TW200620329A - Conductive paste and electronic component mounting substrate using it - Google Patents

Conductive paste and electronic component mounting substrate using it

Info

Publication number
TW200620329A
TW200620329A TW094126242A TW94126242A TW200620329A TW 200620329 A TW200620329 A TW 200620329A TW 094126242 A TW094126242 A TW 094126242A TW 94126242 A TW94126242 A TW 94126242A TW 200620329 A TW200620329 A TW 200620329A
Authority
TW
Taiwan
Prior art keywords
powder
conductive paste
metal powder
electronic component
conductive
Prior art date
Application number
TW094126242A
Other languages
English (en)
Inventor
Hiroki Hayashi
Ayako Taira
Satoshi Ebana
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004227195A external-priority patent/JP2005317491A/ja
Priority claimed from JP2004227184A external-priority patent/JP2005317490A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200620329A publication Critical patent/TW200620329A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Conductive Materials (AREA)
TW094126242A 2004-08-03 2005-08-02 Conductive paste and electronic component mounting substrate using it TW200620329A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004227195A JP2005317491A (ja) 2004-04-01 2004-08-03 導電ペーストおよびそれを用いた電子部品搭載基板
JP2004227184A JP2005317490A (ja) 2004-04-01 2004-08-03 導電ペーストおよびそれを用いた電子部品搭載基板

Publications (1)

Publication Number Publication Date
TW200620329A true TW200620329A (en) 2006-06-16

Family

ID=35787079

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094126242A TW200620329A (en) 2004-08-03 2005-08-02 Conductive paste and electronic component mounting substrate using it

Country Status (4)

Country Link
US (1) US20080261049A1 (zh)
KR (1) KR100804840B1 (zh)
TW (1) TW200620329A (zh)
WO (1) WO2006013793A1 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350384B2 (ja) * 2007-09-13 2013-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 導電性組成物
KR101311681B1 (ko) * 2008-04-30 2013-09-25 히타치가세이가부시끼가이샤 접속 재료 및 반도체 장치
KR20100109416A (ko) * 2009-03-31 2010-10-08 디아이씨 가부시끼가이샤 도전성 페이스트 조성물 및 그 제조 방법
KR20130044847A (ko) * 2011-10-25 2013-05-03 엘지이노텍 주식회사 인쇄용 페이스트 조성물 및 터치패널
WO2013090344A1 (en) 2011-12-13 2013-06-20 Ferro Corporation Electrically conductive polymeric compositons, contacts, assemblies, and methods
KR101375297B1 (ko) * 2011-12-22 2014-03-17 제일모직주식회사 반도체용 접착 조성물 및 이를 포함하는 접착 필름
TWI500737B (zh) * 2013-05-06 2015-09-21 Chi Mei Corp 導電性接著劑
US10347388B2 (en) 2015-03-05 2019-07-09 Namics Corporation Conductive copper paste, conductive copper paste cured film, and semiconductor device
EP3075883B1 (en) * 2015-03-31 2023-09-20 Mitsubishi Electric Corporation Method for corrosion inhibition
JP6318137B2 (ja) * 2015-09-30 2018-04-25 Ｄｏｗａエレクトロニクス株式会社 導電性ペースト及び導電膜
KR20190068352A (ko) * 2017-12-08 2019-06-18 삼성에스디아이 주식회사 태양전지 셀
JP7238352B2 (ja) * 2018-11-14 2023-03-14 東洋インキＳｃホールディングス株式会社 接合用ペースト、及び該接合用ペーストで接合されてなる物品
CN116913576A (zh) * 2023-07-10 2023-10-20 乐凯胶片股份有限公司 导电浆料和异质结太阳能电池

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536738A (ja) * 1991-07-26 1993-02-12 Hitachi Chem Co Ltd 導電性樹脂ペーストおよび半導体装置
JPH06151480A (ja) * 1992-11-13 1994-05-31 Hitachi Chem Co Ltd 導電性樹脂ペーストおよび半導体装置
JP3321261B2 (ja) * 1993-09-08 2002-09-03 日立化成工業株式会社 抵抗回路付シートヒーター用接着剤組成物
JP3075230B2 (ja) * 1997-10-02 2000-08-14 松下電器産業株式会社 セラミック電子部品の製造方法
JP2001236827A (ja) * 2000-02-23 2001-08-31 Hitachi Chem Co Ltd 導電ペースト
JP2001297627A (ja) * 2000-04-12 2001-10-26 Hitachi Chem Co Ltd 導電材
JP2001302884A (ja) * 2000-04-21 2001-10-31 Hitachi Chem Co Ltd 導電ペースト
JP2002015946A (ja) * 2000-06-30 2002-01-18 Kyocera Corp セラミックコンデンサ

Also Published As

Publication number Publication date
KR100804840B1 (ko) 2008-02-20
US20080261049A1 (en) 2008-10-23
KR20070028556A (ko) 2007-03-12
WO2006013793A1 (ja) 2006-02-09

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