TW200627668A - A light-emitting device - Google Patents

A light-emitting device

Info

Publication number
TW200627668A
TW200627668A TW094102193A TW94102193A TW200627668A TW 200627668 A TW200627668 A TW 200627668A TW 094102193 A TW094102193 A TW 094102193A TW 94102193 A TW94102193 A TW 94102193A TW 200627668 A TW200627668 A TW 200627668A
Authority
TW
Taiwan
Prior art keywords
light
layer
emitting device
transparent adhesive
adhesive layer
Prior art date
Application number
TW094102193A
Other languages
English (en)
Other versions
TWI330413B (en
Inventor
Min-Hsun Hsieh
Ta-Cheng Hsu
Wei-Chih Peng
Ya-Ju Lee
Original Assignee
Epistar Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36686550&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200627668(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Epistar Corp filed Critical Epistar Corp
Priority to TW094102193A priority Critical patent/TWI330413B/zh
Priority to US11/326,750 priority patent/US7489068B2/en
Priority to KR1020060005283A priority patent/KR101059992B1/ko
Priority to DE102006002683.7A priority patent/DE102006002683B4/de
Priority to JP2006014122A priority patent/JP5008308B2/ja
Publication of TW200627668A publication Critical patent/TW200627668A/zh
Priority to US11/893,220 priority patent/US8063557B2/en
Application granted granted Critical
Publication of TWI330413B publication Critical patent/TWI330413B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
TW094102193A 2003-07-04 2005-01-25 A light-emitting device TWI330413B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW094102193A TWI330413B (en) 2005-01-25 2005-01-25 A light-emitting device
US11/326,750 US7489068B2 (en) 2005-01-25 2006-01-06 Light emitting device
KR1020060005283A KR101059992B1 (ko) 2005-01-25 2006-01-18 발광 소자
DE102006002683.7A DE102006002683B4 (de) 2005-01-25 2006-01-19 Licht emittierendes Bauteil
JP2006014122A JP5008308B2 (ja) 2005-01-25 2006-01-23 発光装置
US11/893,220 US8063557B2 (en) 2003-07-04 2007-08-14 Light-emitting device having wavelength-converting materials therewithin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094102193A TWI330413B (en) 2005-01-25 2005-01-25 A light-emitting device

Publications (2)

Publication Number Publication Date
TW200627668A true TW200627668A (en) 2006-08-01
TWI330413B TWI330413B (en) 2010-09-11

Family

ID=36686550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102193A TWI330413B (en) 2003-07-04 2005-01-25 A light-emitting device

Country Status (5)

Country Link
US (1) US7489068B2 (zh)
JP (1) JP5008308B2 (zh)
KR (1) KR101059992B1 (zh)
DE (1) DE102006002683B4 (zh)
TW (1) TWI330413B (zh)

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US8063557B2 (en) * 2003-07-04 2011-11-22 Epistar Corporation Light-emitting device having wavelength-converting materials therewithin
DE102005055293A1 (de) * 2005-08-05 2007-02-15 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterchips und Dünnfilm-Halbleiterchip
DE102007004303A1 (de) 2006-08-04 2008-02-07 Osram Opto Semiconductors Gmbh Dünnfilm-Halbleiterbauelement und Bauelement-Verbund
DE102007004302A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Halbleiterchip und Verfahren zur Herstellung eines Halbleiterchips
US9318327B2 (en) * 2006-11-28 2016-04-19 Cree, Inc. Semiconductor devices having low threading dislocations and improved light extraction and methods of making the same
DE102007004304A1 (de) * 2007-01-29 2008-07-31 Osram Opto Semiconductors Gmbh Dünnfilm-Leuchtdioden-Chip und Verfahren zur Herstellung eines Dünnfilm-Leuchtdioden-Chips
US20080277682A1 (en) * 2007-03-29 2008-11-13 The Regents Of The University Of California Dual surface-roughened n-face high-brightness led
EP2017898A1 (en) * 2007-07-17 2009-01-21 Vishay Israel Ltd. Semiconductor light-emitting device and method for the manufacture thereof
KR101449000B1 (ko) * 2007-09-06 2014-10-13 엘지이노텍 주식회사 반도체 발광소자 및 그 제조방법
DE102007063957B3 (de) * 2007-09-28 2022-10-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlung emittierender Halbleiterchip
TWI349221B (en) * 2008-02-05 2011-09-21 Au Optronics Corp Sensing structure of a display
US10147843B2 (en) 2008-07-24 2018-12-04 Lumileds Llc Semiconductor light emitting device including a window layer and a light-directing structure
US20120056228A1 (en) * 2010-09-07 2012-03-08 Phostek, Inc. Led chip modules, method for packaging the led chip modules, and moving fixture thereof
JP2012199231A (ja) 2011-03-04 2012-10-18 Semiconductor Energy Lab Co Ltd 表示装置
KR101104645B1 (ko) * 2011-03-25 2012-01-16 (주)세미머티리얼즈 발광 소자 및 그의 제조 방법
CN103858243A (zh) * 2011-08-30 2014-06-11 皇家飞利浦有限公司 将衬底接合到半导体发光器件的方法
DE102012003638A1 (de) * 2012-02-24 2013-08-29 Limo Patentverwaltung Gmbh & Co. Kg Leuchtdiode
KR101662202B1 (ko) * 2013-10-01 2016-10-04 광주과학기술원 발광 다이오드
JP6387780B2 (ja) * 2013-10-28 2018-09-12 日亜化学工業株式会社 発光装置及びその製造方法
KR20160024170A (ko) 2014-08-25 2016-03-04 삼성전자주식회사 반도체 발광 소자
US11543083B2 (en) 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11073248B2 (en) * 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11690148B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
KR101913855B1 (ko) * 2015-03-04 2018-11-23 제이디엠 주식회사 투명 인쇄회로기판과 이의 제조방법 및 이를 이용한 ｌｅｄ 모듈
JP6668608B2 (ja) * 2015-04-27 2020-03-18 日亜化学工業株式会社 発光装置の製造方法
JP2017147364A (ja) * 2016-02-18 2017-08-24 株式会社東芝 半導体モジュール
WO2018038927A1 (en) * 2016-08-26 2018-03-01 The Penn State Research Foundation High light-extraction efficiency (lee) light-emitting diode (led)
JP2018148094A (ja) * 2017-03-07 2018-09-20 株式会社ディスコ 発光ダイオードチップの製造方法及び発光ダイオードチップ
JP2019212875A (ja) * 2018-06-08 2019-12-12 信越半導体株式会社 発光素子及び発光素子の製造方法
KR102325791B1 (ko) * 2019-12-05 2021-11-12 웨이브로드 주식회사 반도체 발광소자
JP7011195B2 (ja) * 2020-02-27 2022-01-26 日亜化学工業株式会社 発光装置
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
JP7354943B2 (ja) 2020-07-03 2023-10-03 信越半導体株式会社 接合型半導体受光素子及び接合型半導体受光素子の製造方法
JP7413941B2 (ja) 2020-07-03 2024-01-16 信越半導体株式会社 接合型半導体素子及び接合型半導体素子の製造方法
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

