TW200632062A - Solvent-free silicone adhesive composition - Google Patents

Solvent-free silicone adhesive composition

Info

Publication number
TW200632062A
TW200632062A TW094143184A TW94143184A TW200632062A TW 200632062 A TW200632062 A TW 200632062A TW 094143184 A TW094143184 A TW 094143184A TW 94143184 A TW94143184 A TW 94143184A TW 200632062 A TW200632062 A TW 200632062A
Authority
TW
Taiwan
Prior art keywords
adhesive composition
silicone adhesive
solvent
free silicone
molecule
Prior art date
Application number
TW094143184A
Other languages
English (en)
Chinese (zh)
Other versions
TWI374173B (cg-RX-API-DMAC7.html
Inventor
Shunji Aoki
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200632062A publication Critical patent/TW200632062A/zh
Application granted granted Critical
Publication of TWI374173B publication Critical patent/TWI374173B/zh

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
TW094143184A 2004-12-08 2005-12-07 Solvent-free silicone adhesive composition TW200632062A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004355880A JP4761020B2 (ja) 2004-12-08 2004-12-08 無溶剤型シリコーン粘着剤組成物

Publications (2)

Publication Number Publication Date
TW200632062A true TW200632062A (en) 2006-09-16
TWI374173B TWI374173B (cg-RX-API-DMAC7.html) 2012-10-11

Family

ID=36663305

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143184A TW200632062A (en) 2004-12-08 2005-12-07 Solvent-free silicone adhesive composition

Country Status (2)

Country Link
JP (1) JP4761020B2 (cg-RX-API-DMAC7.html)
TW (1) TW200632062A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479003B (zh) * 2007-03-05 2015-04-01 Shinetsu Chemical Co 用於薄膜之無溶劑聚矽氧剝離劑組成物及使用其之剝離膜
CN113302255A (zh) * 2018-12-13 2021-08-24 陶氏东丽株式会社 有机硅压敏粘接剂组合物及其用途

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI440682B (zh) * 2007-03-30 2014-06-11 Shinetsu Chemical Co 無溶劑型聚矽氧感壓接著劑組成物
JP5060873B2 (ja) 2007-08-24 2012-10-31 東レ・ダウコーニング株式会社 シリコーン系感圧接着剤組成物および感圧接着テープもしくはシート
JP5292835B2 (ja) * 2008-02-01 2013-09-18 大日本印刷株式会社 サインフィルム
JP5234064B2 (ja) 2010-08-23 2013-07-10 信越化学工業株式会社 無溶剤型付加型シリコーン粘着剤組成物及び粘着性物品
KR101267776B1 (ko) * 2010-11-10 2013-05-24 (주)엘지하우시스 재박리성 및 상용성이 우수한 윈도우 필름용 실리콘계 점착제 조성물 및 이를 이용한 윈도우 필름
JP2014205762A (ja) * 2013-04-12 2014-10-30 信越化学工業株式会社 無溶剤型シリコーン粘着剤組成物及び粘着性物品
JP6024638B2 (ja) * 2013-10-10 2016-11-16 信越化学工業株式会社 シリコーン粘着剤組成物、密着向上剤の製造方法及び粘着性物品
JPWO2017065131A1 (ja) * 2015-10-14 2018-08-09 信越化学工業株式会社 衝撃吸収性画面保護フィルム
JP6657037B2 (ja) * 2015-12-22 2020-03-04 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物および半導体装置
EP3473675A1 (en) 2015-12-22 2019-04-24 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone resin composition and a semiconductor device
KR102479137B1 (ko) * 2017-09-29 2022-12-20 다우 실리콘즈 코포레이션 열 전도성 조성물
GB2574440A (en) 2018-06-06 2019-12-11 Advanced Insulation Ltd Tie coat
US20210246337A1 (en) 2018-06-29 2021-08-12 Dow Silicones Corporation Solventless silicone pressure sensitive adhesive and methods for making and using same
KR102757568B1 (ko) 2018-12-13 2025-01-22 다우 도레이 캄파니 리미티드 실리콘 점착제 조성물 및 그 용도
CN116507428A (zh) 2020-12-25 2023-07-28 陶氏东丽株式会社 有机硅粘合剂组合物以及其用途
CN119684965B (zh) * 2024-12-13 2025-11-11 江苏皇冠新材料科技有限公司 可用于纸基涂布的有机硅压敏胶组合物、压敏胶及其制品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5082706A (en) * 1988-11-23 1992-01-21 Dow Corning Corporation Pressure sensitive adhesive/release liner laminate
US5292586A (en) * 1991-03-26 1994-03-08 General Electric Company Solventless or high solids-containing silicone pressure sensitive adhesive compositions
JP2734809B2 (ja) * 1991-05-09 1998-04-02 信越化学工業株式会社 シリコーン粘着剤組成物
US5357007A (en) * 1993-03-12 1994-10-18 General Electric Company Method for making a solventless silicone pressure sensitive adhesive composition and product
JP2002285129A (ja) * 2001-03-23 2002-10-03 Shin Etsu Chem Co Ltd シリコーン感圧接着剤組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI479003B (zh) * 2007-03-05 2015-04-01 Shinetsu Chemical Co 用於薄膜之無溶劑聚矽氧剝離劑組成物及使用其之剝離膜
CN113302255A (zh) * 2018-12-13 2021-08-24 陶氏东丽株式会社 有机硅压敏粘接剂组合物及其用途

Also Published As

Publication number Publication date
JP4761020B2 (ja) 2011-08-31
TWI374173B (cg-RX-API-DMAC7.html) 2012-10-11
JP2006160923A (ja) 2006-06-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees