11 Mitsui Chemicals Inc Paste for circuit connection, anisotropic conductive paste and uses thereof
JP4050086B2 (ja) 2002-04-24 2008-02-20 ナトコ株式会社 導電性粒子、導電性材料および異方性導電膜
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품
US7174884B2 (en) * 2005-01-05 2007-02-13 Kempf James J Trigger assembly

Also Published As

Publication number Publication date
KR100666611B1 (ko) 2007-01-09
US20090178826A1 (en) 2009-07-16
CN101142634A (zh) 2008-03-12
KR20060088716A (ko) 2006-08-07
JP2008530731A (ja) 2008-08-07
WO2006083117A1 (en) 2006-08-10

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