TW200632574A - Mobile body system, exposure apparatus and manufacturing method of device - Google Patents
Mobile body system, exposure apparatus and manufacturing method of deviceInfo
- Publication number
- TW200632574A TW200632574A TW094141397A TW94141397A TW200632574A TW 200632574 A TW200632574 A TW 200632574A TW 094141397 A TW094141397 A TW 094141397A TW 94141397 A TW94141397 A TW 94141397A TW 200632574 A TW200632574 A TW 200632574A
- Authority
- TW
- Taiwan
- Prior art keywords
- stopper mechanisms
- tables
- manufacturing
- closer
- exposure apparatus
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- G—PHYSICS
- G12—INSTRUMENT DETAILS
- G12B—CONSTRUCTIONAL DETAILS OF INSTRUMENTS, OR COMPARABLE DETAILS OF OTHER APPARATUS, NOT OTHERWISE PROVIDED FOR
- G12B5/00—Adjusting position or attitude, e.g. level, of instruments or other apparatus, or of parts thereof; Compensating for the effects of tilting or acceleration, e.g. for optical apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2049—Exposure; Apparatus therefor using a cantilever
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004340202 | 2004-11-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200632574A true TW200632574A (en) | 2006-09-16 |
TWI424273B TWI424273B (zh) | 2014-01-21 |
Family
ID=36497999
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094141397A TWI424273B (zh) | 2004-11-25 | 2005-11-25 | A moving body system, an exposure apparatus, and an element manufacturing method |
Country Status (7)
Country | Link |
---|---|
US (1) | US20080123067A1 (zh) |
EP (1) | EP1840943A4 (zh) |
JP (1) | JP4807629B2 (zh) |
KR (2) | KR101280166B1 (zh) |
CN (2) | CN101576716A (zh) |
TW (1) | TWI424273B (zh) |
WO (1) | WO2006057263A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7310132B2 (en) * | 2006-03-17 | 2007-12-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI572995B (zh) * | 2006-08-31 | 2017-03-01 | 尼康股份有限公司 | Exposure method and exposure apparatus, and component manufacturing method |
TWI653511B (zh) | 2006-08-31 | 2019-03-11 | 日商尼康股份有限公司 | Exposure apparatus, exposure method, and component manufacturing method |
CN103645608B (zh) * | 2006-08-31 | 2016-04-20 | 株式会社尼康 | 曝光装置及方法、组件制造方法以及决定方法 |
TWI652720B (zh) | 2006-09-01 | 2019-03-01 | 日商尼康股份有限公司 | Exposure method and device and component manufacturing method |
KR101660668B1 (ko) | 2006-09-01 | 2016-09-27 | 가부시키가이샤 니콘 | 이동체 구동 방법 및 이동체 구동 시스템, 패턴 형성 방법 및 장치, 노광 방법 및 장치, 그리고 디바이스 제조 방법 |
US7872730B2 (en) * | 2006-09-15 | 2011-01-18 | Nikon Corporation | Immersion exposure apparatus and immersion exposure method, and device manufacturing method |
NL2004401A (en) * | 2009-04-15 | 2010-10-18 | Asml Netherlands Bv | Lithographic apparatus, positioning system, and positioning method. |
TW201102765A (en) | 2009-07-01 | 2011-01-16 | Nikon Corp | Grinding device, grinding method, exposure device and production method of a device |
JP5537380B2 (ja) * | 2009-11-16 | 2014-07-02 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
US20120064460A1 (en) * | 2010-09-07 | 2012-03-15 | Nikon Corporation | Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method |
KR101450713B1 (ko) * | 2012-12-05 | 2014-10-16 | 세메스 주식회사 | 기판 처리 장치 |
US9377697B2 (en) | 2012-12-20 | 2016-06-28 | Asml Netherlands B.V. | Lithographic apparatus and table for use in such an apparatus |