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JP2836687B2 (ja) * 1993-04-03 1998-12-14 日亜化学工業株式会社 窒化ガリウム系化合物半導体発光素子
EP0977280A3 (en) 1998-07-28 2008-11-26 Interuniversitair Micro-Elektronica Centrum Vzw Devices for emitting radiation with a high efficiency and a method for fabricating such devices
JP3758390B2 (ja) * 1998-12-14 2006-03-22 パイオニア株式会社 窒化物半導体発光素子及びその製造方法
EP1234344B1 (en) * 1999-12-03 2020-12-02 Cree, Inc. Enhanced light extraction in leds through the use of internal and external optical elements
JP3893874B2 (ja) * 1999-12-21 2007-03-14 日亜化学工業株式会社 窒化物半導体発光素子の製造方法
TW465123B (en) * 2000-02-02 2001-11-21 Ind Tech Res Inst High power white light LED
US6693352B1 (en) 2000-06-05 2004-02-17 Emitronix Inc. Contact structure for group III-V semiconductor devices and method of producing the same
TW472400B (en) * 2000-06-23 2002-01-11 United Epitaxy Co Ltd Method for roughing semiconductor device surface to increase the external quantum efficiency
US20020017652A1 (en) 2000-08-08 2002-02-14 Stefan Illek Semiconductor chip for optoelectronics
US6703780B2 (en) * 2001-01-16 2004-03-09 General Electric Company Organic electroluminescent device with a ceramic output coupler and method of making the same
EP1225643A1 (en) 2001-01-23 2002-07-24 Interuniversitair Microelektronica Centrum Vzw High efficiency unilateral light emitting device and method for fabricating such device
TW544958B (en) 2002-07-15 2003-08-01 Epistar Corp Light emitting diode with an adhesive layer and its manufacturing method
JP4121551B2 (ja) * 2002-10-23 2008-07-23 信越半導体株式会社 発光素子の製造方法及び発光素子
JP2004235505A (ja) * 2003-01-31 2004-08-19 Shin Etsu Handotai Co Ltd 発光素子及び半導体素子用オーミック電極構造
TW571449B (en) 2002-12-23 2004-01-11 Epistar Corp Light-emitting device having micro-reflective structure
TW579610B (en) * 2003-01-30 2004-03-11 Epistar Corp Nitride light-emitting device having adhered reflective layer

Also Published As

Publication number Publication date
DE102006002683B4 (de) 2019-10-17
DE102006002683A1 (de) 2006-08-03
US7489068B2 (en) 2009-02-10
US20060163595A1 (en) 2006-07-27
JP5008308B2 (ja) 2012-08-22
KR20060086272A (ko) 2006-07-31
KR101059992B1 (ko) 2011-08-29
JP2006210916A (ja) 2006-08-10
TWI330413B (en) 2010-09-11

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