TW200620705A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
TW200620705A
TW200620705A TW094128041A TW94128041A TW200620705A TW 200620705 A TW200620705 A TW 200620705A TW 094128041 A TW094128041 A TW 094128041A TW 94128041 A TW94128041 A TW 94128041A TW 200620705 A TW200620705 A TW 200620705A
Authority
TW
Taiwan
Prior art keywords
light emitting
substrate
emitting device
semiconductor light
emitting layer
Prior art date
Application number
TW094128041A
Other languages
English (en)
Other versions
TWI270221B (en
Inventor
Atsushi Miyagaki
Kazuyoshi Furukawa
Yasuharu Sugawara
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of TW200620705A publication Critical patent/TW200620705A/zh
Application granted granted Critical
Publication of TWI270221B publication Critical patent/TWI270221B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
TW094128041A 2004-08-24 2005-08-17 Semiconductor light emitting device TWI270221B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004243981A JP2006066449A (ja) 2004-08-24 2004-08-24 半導体発光素子

Publications (2)

Publication Number Publication Date
TW200620705A true TW200620705A (en) 2006-06-16
TWI270221B TWI270221B (en) 2007-01-01

Family

ID=35941794

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128041A TWI270221B (en) 2004-08-24 2005-08-17 Semiconductor light emitting device

Country Status (3)

Country Link
US (1) US20060043399A1 (zh)
JP (1) JP2006066449A (zh)
TW (1) TWI270221B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455377B (zh) * 2010-04-23 2014-10-01 Everlight Electronics Co Ltd 發光二極體結構及其製作方法

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60042187D1 (de) * 1999-06-09 2009-06-25 Toshiba Kawasaki Kk Bond-typ Halbleitersubstrat, lichtemittierendes Halbleiterbauelement und Herstellungsverfahren
US20080149949A1 (en) * 2006-12-11 2008-06-26 The Regents Of The University Of California Lead frame for transparent and mirrorless light emitting diodes
JP2007103725A (ja) * 2005-10-05 2007-04-19 Toshiba Corp 半導体発光装置
JP5032017B2 (ja) * 2005-10-28 2012-09-26 株式会社東芝 半導体発光素子及びその製造方法並びに半導体発光装置
JP2007258415A (ja) * 2006-03-23 2007-10-04 Matsushita Electric Ind Co Ltd 半導体発光素子およびその製造方法
JP5286641B2 (ja) * 2006-03-29 2013-09-11 日亜化学工業株式会社 半導体発光素子及び半導体発光装置
US8026115B2 (en) * 2006-11-17 2011-09-27 3M Innovative Properties Company Optical bonding composition for LED light source
WO2008064068A2 (en) * 2006-11-17 2008-05-29 3M Innovative Properties Company Planarized led with optical extractor
CN101536202A (zh) * 2006-11-17 2009-09-16 3M创新有限公司 高效发光制品以及形成该高效发光制品的方法
JP4561732B2 (ja) * 2006-11-20 2010-10-13 トヨタ自動車株式会社 移動体位置測位装置
EP2087532A1 (en) * 2006-11-20 2009-08-12 3M Innovative Properties Company Optical bonding composition for led light source
JP2010512662A (ja) * 2006-12-11 2010-04-22 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 透明発光ダイオード
JP2008172040A (ja) * 2007-01-12 2008-07-24 Sony Corp 半導体発光素子、半導体発光素子の製造方法、バックライト、ディスプレイおよび電子機器
JP5032171B2 (ja) * 2007-03-26 2012-09-26 株式会社東芝 半導体発光素子およびその製造方法ならびに発光装置
JP5634003B2 (ja) * 2007-09-29 2014-12-03 日亜化学工業株式会社 発光装置
US20090173956A1 (en) * 2007-12-14 2009-07-09 Philips Lumileds Lighting Company, Llc Contact for a semiconductor light emitting device
US8481357B2 (en) * 2008-03-08 2013-07-09 Crystal Solar Incorporated Thin film solar cell with ceramic handling layer
US8278679B2 (en) * 2008-04-29 2012-10-02 Tsmc Solid State Lighting Ltd. LED device with embedded top electrode
JP5024247B2 (ja) 2008-09-12 2012-09-12 日立電線株式会社 発光素子
KR100974784B1 (ko) * 2009-03-10 2010-08-06 엘지이노텍 주식회사 발광 소자 및 그 제조방법
DE102010023343A1 (de) 2010-06-10 2011-12-15 Osram Opto Semiconductors Gmbh Strahlungsemittierender Halbleiterkörper, Verfahren zur Herstellung eines strahlungsemittierenden Halbleiterkörpers und strahlungsemittierendes Halbleiterbauelement
CN107210335B (zh) 2015-01-30 2019-07-05 欧司朗光电半导体有限公司 用于制造半导体组件的方法及半导体组件
JP2018006535A (ja) * 2016-06-30 2018-01-11 ウシオ電機株式会社 半導体発光素子
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5917202A (en) * 1995-12-21 1999-06-29 Hewlett-Packard Company Highly reflective contacts for light emitting semiconductor devices
DE60042187D1 (de) * 1999-06-09 2009-06-25 Toshiba Kawasaki Kk Bond-typ Halbleitersubstrat, lichtemittierendes Halbleiterbauelement und Herstellungsverfahren
US6784462B2 (en) * 2001-12-13 2004-08-31 Rensselaer Polytechnic Institute Light-emitting diode with planar omni-directional reflector
TW577178B (en) * 2002-03-04 2004-02-21 United Epitaxy Co Ltd High efficient reflective metal layer of light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI455377B (zh) * 2010-04-23 2014-10-01 Everlight Electronics Co Ltd 發光二極體結構及其製作方法

Also Published As

Publication number Publication date
US20060043399A1 (en) 2006-03-02
TWI270221B (en) 2007-01-01
JP2006066449A (ja) 2006-03-09

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees