TW200634435A - Acrylic copolymer - Google Patents

Acrylic copolymer

Info

Publication number
TW200634435A
TW200634435A TW094146528A TW94146528A TW200634435A TW 200634435 A TW200634435 A TW 200634435A TW 094146528 A TW094146528 A TW 094146528A TW 94146528 A TW94146528 A TW 94146528A TW 200634435 A TW200634435 A TW 200634435A
Authority
TW
Taiwan
Prior art keywords
liquid
immersion exposure
degeneration
mol
methyl
Prior art date
Application number
TW094146528A
Other languages
English (en)
Inventor
Kotaro Endo
Keita Ishiduka
Tomoyuki Hirano
Ichiro Taninaka
Takahiko Tsukuda
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd, Harima Chemicals Inc filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200634435A publication Critical patent/TW200634435A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04Acids; Metal salts or ammonium salts thereof
    • C08F220/06Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1806C6-(meth)acrylate, e.g. (cyclo)hexyl (meth)acrylate or phenyl (meth)acrylate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
TW094146528A 2004-12-27 2005-12-26 Acrylic copolymer TW200634435A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004378236 2004-12-27
PCT/JP2005/023636 WO2006070694A1 (ja) 2004-12-27 2005-12-22 アクリル系共重合ポリマー

Publications (1)

Publication Number Publication Date
TW200634435A true TW200634435A (en) 2006-10-01

Family

ID=36614811

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094146528A TW200634435A (en) 2004-12-27 2005-12-26 Acrylic copolymer

Country Status (5)

Country Link
US (1) US20090048409A1 (zh)
EP (1) EP1876190A4 (zh)
JP (1) JPWO2006070694A1 (zh)
TW (1) TW200634435A (zh)
WO (1) WO2006070694A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105747B2 (en) 2006-10-31 2012-01-31 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method of forming resist pattern
US8519073B2 (en) 2006-10-31 2013-08-27 Tokyo Ohka Kogyo Co., Ltd. Compound and polymeric compound

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006301524A (ja) * 2005-04-25 2006-11-02 Tokyo Ohka Kogyo Co Ltd 保護膜形成用材料およびこれを用いたレジストパターン形成方法
JP4638378B2 (ja) * 2005-06-07 2011-02-23 信越化学工業株式会社 レジスト下層膜材料並びにそれを用いたパターン形成方法
JP2007078744A (ja) * 2005-09-09 2007-03-29 Tokyo Ohka Kogyo Co Ltd 保護膜形成用材料およびこれを用いたホトレジストパターン形成方法
JP5049513B2 (ja) * 2006-05-30 2012-10-17 Jsr株式会社 保護膜形成用樹脂組成物
JP2008050422A (ja) * 2006-08-23 2008-03-06 Daicel Chem Ind Ltd 半導体レジストの保護膜用樹脂及び半導体の製造方法
JP5223892B2 (ja) * 2010-06-30 2013-06-26 Jsr株式会社 パターン形成方法
JP6875082B2 (ja) * 2016-08-08 2021-05-19 旭化成株式会社 インプリント用モールド

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041838B2 (en) * 2000-12-06 2006-05-09 Mitsubishi Rayon Co., Ltd. (Meth)acrylate esters, starting alcohols for the preparation thereof, processes for preparing both, polymers of the esters, chemically amplifiable resist compositions, and method for forming patterns
US6683202B2 (en) * 2001-02-22 2004-01-27 Tokyo Ohka, Kogyo Co., Ltd. Fluorine-containing monomeric ester compound for base resin in photoresist composition
US7192681B2 (en) * 2001-07-05 2007-03-20 Fuji Photo Film Co., Ltd. Positive photosensitive composition
JP2003238629A (ja) * 2002-02-19 2003-08-27 Sumitomo Bakelite Co Ltd 化学増幅型フォトレジスト用ポリマー及びフォトレジスト組成物
JP2004252146A (ja) * 2002-05-27 2004-09-09 Tokyo Ohka Kogyo Co Ltd ネガ型レジスト組成物
US6639035B1 (en) * 2002-05-28 2003-10-28 Everlight Usa, Inc. Polymer for chemical amplified photoresist compositions
JP2004077653A (ja) * 2002-08-13 2004-03-11 Toagosei Co Ltd 架橋硬化型樹脂組成物
JP2004161860A (ja) * 2002-11-12 2004-06-10 Nippon Shokubai Co Ltd 水酸基含有アクリル酸エステルおよびその用途
JP2005309376A (ja) * 2004-03-25 2005-11-04 Fuji Photo Film Co Ltd 液浸露光用ポジ型レジスト組成物及びそれを用いたパターン形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105747B2 (en) 2006-10-31 2012-01-31 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition and method of forming resist pattern
US8519073B2 (en) 2006-10-31 2013-08-27 Tokyo Ohka Kogyo Co., Ltd. Compound and polymeric compound

Also Published As

Publication number Publication date
EP1876190A1 (en) 2008-01-09
WO2006070694A1 (ja) 2006-07-06
JPWO2006070694A1 (ja) 2008-10-02
US20090048409A1 (en) 2009-02-19
EP1876190A4 (en) 2009-03-18

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