TW200631981A - The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices - Google Patents

The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices

Info

Publication number
TW200631981A
TW200631981A TW095104251A TW95104251A TW200631981A TW 200631981 A TW200631981 A TW 200631981A TW 095104251 A TW095104251 A TW 095104251A TW 95104251 A TW95104251 A TW 95104251A TW 200631981 A TW200631981 A TW 200631981A
Authority
TW
Taiwan
Prior art keywords
resin
group
resin composition
devices
electronic parts
Prior art date
Application number
TW095104251A
Other languages
English (en)
Other versions
TWI320416B (zh
Inventor
Shinya Nakamura
Tomoya Masuda
Mitsuo Katayose
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200631981A publication Critical patent/TW200631981A/zh
Application granted granted Critical
Publication of TWI320416B publication Critical patent/TWI320416B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/302—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4261—Macromolecular compounds obtained by reactions involving only unsaturated carbon-to-carbon bindings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
TW095104251A 2005-02-18 2006-02-08 The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices TW200631981A (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005042131 2005-02-18
JP2005042117 2005-02-18
JP2005042108 2005-02-18
JP2005321439 2005-11-04

Publications (2)

Publication Number Publication Date
TW200631981A true TW200631981A (en) 2006-09-16
TWI320416B TWI320416B (zh) 2010-02-11

Family

ID=36916317

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104251A TW200631981A (en) 2005-02-18 2006-02-08 The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices

Country Status (6)

Country Link
US (1) US8013052B2 (zh)
JP (2) JP5592054B2 (zh)
KR (1) KR100941538B1 (zh)
CN (1) CN101124233B (zh)
TW (1) TW200631981A (zh)
WO (1) WO2006087906A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4952131B2 (ja) * 2005-08-23 2012-06-13 日立化成工業株式会社 エポキシ樹脂の硬化剤、エポキシ樹脂の硬化剤の製造方法、エポキシ樹脂組成物及び電子部品装置
ITMI20061766A1 (it) * 2006-09-15 2008-03-16 N P T S R L Prepolimeri silano-terminati e relativi formulati adesivo-sigillanti
EP2063471B1 (en) * 2007-11-26 2012-10-03 Hitachi Ltd. Organic field effect transistor
SG157237A1 (en) * 2008-05-13 2009-12-29 Sumitomo Bakelite Singapore Pte Ltd A curable composition
KR20130061132A (ko) 2010-04-16 2013-06-10 발스파 소싱 인코포레이티드 패키징 용품을 위한 코팅 조성물 및 코팅 방법
KR101156581B1 (ko) * 2010-04-27 2012-06-20 대주전자재료 주식회사 에폭시 수지 조성물 및 이로써 피복된 발광 반도체 소자
BR112013020026B1 (pt) 2011-02-07 2021-03-02 Swimc Llc artigo, composição de revestimento, e, método
EP2751161B1 (en) * 2011-08-31 2018-09-19 Huntsmann Advanced Materials Licensing (Switzerland) GmbH Process for the impregnation of air core reactors, impregnated air core reactor and use of an impregnation system
WO2014025411A1 (en) 2012-08-09 2014-02-13 Valspar Sourcing, Inc. Container coating system
ES2849526T3 (es) 2012-08-09 2021-08-19 Swimc Llc Composiciones para contenedores y otros artículos y métodos de utilización de los mismos
US8753021B1 (en) * 2013-02-12 2014-06-17 Corning Cable Systems Llc Adhesives for securing optical fibers to ferrules of optical connectors and methods for use thereof
KR101664948B1 (ko) 2014-01-09 2016-10-13 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
WO2015105379A1 (ko) * 2014-01-09 2015-07-16 한국생산기술연구원 알콕시실릴기를 갖는 새로운 노볼락 경화제, 이의 제조 방법, 이를 포함하는 조성물, 경화물 및 이의 용도
EP3131965B1 (en) 2014-04-14 2024-06-12 Swimc Llc Methods of preparing compositions for containers and other articles and methods of using same
WO2016003986A1 (en) * 2014-07-03 2016-01-07 3M Innovative Properties Company Quantum dot article with reduced edge ingress and improved color stability
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
JP7259783B2 (ja) * 2020-02-27 2023-04-18 味の素株式会社 樹脂組成物
JP7552931B2 (ja) 2022-03-25 2024-09-18 住友ベークライト株式会社 封止用樹脂組成物および片面封止構造体の製造方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE553340A (zh) * 1956-03-17
US3461095A (en) * 1964-04-09 1969-08-12 Dow Corning Extracoordinate silicone complexes as curing agents for epoxy resins
NL130773C (zh) * 1964-04-09
US3465020A (en) * 1967-08-21 1969-09-02 Dow Corning Heterocyclic silicon compounds
FR1543493A (fr) * 1967-09-15 1968-10-25 Rhone Poulenc Sa Nouvelles compositions organosiliciques vulcanisables en élastomères
DE1769713A1 (de) * 1968-07-02 1971-07-01 Hoechst Ag Thermoplastische Formmassen auf Basis gesaettigter Polyester
US4055546A (en) * 1971-10-29 1977-10-25 Hitachi Chemical Company, Ltd. Novel thermosetting resins and process for preparing the same
FR2222403B1 (zh) * 1973-03-21 1977-02-11 Rhone Poulenc Ind
US4198498A (en) * 1978-11-21 1980-04-15 General Electric Company Tris[poly(aryloxysiloxane)] polymers
US4307212A (en) * 1980-08-14 1981-12-22 General Electric Company Curable epoxy resins
JPS5852350A (ja) * 1981-09-21 1983-03-28 Toray Silicone Co Ltd プライマ−組成物
US4503243A (en) * 1983-01-12 1985-03-05 Eisai Co., Ltd. Dioxasilepin and dioxasilocin stabilizers
JPS59170157A (ja) * 1983-03-18 1984-09-26 Toray Silicone Co Ltd プライマ−組成物
DE3327795A1 (de) * 1983-08-02 1985-02-21 Dynamit Nobel Ag, 5210 Troisdorf Cyclische phenolorganosilane und verfahren zu deren herstellung
US4775497A (en) * 1986-10-24 1988-10-04 Ciba-Geigy Corporation Esterification process with calcium hydroxyaryl phosphonate-organosilicon heterocycle catalyst system
JP2559597B2 (ja) * 1987-09-08 1996-12-04 関西ペイント株式会社 生物付着防止方法
DE3736990A1 (de) * 1987-10-31 1989-05-11 Bayer Ag 1,7,9,15-tetraoxa-4,12-diaza-8-silaspiro- (7.7) -pentadecane, verfahren zu ihrer herstellung und ihre verwendung
US5019607A (en) * 1989-11-01 1991-05-28 Eastman Kodak Company Modified epoxy resins and composites
EP0594175B1 (en) * 1992-10-23 1997-06-18 Mitsubishi Chemical Corporation Process for producing aromatic polycarbonate
EP0671450B1 (en) * 1993-09-29 2002-08-21 Nippon Shokubai Co., Ltd. Use of a surface treatment composition for coatings reducing the permeability for gases
US5834551A (en) * 1994-06-10 1998-11-10 Dainippon Ink And Chemicals, Inc. Composite of thermosetting resin with metallic oxide and process for the preparation thereof
KR100591698B1 (ko) 1999-01-29 2006-06-20 아라까와 가가꾸 고교 가부시끼가이샤 에폭시 수지용 경화제, 에폭시 수지 조성물 및 실란변성페놀 수지의 제조법
JP3395744B2 (ja) 1999-01-29 2003-04-14 荒川化学工業株式会社 エポキシ樹脂用硬化剤およびエポキシ樹脂組成物
US6525160B1 (en) * 1999-06-17 2003-02-25 Arakawa Chemical Industries Ltd. Epoxy resin composition and process for producing silane-modified epoxy resin
JP3468195B2 (ja) 1999-06-17 2003-11-17 荒川化学工業株式会社 エポキシ樹脂組成物
JP3468291B2 (ja) 2000-04-10 2003-11-17 荒川化学工業株式会社 アルコキシ基含有シラン変性フェノール樹脂、樹脂組成物、エポキシ樹脂硬化剤及び有機・無機ハイブリッド体。
US6506868B1 (en) * 1999-07-15 2003-01-14 Arakawa Chemical Industries, Ltd. Partial condensate of glycidyl ether group-containing alkoxysilane, silane-modified resin, compositions thereof and preparation methods thereof
US6423416B1 (en) * 2000-03-03 2002-07-23 Dow Corning Corporation Barrier coating compositions from bis-aminosilanes and phenolic compounds
JP2001261776A (ja) * 2000-03-24 2001-09-26 Matsushita Electric Works Ltd プリント配線板用絶縁材料
GB0023089D0 (en) * 2000-09-20 2000-11-01 Eastman Kodak Co Photographic element dye-forming coupler and stabilizing compound
JP3570380B2 (ja) 2000-12-22 2004-09-29 荒川化学工業株式会社 メトキシ基含有シラン変性エポキシ樹脂、その製造法、エポキシ樹脂組成物およびその硬化物
JP4948716B2 (ja) * 2001-06-29 2012-06-06 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物
JP4244777B2 (ja) 2002-10-18 2009-03-25 日立化成工業株式会社 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法
US7291684B2 (en) * 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
JP4367046B2 (ja) * 2003-07-30 2009-11-18 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP4163162B2 (ja) * 2003-08-29 2008-10-08 住友ベークライト株式会社 エポキシ樹脂用潜伏性触媒、エポキシ樹脂組成物および半導体装置

Also Published As

Publication number Publication date
JP5937794B2 (ja) 2016-06-22
JP5592054B2 (ja) 2014-09-17
US8013052B2 (en) 2011-09-06
US20090023855A1 (en) 2009-01-22
CN101124233A (zh) 2008-02-13
KR100941538B1 (ko) 2010-02-10
JPWO2006087906A1 (ja) 2008-07-03
KR20070114164A (ko) 2007-11-29
JP2011195841A (ja) 2011-10-06
CN101124233B (zh) 2012-12-05
WO2006087906A1 (ja) 2006-08-24
TWI320416B (zh) 2010-02-11

Similar Documents

Publication Publication Date Title
TW200631981A (en) The novel curable resin, the method of manufacturing the same, the epoxy resin composition and the electronic parts/devices
TW200736291A (en) Epoxy resin composition for encapsulation and electronic component device
MY144113A (en) Resin composition for semiconductor encapsulation and semiconductor device
TW200602374A (en) Encapsulation epoxy resin material and electronic component
TW200715060A (en) Curable resin composition, cured article using the same and various object derived thereof
PL2119737T3 (pl) Opakowanie na Elementy Elektroniczne
EP2805977A3 (en) Thermosetting resin composition
MY144047A (en) Epoxy resin composition, process for providing latency to the composition and a semiconductor device
TW200801110A (en) Resin composition for semiconductor encapsulation and semiconductor device
WO2009069491A1 (ja) 塩素含有樹脂用安定剤及び塩素含有樹脂組成物
WO2008143085A1 (ja) 半導体封止用エポキシ樹脂組成物およびそれを用いて得られる半導体装置
TW200643100A (en) Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component
TW200801062A (en) Epoxy resin molding material for sealing and device of electronic part
TW200734377A (en) Phenol resin and resin composition
TW200740870A (en) Epoxy resin composition for encapsulating semiconductor and semiconductor device
TW200722453A (en) Thermosetting resin composition
MY156450A (en) Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
MY138699A (en) Epoxy compound, preparation method thereof, and use thereof
TW200833728A (en) Epoxy resin, phenol resin, their production methods, epoxy resin composition and cured product
TW200631979A (en) Curing accelerator, curable resin composition, and electronic part/device
TW200500412A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
MY142389A (en) Biphenylaralkyl epoxy and phenolic resins
WO2009011335A1 (ja) 半導体封止用エポキシ樹脂組成物および半導体装置
MY133799A (en) Thermosetting resin composition
WO2009063708A1 (ja) 樹脂組成物および樹脂成形品