TW200619655A - Improved printed circuit board development cycle using probe location automation and bead probe technology - Google Patents

Improved printed circuit board development cycle using probe location automation and bead probe technology

Info

Publication number
TW200619655A
TW200619655A TW094117460A TW94117460A TW200619655A TW 200619655 A TW200619655 A TW 200619655A TW 094117460 A TW094117460 A TW 094117460A TW 94117460 A TW94117460 A TW 94117460A TW 200619655 A TW200619655 A TW 200619655A
Authority
TW
Taiwan
Prior art keywords
pcb
design
fixture
circuit board
printed circuit
Prior art date
Application number
TW094117460A
Other languages
English (en)
Inventor
Chris R Jacobsen
Kenneth P Parker
John E Herczeg
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200619655A publication Critical patent/TW200619655A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0005Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • H05K1/0268Marks, test patterns or identification means for electrical inspection or testing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16Inspection; Monitoring; Aligning
    • H05K2203/162Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Tests Of Electronic Circuits (AREA)
TW094117460A 2004-12-10 2005-05-27 Improved printed circuit board development cycle using probe location automation and bead probe technology TW200619655A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/009,117 US20060129955A1 (en) 2004-12-10 2004-12-10 Printed circuit board development cycle using probe location automation and bead probe technology

Publications (1)

Publication Number Publication Date
TW200619655A true TW200619655A (en) 2006-06-16

Family

ID=36585522

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094117460A TW200619655A (en) 2004-12-10 2005-05-27 Improved printed circuit board development cycle using probe location automation and bead probe technology

Country Status (3)

Country Link
US (2) US20060129955A1 (zh)
JP (1) JP2006173613A (zh)
TW (1) TW200619655A (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4361292B2 (ja) * 2003-02-19 2009-11-11 Okiセミコンダクタ株式会社 半導体装置の評価用teg
US7325219B2 (en) * 2005-02-16 2008-01-29 Agilent Technologies, Inc. Method and apparatus for determining probing locations for a printed circuit board
US7818698B2 (en) * 2007-06-29 2010-10-19 Taiwan Semiconductor Manufacturing Company, Ltd. Accurate parasitic capacitance extraction for ultra large scale integrated circuits
US8056025B1 (en) * 2008-02-21 2011-11-08 Altera Corporation Integration of open space/dummy metal at CAD for physical debug of new silicon
US20110035720A1 (en) * 2009-06-11 2011-02-10 Gerald Suiter Dynamic Printed Circuit Board Design Reuse
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
US8310256B2 (en) 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
TW201232211A (en) * 2011-01-28 2012-08-01 Hon Hai Prec Ind Co Ltd System and method of automatically testing a circuit board
US9000798B2 (en) * 2012-06-13 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method of test probe alignment control
CN103472384B (zh) * 2013-08-31 2016-08-17 杭州华为数字技术有限公司 一种定位方法及定位装置
US10371718B2 (en) 2016-11-14 2019-08-06 International Business Machines Corporation Method for identification of proper probe placement on printed circuit board
US10769340B2 (en) * 2018-05-16 2020-09-08 Mentor Graphics Corporation Automatic moving of probe locations for parasitic extraction
US11532524B2 (en) 2020-07-27 2022-12-20 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit test method and structure thereof
CN112966467B (zh) * 2021-03-17 2022-04-29 武汉大学 一种基于湿法化学蚀刻联合仿真的柔性pcb板结构设计方法

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US4535536A (en) * 1983-11-03 1985-08-20 Augat Inc. Method of assembling adaptor for automatic testing equipment
US4724383A (en) * 1985-05-03 1988-02-09 Testsystems, Inc. PC board test fixture
US5414371A (en) * 1993-03-25 1995-05-09 Probes Associates, Inc. Semiconductor device test probe ring apparatus and method of manufacture
KR0158421B1 (ko) * 1995-09-19 1998-12-15 배순훈 인쇄회로기판의 자삽불량 검사장치 및 방법
US5794007A (en) * 1995-11-03 1998-08-11 Intel Corporation System and method for programming programmable electronic components using board-level automated test equipment
US5939892A (en) * 1996-04-12 1999-08-17 Methode Electronics, Inc. Circuit board testing fixture
JPH1164426A (ja) * 1997-08-25 1999-03-05 I C T:Kk プリント基板の検査装置およびプリント基板の検査 装置の組み立てキット
JP3186667B2 (ja) * 1997-10-07 2001-07-11 日本電気株式会社 検査用端子位置決定装置、検査用端子位置決定方法および検査用端子位置決定用プログラムを記録した記録媒体
US6144210A (en) * 1998-06-09 2000-11-07 Zen Licensing Group, Llp Method and apparatus for finding and locating manufacturing defects on a printed circuit board
US6243655B1 (en) * 1998-08-05 2001-06-05 International Business Machines Corporation Circuit trace probe and method
US6311317B1 (en) * 1999-03-31 2001-10-30 Synopsys, Inc. Pre-synthesis test point insertion
US6787708B1 (en) * 2000-11-21 2004-09-07 Unisys Corporation Printed circuit board debug technique
US6484301B1 (en) * 2001-05-25 2002-11-19 Hewlett-Packard Company System for and method of efficient contact pad identification
US6667628B2 (en) * 2002-04-02 2003-12-23 Agilent Technologies, Inc. Method and apparatus for the management of forces in a wireless fixture
US6839883B2 (en) * 2002-08-08 2005-01-04 Agilent Technologies, Inc. Determining support locations in a wireless fixture of a printed circuit assembly tester
US6839885B2 (en) * 2002-08-22 2005-01-04 Agilent Technologies, Inc. Determining via placement in the printed circuit board of a wireless test fixture
US7173442B2 (en) * 2003-08-25 2007-02-06 Delaware Capital Formation, Inc. Integrated printed circuit board and test contactor for high speed semiconductor testing
US7307222B2 (en) * 2003-09-24 2007-12-11 Agilent Technologies, Inc. Printed circuit board test access point structures and method for making the same
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US7190157B2 (en) * 2004-10-25 2007-03-13 Agilent Technologies, Inc. Method and apparatus for layout independent test point placement on a printed circuit board
US7187165B2 (en) * 2004-12-10 2007-03-06 Agilent Technologies, Inc. Method and system for implicitly encoding preferred probing locations in a printed circuit board design for use in tester fixture build

Also Published As

Publication number Publication date
US20080148208A1 (en) 2008-06-19
JP2006173613A (ja) 2006-06-29
US20060129955A1 (en) 2006-06-15

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