TW200618304A - Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus - Google Patents
Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatusInfo
- Publication number
- TW200618304A TW200618304A TW094124765A TW94124765A TW200618304A TW 200618304 A TW200618304 A TW 200618304A TW 094124765 A TW094124765 A TW 094124765A TW 94124765 A TW94124765 A TW 94124765A TW 200618304 A TW200618304 A TW 200618304A
- Authority
- TW
- Taiwan
- Prior art keywords
- thin film
- semiconductor device
- electro
- manufacturing
- same
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000010409 thin film Substances 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010408 film Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 230000001681 protective effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
- H01L27/0251—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
- H01L27/0255—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices using diodes as protective elements
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7391—Gated diode structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/868—PIN diodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Semiconductor Integrated Circuits (AREA)
- Light Receiving Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004215333 | 2004-07-23 | ||
JP2005114230A JP2006060191A (ja) | 2004-07-23 | 2005-04-12 | 薄膜半導体装置及びその製造方法、電気光学装置、電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200618304A true TW200618304A (en) | 2006-06-01 |
TWI283484B TWI283484B (en) | 2007-07-01 |
Family
ID=35311881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094124765A TWI283484B (en) | 2004-07-23 | 2005-07-21 | Thin film semiconductor device and method of manufacturing the same, electro-optical device, and electronic apparatus |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060017139A1 (zh) |
EP (1) | EP1619725A3 (zh) |
JP (1) | JP2006060191A (zh) |
KR (1) | KR100668272B1 (zh) |
TW (1) | TWI283484B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI662698B (zh) * | 2012-11-28 | 2019-06-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070069237A1 (en) * | 2005-09-29 | 2007-03-29 | Toppoly Optoelectronics Corp. | Systems for providing electrostatic discharge protection |
US20070268637A1 (en) * | 2006-05-18 | 2007-11-22 | Prime View International Co., Ltd. | Active matrix device |
DE102006023429B4 (de) * | 2006-05-18 | 2011-03-10 | Infineon Technologies Ag | ESD-Schutz-Element zur Verwendung in einem elektrischen Schaltkreis |
US7781768B2 (en) * | 2006-06-29 | 2010-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Display device, method for manufacturing the same, and electronic device having the same |
WO2008001517A1 (en) | 2006-06-30 | 2008-01-03 | Sharp Kabushiki Kaisha | Tft substrate, display panel and display device provided with such tft substrate, and tft substrate manufacturing method |
KR100840098B1 (ko) * | 2007-07-04 | 2008-06-19 | 삼성에스디아이 주식회사 | 유기전계발광 소자 및 그의 제조 방법 |
TW200947822A (en) * | 2008-05-09 | 2009-11-16 | Tpo Displays Corp | Electrostatic discharge (ESD) protection circuit and electronic system utilizing the same |
US8363365B2 (en) * | 2008-06-17 | 2013-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP5448584B2 (ja) * | 2008-06-25 | 2014-03-19 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US8174047B2 (en) | 2008-07-10 | 2012-05-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US8384180B2 (en) * | 2009-01-22 | 2013-02-26 | Palo Alto Research Center Incorporated | Gated co-planar poly-silicon thin film diode |
US8749930B2 (en) | 2009-02-09 | 2014-06-10 | Semiconductor Energy Laboratory Co., Ltd. | Protection circuit, semiconductor device, photoelectric conversion device, and electronic device |
JP5455753B2 (ja) * | 2009-04-06 | 2014-03-26 | 株式会社半導体エネルギー研究所 | Icカード |
JP5728171B2 (ja) | 2009-06-29 | 2015-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2011043183A1 (ja) * | 2009-10-07 | 2011-04-14 | シャープ株式会社 | 半導体装置およびその製造方法、ならびに半導体装置を備えた表示装置 |
WO2011052437A1 (en) * | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Non-linear element, display device including non-linear element, and electronic device including display device |
KR101113421B1 (ko) * | 2009-11-23 | 2012-03-13 | 삼성모바일디스플레이주식회사 | 액정 표시 장치 |
US8698137B2 (en) | 2011-09-14 | 2014-04-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
TWI627483B (zh) * | 2012-11-28 | 2018-06-21 | 半導體能源研究所股份有限公司 | 顯示裝置及電視接收機 |
KR20150026066A (ko) * | 2013-08-30 | 2015-03-11 | 삼성전자주식회사 | 터널링 전계 효과 트랜지스터 |
JP6364891B2 (ja) * | 2014-04-01 | 2018-08-01 | セイコーエプソン株式会社 | 電気光学装置、電子機器および半導体装置 |
JP2016015404A (ja) * | 2014-07-02 | 2016-01-28 | 株式会社ジャパンディスプレイ | 液晶表示装置 |
CN104483796A (zh) * | 2015-01-04 | 2015-04-01 | 京东方科技集团股份有限公司 | 一种阵列基板及其制备方法、显示面板及显示装置 |
US9397084B1 (en) * | 2015-03-02 | 2016-07-19 | United Microelectronics Corp. | Structure of ESD protection circuits on BEOL layer |
WO2018116263A1 (en) * | 2016-12-24 | 2018-06-28 | Indian Institute Of Science | Low power electrostatic discharge protection circuit |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0425175A (ja) * | 1990-05-21 | 1992-01-28 | Canon Inc | ダイオード |
JP3071851B2 (ja) * | 1991-03-25 | 2000-07-31 | 株式会社半導体エネルギー研究所 | 電気光学装置 |
US5610790A (en) * | 1995-01-20 | 1997-03-11 | Xilinx, Inc. | Method and structure for providing ESD protection for silicon on insulator integrated circuits |
JP3717227B2 (ja) * | 1996-03-29 | 2005-11-16 | 株式会社ルネサステクノロジ | 入力/出力保護回路 |
US6657240B1 (en) * | 2002-01-28 | 2003-12-02 | Taiwan Semiconductoring Manufacturing Company | Gate-controlled, negative resistance diode device using band-to-band tunneling |
JP4813743B2 (ja) * | 2002-07-24 | 2011-11-09 | 株式会社 日立ディスプレイズ | 画像表示装置の製造方法 |
US6822295B2 (en) * | 2002-07-30 | 2004-11-23 | Honeywell International Inc. | Overvoltage protection device using pin diodes |
TWI338346B (en) * | 2002-09-20 | 2011-03-01 | Semiconductor Energy Lab | Display device and manufacturing method thereof |
TW587345B (en) * | 2003-02-21 | 2004-05-11 | Toppoly Optoelectronics Corp | Method and structure of diode |
JP2005043672A (ja) * | 2003-07-22 | 2005-02-17 | Toshiba Matsushita Display Technology Co Ltd | アレイ基板およびその製造方法 |
US7314785B2 (en) * | 2003-10-24 | 2008-01-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
-
2005
- 2005-04-12 JP JP2005114230A patent/JP2006060191A/ja active Pending
- 2005-06-08 US US11/147,250 patent/US20060017139A1/en not_active Abandoned
- 2005-06-23 EP EP05013531A patent/EP1619725A3/en not_active Withdrawn
- 2005-07-19 KR KR1020050065151A patent/KR100668272B1/ko active IP Right Grant
- 2005-07-21 TW TW094124765A patent/TWI283484B/zh not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI662698B (zh) * | 2012-11-28 | 2019-06-11 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
TWI703723B (zh) * | 2012-11-28 | 2020-09-01 | 日商半導體能源研究所股份有限公司 | 顯示裝置 |
Also Published As
Publication number | Publication date |
---|---|
EP1619725A2 (en) | 2006-01-25 |
US20060017139A1 (en) | 2006-01-26 |
TWI283484B (en) | 2007-07-01 |
EP1619725A3 (en) | 2009-04-08 |
JP2006060191A (ja) | 2006-03-02 |
KR20060053881A (ko) | 2006-05-22 |
KR100668272B1 (ko) | 2007-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |