SG10202108028WA - Lithographic apparatus and method of operating a lithographic apparatus - Google Patents
Lithographic apparatus and method of operating a lithographic apparatusInfo
- Publication number
- SG10202108028WA SG10202108028WA SG10202108028WA SG10202108028WA SG10202108028WA SG 10202108028W A SG10202108028W A SG 10202108028WA SG 10202108028W A SG10202108028W A SG 10202108028WA SG 10202108028W A SG10202108028W A SG 10202108028WA SG 10202108028W A SG10202108028W A SG 10202108028WA
- Authority
- SG
- Singapore
- Prior art keywords
- lithographic apparatus
- operating
- lithographic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15195532 | 2015-11-20 | ||
EP16157155 | 2016-02-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10202108028WA true SG10202108028WA (en) | 2021-08-30 |
Family
ID=57206206
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10202108028WA SG10202108028WA (en) | 2015-11-20 | 2016-09-30 | Lithographic apparatus and method of operating a lithographic apparatus |
SG11201804115UA SG11201804115UA (en) | 2015-11-20 | 2016-09-30 | Lithographic apparatus and method of operating a lithographic apparatus |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201804115UA SG11201804115UA (en) | 2015-11-20 | 2016-09-30 | Lithographic apparatus and method of operating a lithographic apparatus |
Country Status (10)
Country | Link |
---|---|
US (1) | US20180329292A1 (en) |
EP (1) | EP3377942B1 (en) |
JP (3) | JP2018534623A (en) |
KR (2) | KR102215539B1 (en) |
CN (2) | CN112965341A (en) |
IL (1) | IL259258A (en) |
NL (1) | NL2017554A (en) |
SG (2) | SG10202108028WA (en) |
TW (2) | TWI732797B (en) |
WO (1) | WO2017084797A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7027099B2 (en) * | 2017-09-29 | 2022-03-01 | キヤノン株式会社 | Manufacturing method of imprint device and goods |
EP3531206A1 (en) * | 2018-02-23 | 2019-08-28 | ASML Netherlands B.V. | Systems and methods for improving resist model predictions |
CN108873615B (en) * | 2018-06-12 | 2019-12-03 | 中国科学院上海光学精密机械研究所 | The rapid simulation method of photoetching projection objective lens thermal aberration |
WO2020064265A1 (en) | 2018-09-24 | 2020-04-02 | Asml Netherlands B.V. | A process tool and an inspection method |
NO20190876A1 (en) | 2019-07-11 | 2021-01-12 | Visitech As | Real time Registration Lithography system |
EP4062233A1 (en) * | 2019-11-18 | 2022-09-28 | ASML Netherlands B.V. | A fluid handling system, method and lithographic apparatus |
Family Cites Families (48)
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EP2613193B1 (en) * | 2003-04-11 | 2016-01-13 | Nikon Corporation | Apparatus and method for maintaining immersion fluid in the gap under the projection lens during wafer exchange in an immersion lithography machine |
US7403264B2 (en) * | 2004-07-08 | 2008-07-22 | Asml Netherlands B.V. | Lithographic projection apparatus and a device manufacturing method using such lithographic projection apparatus |
EP3267257B1 (en) * | 2004-08-03 | 2019-02-13 | Nikon Corporation | Exposure apparatus, exposure method, and method for producing device |
KR101280166B1 (en) * | 2004-11-25 | 2013-06-28 | 가부시키가이샤 니콘 | Mobile body system, exposure apparatus, and method of producing device |
EP1833082A4 (en) * | 2004-12-06 | 2010-03-24 | Nikon Corp | Substrate processing method, exposure method, exposure apparatus, and method for manufacturing device |
US7528931B2 (en) * | 2004-12-20 | 2009-05-05 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP2006190866A (en) * | 2005-01-07 | 2006-07-20 | Nippon Telegr & Teleph Corp <Ntt> | Imprint method |
US7436485B2 (en) * | 2005-04-06 | 2008-10-14 | Asml Netherlands B.V. | Lithographic apparatus, patterning assembly and contamination estimation method |
FR2886377B1 (en) * | 2005-05-31 | 2007-11-23 | Jean Guillot | COMBUSTION DEVICE WITH PREHEATING OF THE COMBUSTION AIR BY THE POSTCOMBUSTION GAS THEY ARE OVERHEATED BY THEIR PASSAGE AT THE HEART OF THE COMBUSTION |
JP2007081070A (en) * | 2005-09-14 | 2007-03-29 | Canon Inc | Processing equipment and method therefor |
US8011915B2 (en) * | 2005-11-04 | 2011-09-06 | Asml Netherlands B.V. | Imprint lithography |
US7670530B2 (en) * | 2006-01-20 | 2010-03-02 | Molecular Imprints, Inc. | Patterning substrates employing multiple chucks |
ATE549294T1 (en) * | 2005-12-09 | 2012-03-15 | Obducat Ab | DEVICE AND METHOD FOR TRANSFER OF PATTERN WITH INTERMEDIATE STAMP |
US7943080B2 (en) * | 2005-12-23 | 2011-05-17 | Asml Netherlands B.V. | Alignment for imprint lithography |
WO2007105645A1 (en) * | 2006-03-13 | 2007-09-20 | Nikon Corporation | Exposure apparatus, maintenance method, exposure method and device manufacturing method |
US7310132B2 (en) * | 2006-03-17 | 2007-12-18 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
CN102298274A (en) * | 2006-05-18 | 2011-12-28 | 株式会社尼康 | Exposure method and apparatus, maintenance method and device manufacturing method |
US8015939B2 (en) * | 2006-06-30 | 2011-09-13 | Asml Netherlands B.V. | Imprintable medium dispenser |
KR20180085820A (en) * | 2006-09-01 | 2018-07-27 | 가부시키가이샤 니콘 | Mobile object driving method, mobile object driving system, pattern forming method and apparatus, exposure method and apparatus, device manufacturing method and calibration method |
US7541603B2 (en) * | 2006-09-27 | 2009-06-02 | Asml Netherlands B.V. | Radiation system and lithographic apparatus comprising the same |
WO2008147175A1 (en) * | 2007-05-25 | 2008-12-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR20100102580A (en) * | 2007-12-17 | 2010-09-24 | 가부시키가이샤 니콘 | Exposure apparatus, exposure method and device manufacturing method |
US20090153832A1 (en) * | 2007-12-18 | 2009-06-18 | Yosuke Tatsuzaki | Apparatus and method for isolating vibrations in a lithography machine using two active control units |
JPWO2009110596A1 (en) * | 2008-03-07 | 2011-07-14 | 昭和電工株式会社 | UV nanoimprint method, resin replica mold and manufacturing method thereof, magnetic recording medium and manufacturing method thereof, and magnetic recording / reproducing apparatus |
NL2003421A (en) * | 2008-10-21 | 2010-04-22 | Asml Netherlands Bv | Lithographic apparatus and a method of removing contamination. |
JP4555896B2 (en) * | 2008-11-27 | 2010-10-06 | パイオニア株式会社 | Transfer method and transfer device |
NL2003871A (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands Bv | Imprint lithography. |
NL2003875A (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands Bv | Imprint lithography method and apparatus. |
JP2010267808A (en) * | 2009-05-14 | 2010-11-25 | Nikon Corp | Aligner, cleaning method, and method of manufacturing device |
JP5149244B2 (en) * | 2009-06-19 | 2013-02-20 | 東京エレクトロン株式会社 | IMPRINT SYSTEM, IMPRINT METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM |
NL2005259A (en) * | 2009-09-29 | 2011-03-30 | Asml Netherlands Bv | Imprint lithography. |
JP5455583B2 (en) * | 2009-11-30 | 2014-03-26 | キヤノン株式会社 | Imprint device |
JP5471514B2 (en) * | 2010-01-28 | 2014-04-16 | ウシオ電機株式会社 | Light processing equipment |
JP2011163839A (en) * | 2010-02-08 | 2011-08-25 | Toshiba Corp | Method and device for inspecting substrate |
