TW200629270A - Programmable phase-change memory and method therefor - Google Patents

Programmable phase-change memory and method therefor

Info

Publication number
TW200629270A
TW200629270A TW094143688A TW94143688A TW200629270A TW 200629270 A TW200629270 A TW 200629270A TW 094143688 A TW094143688 A TW 094143688A TW 94143688 A TW94143688 A TW 94143688A TW 200629270 A TW200629270 A TW 200629270A
Authority
TW
Taiwan
Prior art keywords
contiguous layer
phase change
electrical current
change material
region
Prior art date
Application number
TW094143688A
Other languages
English (en)
Inventor
Hans Marc Bert Boeve
Nicolaas Lambert
Victor Martinus Gerardus Acht
Karen Attenborough
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200629270A publication Critical patent/TW200629270A/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/80Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
    • H10B63/82Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays the switching components having a common active material layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/823Device geometry adapted for essentially horizontal current flow, e.g. bridge type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/861Thermal details
    • H10N70/8613Heating or cooling means other than resistive heating electrodes, e.g. heater in parallel
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides

Landscapes

  • Semiconductor Memories (AREA)
TW094143688A 2004-12-13 2005-12-09 Programmable phase-change memory and method therefor TW200629270A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US59312904P 2004-12-13 2004-12-13

Publications (1)

Publication Number Publication Date
TW200629270A true TW200629270A (en) 2006-08-16

Family

ID=36228712

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143688A TW200629270A (en) 2004-12-13 2005-12-09 Programmable phase-change memory and method therefor

Country Status (8)

Country Link
US (2) US8208293B2 (zh)
EP (1) EP1829110B1 (zh)
JP (1) JP2008523605A (zh)
KR (1) KR20070087098A (zh)
CN (1) CN101185167A (zh)
AT (1) ATE545957T1 (zh)
TW (1) TW200629270A (zh)
WO (1) WO2006064441A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1829110B1 (en) * 2004-12-13 2012-02-15 Nxp B.V. Programmable phase-change memory and method therefor
JP4625822B2 (ja) 2007-03-16 2011-02-02 株式会社東芝 半導体記憶装置及びその製造方法
US20090180313A1 (en) * 2008-01-15 2009-07-16 Wim Deweerd Chalcogenide anti-fuse
KR101007562B1 (ko) * 2008-05-20 2011-01-14 주식회사 하이닉스반도체 저항성 메모리 소자 및 그 제조 방법
CN110335941B (zh) * 2019-07-03 2023-08-18 芯盟科技有限公司 相变存储器的结构及其形成方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4845533A (en) 1986-08-22 1989-07-04 Energy Conversion Devices, Inc. Thin film electrical devices with amorphous carbon electrodes and method of making same
US5166758A (en) 1991-01-18 1992-11-24 Energy Conversion Devices, Inc. Electrically erasable phase change memory
US6172902B1 (en) * 1998-08-12 2001-01-09 Ecole Polytechnique Federale De Lausanne (Epfl) Non-volatile magnetic random access memory
WO2003073512A1 (en) 2002-02-22 2003-09-04 Ovonyx, Inc. Single level metal memory cell using chalcogenide cladding
US6707087B2 (en) * 2002-06-21 2004-03-16 Hewlett-Packard Development Company, L.P. Structure of chalcogenide memory element
US6766264B2 (en) 2002-08-02 2004-07-20 Sun Microsystems, Inc. Method and apparatus for calibrating parameters to be used in a digital circuit simulation
US6850432B2 (en) * 2002-08-20 2005-02-01 Macronix International Co., Ltd. Laser programmable electrically readable phase-change memory method and device
KR100491978B1 (ko) * 2003-04-12 2005-05-27 한국전자통신연구원 저 전력 동작이 가능한 상변화 메모리 소자 및 그 제조 방법
JP4634014B2 (ja) * 2003-05-22 2011-02-16 株式会社日立製作所 半導体記憶装置
KR100504700B1 (ko) * 2003-06-04 2005-08-03 삼성전자주식회사 고집적 상변환 램
EP1829110B1 (en) * 2004-12-13 2012-02-15 Nxp B.V. Programmable phase-change memory and method therefor

Also Published As

Publication number Publication date
WO2006064441A2 (en) 2006-06-22
CN101185167A (zh) 2008-05-21
US20120230100A1 (en) 2012-09-13
JP2008523605A (ja) 2008-07-03
US20100039856A1 (en) 2010-02-18
US8208293B2 (en) 2012-06-26
US8503226B2 (en) 2013-08-06
WO2006064441A3 (en) 2006-11-16
KR20070087098A (ko) 2007-08-27
EP1829110A2 (en) 2007-09-05
ATE545957T1 (de) 2012-03-15
EP1829110B1 (en) 2012-02-15

Similar Documents

Publication Publication Date Title
TW200711120A (en) Phase change memory with reduced programming current
SG136797A1 (en) Lateral phase change memory and method therefor
DE602006016864D1 (de) Vertikale phasenwechsel-speicherzelle und herstellungsverfahren dafür
AU2003288186A1 (en) Heating device comprising an electrode for the conductive heating of melts
ATE497260T1 (de) Dielektrische antifuse für eine elektrothermisch programmierbare vorrichtung
DE602006003098D1 (de) Verfahren zum regeln des zuerst schmelzenden bereihtungen
TW200629270A (en) Programmable phase-change memory and method therefor
TW200709481A (en) Phase change memory cell and method of formation
DE69927966D1 (de) Hochtemperatur-, mehrschicht-, legierungsheizanordnung
AU2003239249A8 (en) Phase change memory and manufacturing method therefor
MY135719A (en) Forming phase change memories
WO2008078197A3 (en) Method for controlled formation of the resistive switching material in a resistive switching device and devices obtained thereof
TWI263365B (en) Multilayered phase change memory
TW200625544A (en) Phase change memory device and method of manufacturing
AU2003216351A1 (en) Temperature control pads with integral electrodes
ATE547814T1 (de) Phasenänderungsstromdichte-steuerstruktur
MXPA03000408A (es) Material de electrodo de hidroxido de niquel y metodo para fabricar el mismo.
WO2008027135A3 (en) Self-aligned, planar phase change memory elements and devices, systems employing the same and methods of forming the same
EP1617467A4 (en) METHOD FOR MANUFACTURING DIELECTRIC INSULATING THIN FILM AND DIELECTRIC INSULATING MATERIAL
EP1953842A3 (en) Phase change memory device and method for fabricating the same
AU2001284445A1 (en) Electrode material for electrochemical element and method for production thereof, and electrochemical element
MXPA03007041A (es) Metodo de fabricacion de material de cambio de fase, casi incompresible, fluidizado bajo corte y con baja conductividad termica.
DE602006004729D1 (de) Verfahren zum regeln des zuerst schmelzenden bereihtungen
PL376962A1 (pl) Ogrzewanie oporowe
TW200644171A (en) Using conductive oxidation for phase change memory electrodes