TW200632273A - Electro-hydrodynamic gas flow cooling system - Google Patents
Electro-hydrodynamic gas flow cooling systemInfo
- Publication number
- TW200632273A TW200632273A TW095102631A TW95102631A TW200632273A TW 200632273 A TW200632273 A TW 200632273A TW 095102631 A TW095102631 A TW 095102631A TW 95102631 A TW95102631 A TW 95102631A TW 200632273 A TW200632273 A TW 200632273A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- cooling system
- ehd
- gas flow
- micro
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F25/00—Component parts of trickle coolers
- F28F25/10—Component parts of trickle coolers for feeding gas or vapour
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B19/00—Machines or pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B1/00 - F04B17/00
- F04B19/006—Micropumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B35/00—Piston pumps specially adapted for elastic fluids and characterised by the driving means to their working members, or by combination with, or adaptation to, specific driving engines or motors, not otherwise provided for
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64675005P | 2005-01-24 | 2005-01-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200632273A true TW200632273A (en) | 2006-09-16 |
Family
ID=36293581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095102631A TW200632273A (en) | 2005-01-24 | 2006-01-24 | Electro-hydrodynamic gas flow cooling system |
Country Status (7)
Country | Link |
---|---|
US (1) | US7661468B2 (zh) |
EP (1) | EP1882099A2 (zh) |
JP (1) | JP2008529284A (zh) |
KR (1) | KR20070108880A (zh) |
CN (1) | CN101107444B (zh) |
TW (1) | TW200632273A (zh) |
WO (1) | WO2006079111A2 (zh) |
Families Citing this family (62)
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US7269008B2 (en) * | 2005-06-29 | 2007-09-11 | Intel Corporation | Cooling apparatus and method |
US20100177519A1 (en) * | 2006-01-23 | 2010-07-15 | Schlitz Daniel J | Electro-hydrodynamic gas flow led cooling system |
US7830643B2 (en) * | 2006-01-23 | 2010-11-09 | Igo, Inc. | Power supply with electrostatic cooling fan |
WO2008091905A1 (en) * | 2007-01-23 | 2008-07-31 | Ventiva, Inc. | Contoured electrodes for an electrostatic gas pump |
JP2010516459A (ja) * | 2007-01-24 | 2010-05-20 | ベンティバ・インコーポレイテッド | コロナ電極における粉塵の凝集を防止する方法及び装置 |
US20080302514A1 (en) * | 2007-06-09 | 2008-12-11 | Chien Ouyang | Plasma cooling heat sink |
WO2008153989A1 (en) * | 2007-06-11 | 2008-12-18 | Chien Ouyang | Plasma-driven cooling heat sink |
US7839634B2 (en) * | 2007-08-22 | 2010-11-23 | Chien Ouyang | Micro thrust cooling |
US7837805B2 (en) * | 2007-08-29 | 2010-11-23 | Micron Technology, Inc. | Methods for treating surfaces |
US20090065177A1 (en) * | 2007-09-10 | 2009-03-12 | Chien Ouyang | Cooling with microwave excited micro-plasma and ions |
US20090155090A1 (en) * | 2007-12-18 | 2009-06-18 | Schlitz Daniel J | Auxiliary electrodes for enhanced electrostatic discharge |
US20090168344A1 (en) * | 2007-12-31 | 2009-07-02 | Ploeg Johan F | Thermal device with electrokinetic air flow |
DE102008010944B4 (de) * | 2008-02-25 | 2010-05-20 | Fujitsu Siemens Computers Gmbh | Kühlanordnung mit einem Ionen-Kühlsystem für ein elektronisches Gerät, elektronisches Gerät und Verfahren zur Überwachung einer elektrostatischen Aufladung |
US20090321056A1 (en) * | 2008-03-11 | 2009-12-31 | Tessera, Inc. | Multi-stage electrohydrodynamic fluid accelerator apparatus |
US20090323276A1 (en) * | 2008-06-25 | 2009-12-31 | Mongia Rajiv K | High performance spreader for lid cooling applications |
DE102008040225A1 (de) * | 2008-07-07 | 2010-01-14 | Robert Bosch Gmbh | Kapazitive Vorrichtung und Verfahren zum elektrostatischen Transport dielektrischer und ferroelektrischer Fluide |
US20100005572A1 (en) * | 2008-07-10 | 2010-01-14 | David Vern Chaplin | Thermoelectric crash helmet cooling system with no mechanically moving components or fluids |
US8411435B2 (en) * | 2008-11-10 | 2013-04-02 | Tessera, Inc. | Electrohydrodynamic fluid accelerator with heat transfer surfaces operable as collector electrode |
US8585251B2 (en) | 2008-12-12 | 2013-11-19 | Bridgelux, Inc. | Light emitting diode lamp |
US8585240B2 (en) | 2008-12-12 | 2013-11-19 | Bridgelux, Inc. | Light emitting diode luminaire |
JP5406937B2 (ja) * | 2008-12-15 | 2014-02-05 | コーニンクレッカ フィリップス エヌ ヴェ | 照明器具に対する冷却装置 |
US20100276705A1 (en) * | 2009-07-20 | 2010-11-04 | Bridgelux, Inc. | Solid state lighting device with an integrated fan |
US20110116205A1 (en) * | 2009-09-18 | 2011-05-19 | Ventiva, Inc. | Collector electrodes for an ion wind fan |
TWI391609B (zh) * | 2009-09-28 | 2013-04-01 | Yu Nung Shen | Light emitting diode lighting device |
FR2950545B1 (fr) * | 2009-09-29 | 2012-11-30 | Centre Nat Rech Scient | Dispositif et procede de projection electrostatique d'un liquide, injecteur de carburant incorporant ce dispositif et utilisations de ce dernier |
KR20110037296A (ko) * | 2009-10-06 | 2011-04-13 | 삼성전자주식회사 | 디스플레이장치 |
US20110149252A1 (en) * | 2009-12-21 | 2011-06-23 | Matthew Keith Schwiebert | Electrohydrodynamic Air Mover Performance |
US8274228B2 (en) * | 2009-12-24 | 2012-09-25 | Intel Corporation | Flow tube apparatus |
SG173932A1 (en) * | 2010-02-25 | 2011-09-29 | United Technologies Corp | Repair of a coating on a turbine component |
TWI418972B (zh) * | 2010-04-14 | 2013-12-11 | Acer Inc | 散熱系統與散熱方法 |
US8824142B2 (en) | 2010-05-26 | 2014-09-02 | Panasonic Precision Devices Co., Ltd. | Electrohydrodynamic fluid mover techniques for thin, low-profile or high-aspect-ratio electronic devices |
US8139354B2 (en) | 2010-05-27 | 2012-03-20 | International Business Machines Corporation | Independently operable ionic air moving devices for zonal control of air flow through a chassis |
US8305728B2 (en) | 2010-06-30 | 2012-11-06 | Apple Inc. | Methods and apparatus for cooling electronic devices |
US20120000627A1 (en) * | 2010-06-30 | 2012-01-05 | Tessera, Inc. | Electrostatic precipitator pre-filter for electrohydrodynamic fluid mover |
US20120007742A1 (en) * | 2010-07-09 | 2012-01-12 | Ventiva, Inc. | Consumer electronics device having replaceable ion wind fan |
US8807204B2 (en) * | 2010-08-31 | 2014-08-19 | International Business Machines Corporation | Electrohydrodynamic airflow across a heat sink using a non-planar ion emitter array |
US20120103568A1 (en) * | 2010-10-28 | 2012-05-03 | Tessera, Inc. | Layered Emitter Coating Structure for Crack Resistance with PDAG Coatings |
JP2013544035A (ja) * | 2010-11-10 | 2013-12-09 | テッセラ,インコーポレイテッド | 内部空気プレナムから隔離されたehdエアムーバの通気経路を備えた電子システム |
WO2012064614A1 (en) * | 2010-11-11 | 2012-05-18 | Tessera, Inc. | Electronic system changeable to accommodate an ehd air mover or mechanical air mover |
CN102548188A (zh) * | 2010-12-14 | 2012-07-04 | 联想(北京)有限公司 | 印刷电路板、计算机和散热方法 |
US20120162903A1 (en) * | 2010-12-23 | 2012-06-28 | Macdonald Mark | Electro-hydrodynamic cooling for handheld mobile computing device |
JP2015529396A (ja) * | 2012-08-22 | 2015-10-05 | フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー | Ledヘッドランプ用マイクロチャネルヒートシンク |
US9038407B2 (en) | 2012-10-03 | 2015-05-26 | Hamilton Sundstrand Corporation | Electro-hydrodynamic cooling with enhanced heat transfer surfaces |
GB2514145A (en) * | 2013-05-15 | 2014-11-19 | Intelligent Energy Ltd | Cooling system for fuel cells |
CN103353786B (zh) * | 2013-07-17 | 2016-09-21 | 浙江大学 | 具有自动温控系统的可拆卸线板结构的电晕风散热器 |
CN103487459B (zh) * | 2013-10-15 | 2016-04-06 | 北京大学 | 一种微尺度液冷器散热性能测试系统及其测试方法 |
WO2016041581A1 (en) * | 2014-09-16 | 2016-03-24 | Huawei Technologies Co., Ltd | Method, device and system for cooling |
US20160356556A1 (en) * | 2015-06-02 | 2016-12-08 | University Of Florida Research Foundation, Inc. | Low power cooling and flow inducement |
SE539310C2 (en) * | 2015-06-03 | 2017-06-27 | Rapkap Ab | Microfluidic fan |
SE541352C2 (en) * | 2015-06-03 | 2019-08-13 | Apr Tech Ab | Microfluidic array |
CN105276894A (zh) * | 2015-11-12 | 2016-01-27 | 浙江大学 | 带有固态风扇的半导体制冷模块和包括该模块的冷藏箱 |
EP3551884B1 (en) * | 2017-01-09 | 2020-07-15 | Huawei Technologies Co., Ltd. | Electro hydro dynamic apparatus and system comprising an electro hydro dynamic apparatus |
CN107843617B (zh) * | 2017-12-01 | 2024-05-17 | 中国科学院工程热物理研究所 | 电流体强化对流换热实验系统 |
CN108551079B (zh) * | 2018-06-22 | 2024-02-13 | 嘉兴学院 | 一种离子风高效散热器 |
SE543734C2 (en) * | 2019-03-11 | 2021-07-06 | Apr Tech Ab | Cooling of electronic components with an electrohydrodynamic flow unit |
KR102185943B1 (ko) * | 2019-07-17 | 2020-12-03 | 한국과학기술연구원 | 이온풍을 이용한 열교환기 |
TWI696328B (zh) * | 2019-10-30 | 2020-06-11 | 友達光電股份有限公司 | 離子風扇及顯示裝置 |
CN111256406A (zh) * | 2020-01-20 | 2020-06-09 | 珠海格力电器股份有限公司 | 电磁保鲜结构、电磁保鲜装置及制冷设备 |
CN112604833B (zh) * | 2020-12-14 | 2022-09-13 | 哈尔滨工业大学 | 一种电导泵驱动的电喷液滴辐射散热装置 |
WO2022226245A1 (en) * | 2021-04-23 | 2022-10-27 | Ventiva, Inc. | Heat transfer using ionic pumps |
CN113266541B (zh) * | 2021-05-19 | 2022-05-31 | 上海芯物科技有限公司 | 一种热驱动微型气体泵送器件及泵送器件加工方法 |
WO2023086216A2 (en) * | 2021-10-28 | 2023-05-19 | Worcester Polytechnic Institute | Gravity independent liquid cooling for electronics |
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US3267860A (en) * | 1964-12-31 | 1966-08-23 | Martin M Decker | Electrohydrodynamic fluid pump |
US3872917A (en) * | 1971-04-08 | 1975-03-25 | Inter Probe | Cooling apparatus and method for heat exchangers |
FR2270700B1 (zh) | 1974-05-09 | 1980-01-11 | Breton Jacques | |
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US4210847A (en) * | 1978-12-28 | 1980-07-01 | The United States Of America As Represented By The Secretary Of The Navy | Electric wind generator |
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DE3148380C2 (de) | 1981-12-07 | 1986-09-04 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Ionengenerator zur Erzeugung einer Luftströmung |
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IT1252811B (it) | 1991-10-11 | 1995-06-28 | Proel Tecnologie Spa | Generatore di ioni con camera di ionizzazione costruita o rivestita con materiale ad alto coefficiente di emissione secondaria |
AUPM893094A0 (en) | 1994-10-20 | 1994-11-10 | Shaw, Joshua | Improvements in or in relating to negative air ion generators |
SE505053C2 (sv) * | 1995-04-18 | 1997-06-16 | Strainer Lpb Ab | Anordning för lufttransport och/eller luftrening med hjälp av så kallad jonvind |
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DE19603043C2 (de) | 1996-01-29 | 1997-11-27 | Ibm | Ionenerzeuger für ionographischen Druckkopf und Verfahren zu dessen Herstellung |
DE19621874C2 (de) | 1996-05-31 | 2000-10-12 | Karlsruhe Forschzent | Quelle zur Erzeugung von großflächigen, gepulsten Ionen- und Elektronenstrahlen |
US5769155A (en) * | 1996-06-28 | 1998-06-23 | University Of Maryland | Electrohydrodynamic enhancement of heat transfer |
IL119613A (en) | 1996-11-14 | 1998-12-06 | Riskin Yefim | Method and apparatus for the generation of ions |
WO1999035893A2 (en) * | 1998-01-08 | 1999-07-15 | The University Of Tennessee Research Corporation | Paraelectric gas flow accelerator |
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SE0401749L (sv) | 2004-07-02 | 2006-01-03 | Aureola Swedish Engineering Ab | Anordning och förfarande för att kyla en värmekälla |
WO2006017301A2 (en) | 2004-07-13 | 2006-02-16 | Thorrn Micro Technologies, Inc. | Micro-channel heat sink |
KR100616620B1 (ko) | 2004-09-22 | 2006-08-28 | 삼성전기주식회사 | 이온풍을 이용한 무소음 고효율 방열장치 |
-
2006
- 2006-01-23 JP JP2007552395A patent/JP2008529284A/ja active Pending
- 2006-01-23 CN CN2006800030744A patent/CN101107444B/zh not_active Expired - Fee Related
- 2006-01-23 WO PCT/US2006/002631 patent/WO2006079111A2/en active Application Filing
- 2006-01-23 EP EP06719473A patent/EP1882099A2/en not_active Withdrawn
- 2006-01-23 KR KR1020077019311A patent/KR20070108880A/ko not_active Application Discontinuation
- 2006-01-23 US US11/338,617 patent/US7661468B2/en active Active - Reinstated
- 2006-01-24 TW TW095102631A patent/TW200632273A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006079111B1 (en) | 2007-01-18 |
US20060169441A1 (en) | 2006-08-03 |
JP2008529284A (ja) | 2008-07-31 |
WO2006079111A3 (en) | 2006-11-30 |
CN101107444A (zh) | 2008-01-16 |
CN101107444B (zh) | 2011-06-15 |
WO2006079111A2 (en) | 2006-07-27 |
US7661468B2 (en) | 2010-02-16 |
EP1882099A2 (en) | 2008-01-30 |
KR20070108880A (ko) | 2007-11-13 |
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