JP5697345B2 (en) * | 2010-02-17 | 2015-04-08 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP5469041B2 (en) * | 2010-03-08 | 2014-04-09 | 株式会社日立ハイテクノロジーズ | Fine structure transfer method and apparatus |
JP5754965B2 (en) * | 2011-02-07 | 2015-07-29 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP5647029B2 (en) * | 2011-02-18 | 2014-12-24 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
JP5348156B2 (en) * | 2011-03-01 | 2013-11-20 | ウシオ電機株式会社 | Light irradiation device |
JP5769451B2 (en) * | 2011-03-07 | 2015-08-26 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
KR101388805B1 (en) * | 2011-04-19 | 2014-04-23 | 캐논 가부시끼가이샤 | Imprint apparatus, and article manufacturing method using same |
US10120283B2 (en) * | 2011-06-06 | 2018-11-06 | Nikon Corporation | Illumination method, illumination optical device, and exposure device |
US9263649B2 (en) * | 2011-06-23 | 2016-02-16 | Asahi Kasei E-Materials Corporation | Layered product for fine pattern formation and method of manufacturing layered product for fine pattern formation |
JP6304965B2 (en) * | 2012-08-24 | 2018-04-04 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method using the same |
US9772564B2 (en) * | 2012-11-12 | 2017-09-26 | Nikon Corporation | Exposure apparatus and exposure method, and device manufacturing method |
JP6318534B2 (en) * | 2013-10-09 | 2018-05-09 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
JP6234207B2 (en) * | 2013-12-18 | 2017-11-22 | キヤノン株式会社 | Imprint method, imprint apparatus, and article manufacturing method |
JP6097704B2 (en) * | 2014-01-06 | 2017-03-15 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method |
-
2016
- 2016-09-30 NL NL2017554A patent/NL2017554A/en unknown
- 2016-09-30 WO PCT/EP2016/073380 patent/WO2017084797A1/en active Application Filing
- 2016-09-30 KR KR1020187017414A patent/KR102215539B1/en active IP Right Grant
- 2016-09-30 US US15/775,602 patent/US20180329292A1/en active Pending
- 2016-09-30 EP EP16787344.7A patent/EP3377942B1/en active Active
- 2016-09-30 JP JP2018524329A patent/JP2018534623A/en active Pending
- 2016-09-30 KR KR1020217003543A patent/KR102410381B1/en active IP Right Grant
- 2016-09-30 SG SG10202108028WA patent/SG10202108028WA/en unknown
- 2016-09-30 CN CN202110161152.XA patent/CN112965341A/en active Pending
- 2016-09-30 CN CN201680079692.0A patent/CN108475025B/en active Active
- 2016-09-30 SG SG11201804115UA patent/SG11201804115UA/en unknown
- 2016-11-14 TW TW105137002A patent/TWI732797B/en active
- 2016-11-14 TW TW110120706A patent/TWI773365B/en active
-
2018
- 2018-05-09 IL IL259258A patent/IL259258A/en unknown
-
2020
- 2020-07-31 JP JP2020130282A patent/JP2020197731A/en active Pending
-
2021
- 2021-04-27 JP JP2021075152A patent/JP2021119622A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN112965341A (en) | 2021-06-15 |
KR102215539B1 (en) | 2021-02-16 |
EP3377942A1 (en) | 2018-09-26 |
CN108475025B (en) | 2021-02-26 |
WO2017084797A1 (en) | 2017-05-26 |
TW202136930A (en) | 2021-10-01 |
US20180329292A1 (en) | 2018-11-15 |
KR20210016483A (en) | 2021-02-15 |
CN108475025A (en) | 2018-08-31 |
KR102410381B1 (en) | 2022-06-22 |
KR20180083928A (en) | 2018-07-23 |
NL2017554A (en) | 2017-06-02 |
EP3377942B1 (en) | 2023-12-20 |
SG11201804115UA (en) | 2018-06-28 |
TW201729005A (en) | 2017-08-16 |
JP2020197731A (en) | 2020-12-10 |
TWI773365B (en) | 2022-08-01 |
JP2021119622A (en) | 2021-08-12 |
IL259258A (en) | 2018-07-31 |
TWI732797B (en) | 2021-07-11 |
JP2018534623A (en) | 2018-11-22 |
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