TW200632117A - Method of mounting substrate in film deposition apparatus and method of depositing film - Google Patents

Method of mounting substrate in film deposition apparatus and method of depositing film

Info

Publication number
TW200632117A
TW200632117A TW095105918A TW95105918A TW200632117A TW 200632117 A TW200632117 A TW 200632117A TW 095105918 A TW095105918 A TW 095105918A TW 95105918 A TW95105918 A TW 95105918A TW 200632117 A TW200632117 A TW 200632117A
Authority
TW
Taiwan
Prior art keywords
deposition apparatus
film deposition
film
chuck
mounting substrate
Prior art date
Application number
TW095105918A
Other languages
English (en)
Chinese (zh)
Other versions
TWI316968B (fr
Inventor
Tatsuya Kataoka
Kenji Nagao
Kenichi Saito
Original Assignee
Mitsui Shipbuilding Eng
Vieetech Japan Co Ltd
Choshu Industry Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Shipbuilding Eng, Vieetech Japan Co Ltd, Choshu Industry Company Ltd filed Critical Mitsui Shipbuilding Eng
Publication of TW200632117A publication Critical patent/TW200632117A/zh
Application granted granted Critical
Publication of TWI316968B publication Critical patent/TWI316968B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW095105918A 2005-02-23 2006-02-22 Method of mounting substrate in film deposition apparatus and method of depositing film TW200632117A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005047815A JP4609757B2 (ja) 2005-02-23 2005-02-23 成膜装置における基板装着方法

Publications (2)

Publication Number Publication Date
TW200632117A true TW200632117A (en) 2006-09-16
TWI316968B TWI316968B (fr) 2009-11-11

Family

ID=36927387

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105918A TW200632117A (en) 2005-02-23 2006-02-22 Method of mounting substrate in film deposition apparatus and method of depositing film

Country Status (5)

Country Link
JP (1) JP4609757B2 (fr)
KR (1) KR100932140B1 (fr)
CN (1) CN101090996B (fr)
TW (1) TW200632117A (fr)
WO (1) WO2006090749A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400345B (zh) * 2008-04-09 2013-07-01 Ulvac Inc 蒸發源及成膜裝置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010106958A1 (fr) * 2009-03-18 2010-09-23 株式会社アルバック Procédé de positionnement et procédé de dépôt de vapeur
DE102009034532A1 (de) 2009-07-23 2011-02-03 Msg Lithoglas Ag Verfahren zum Herstellen einer strukturierten Beschichtung auf einem Substrat, beschichtetes Substrat sowie Halbzeug mit einem beschichteten Substrat
TWI598377B (zh) 2015-08-20 2017-09-11 大連化學工業股份有限公司 聚碳酸酯二醇及使用該聚碳酸酯二醇製得之熱塑性聚氨酯
CN105762278B (zh) * 2016-03-04 2018-05-01 苏州大学 一种真空蒸镀装置及利用其制备有机电致发光器件的方法
JP6876520B2 (ja) * 2016-06-24 2021-05-26 キヤノントッキ株式会社 基板の挟持方法、基板の挟持装置、成膜方法、成膜装置、及び電子デバイスの製造方法、基板載置方法、アライメント方法、基板載置装置
WO2018211703A1 (fr) * 2017-05-19 2018-11-22 シャープ株式会社 Procédé de dépôt en phase vapeur, appareil de dépôt en phase vapeur, appareil de production de dispositif électroluminescent et procédé de production de dispositif électroluminescent
JP6468540B2 (ja) * 2017-05-22 2019-02-13 キヤノントッキ株式会社 基板搬送機構、基板載置機構、成膜装置及びそれらの方法
JP2024037209A (ja) * 2022-09-07 2024-03-19 キヤノントッキ株式会社 成膜装置、成膜装置の駆動方法及び成膜方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051375A (ja) * 1991-06-25 1993-01-08 Canon Inc 真空処理装置
JP3516346B2 (ja) * 1992-09-08 2004-04-05 大日本印刷株式会社 スパッタ用治具
JPH1046339A (ja) * 1996-07-29 1998-02-17 Matsushita Electric Ind Co Ltd 基板ハンドリング方法
JP2004183044A (ja) * 2002-12-03 2004-07-02 Seiko Epson Corp マスク蒸着方法及び装置、マスク及びマスクの製造方法、表示パネル製造装置、表示パネル並びに電子機器
JP2004303559A (ja) * 2003-03-31 2004-10-28 Tohoku Pioneer Corp アライメント装置及び方法、並びにこれを用いて製造される有機ｅｌ素子

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400345B (zh) * 2008-04-09 2013-07-01 Ulvac Inc 蒸發源及成膜裝置

Also Published As

Publication number Publication date
JP2006233259A (ja) 2006-09-07
WO2006090749A1 (fr) 2006-08-31
CN101090996A (zh) 2007-12-19
JP4609757B2 (ja) 2011-01-12
TWI316968B (fr) 2009-11-11
CN101090996B (zh) 2010-05-26
KR100932140B1 (ko) 2009-12-16
KR20070087080A (ko) 2007-08-27

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