US9136243B2 (en) * | 2013-12-03 | 2015-09-15 | Kulicke And Soffa Industries, Inc. | Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements |
TWI581899B (zh) * | 2015-09-09 | 2017-05-11 | Automatic preloading device for feed system | |
SG10202108028WA (en) * | 2015-11-20 | 2021-08-30 | Asml Netherlands Bv | Lithographic apparatus and method of operating a lithographic apparatus |
CN106814551B (zh) * | 2015-11-30 | 2019-04-12 | 上海微电子装备(集团)股份有限公司 | 一种基板交接装置及交接方法 |
CN112835269B (zh) * | 2021-01-19 | 2024-04-12 | 上海集成电路装备材料产业创新中心有限公司 | 一种光刻装置及曝光方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4346164A (en) * | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
JPS57153433A (en) * | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
JP2753930B2 (ja) * | 1992-11-27 | 1998-05-20 | キヤノン株式会社 | 液浸式投影露光装置 |
JPH08316124A (ja) * | 1995-05-19 | 1996-11-29 | Hitachi Ltd | 投影露光方法及び露光装置 |
US5825043A (en) * | 1996-10-07 | 1998-10-20 | Nikon Precision Inc. | Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus |
TWI223734B (en) * | 1999-12-21 | 2004-11-11 | Asml Netherlands Bv | Crash prevention in positioning apparatus for use in lithographic projection apparatus |
EP1111471B1 (en) * | 1999-12-21 | 2005-11-23 | ASML Netherlands B.V. | Lithographic projection apparatus with collision preventing device |
JP2001217183A (ja) * | 2000-02-04 | 2001-08-10 | Nikon Corp | モータ装置、ステージ装置、露光装置及びデバイス製造方法 |
KR20030028826A (ko) * | 2000-08-29 | 2003-04-10 | 가부시키가이샤 니콘 | 노광방법 및 장치 |
EP1372038B1 (en) * | 2002-06-13 | 2005-11-23 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
EP1477852A1 (en) * | 2003-05-16 | 2004-11-17 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
JP2004108434A (ja) * | 2002-09-17 | 2004-04-08 | Nikon Corp | ショックアブソーバユニット、ショックアブソーバ及びそれを有する露光装置 |
CN101424881B (zh) * | 2002-11-12 | 2011-11-30 | Asml荷兰有限公司 | 光刻投射装置 |
CN100446179C (zh) * | 2002-12-10 | 2008-12-24 | 株式会社尼康 | 曝光设备和器件制造法 |
KR101178756B1 (ko) * | 2003-04-11 | 2012-08-31 | 가부시키가이샤 니콘 | 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침액체를 유지하는 장치 및 방법 |
JP2005005295A (ja) * | 2003-06-09 | 2005-01-06 | Nikon Corp | ステージ装置及び露光装置 |
-
2005
- 2005-11-24 US US11/791,335 patent/US20080123067A1/en not_active Abandoned
- 2005-11-24 KR KR1020127017807A patent/KR101280166B1/ko active IP Right Grant
- 2005-11-24 KR KR1020077004192A patent/KR101261063B1/ko active IP Right Grant
- 2005-11-24 EP EP05809699A patent/EP1840943A4/en not_active Withdrawn
- 2005-11-24 WO PCT/JP2005/021512 patent/WO2006057263A1/ja active Application Filing
- 2005-11-24 CN CNA2009101325298A patent/CN101576716A/zh active Pending
- 2005-11-24 CN CNB200580025934XA patent/CN100490066C/zh not_active Expired - Fee Related
- 2005-11-24 JP JP2006547803A patent/JP4807629B2/ja not_active Expired - Fee Related
- 2005-11-25 TW TW094141397A patent/TWI424273B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101576716A (zh) | 2009-11-11 |
KR101280166B1 (ko) | 2013-06-28 |
TWI424273B (zh) | 2014-01-21 |
CN100490066C (zh) | 2009-05-20 |
JPWO2006057263A1 (ja) | 2008-06-05 |
EP1840943A1 (en) | 2007-10-03 |
CN1993803A (zh) | 2007-07-04 |
KR20120087190A (ko) | 2012-08-06 |
EP1840943A4 (en) | 2010-04-21 |
KR101261063B1 (ko) | 2013-05-06 |
WO2006057263A1 (ja) | 2006-06-01 |
KR20070085212A (ko) | 2007-08-27 |
JP4807629B2 (ja) | 2011-11-02 |
US20080123067A1 (en) | 2008-05-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |