TW200617928A - Semiconductor laser unit and optical pickup device equipped with the same - Google Patents

Semiconductor laser unit and optical pickup device equipped with the same

Info

Publication number
TW200617928A
TW200617928A TW094133703A TW94133703A TW200617928A TW 200617928 A TW200617928 A TW 200617928A TW 094133703 A TW094133703 A TW 094133703A TW 94133703 A TW94133703 A TW 94133703A TW 200617928 A TW200617928 A TW 200617928A
Authority
TW
Taiwan
Prior art keywords
recess
semiconductor laser
laser unit
same
opening
Prior art date
Application number
TW094133703A
Other languages
English (en)
Inventor
Kiyoshi Fujihara
Masanori Minamio
Masaya Tateyanagi
Shigeki Okamoto
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200617928A publication Critical patent/TW200617928A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
    • G11B7/125—Optical beam sources therefor, e.g. laser control circuitry specially adapted for optical storage devices; Modulators, e.g. means for controlling the size or intensity of optical spots or optical traces
    • G11B7/127—Lasers; Multiple laser arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optical Head (AREA)
  • Semiconductor Lasers (AREA)
TW094133703A 2004-10-13 2005-09-28 Semiconductor laser unit and optical pickup device equipped with the same TW200617928A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004298498A JP2006114096A (ja) 2004-10-13 2004-10-13 半導体レーザユニットおよびそれを備えた光ピックアップ装置

Publications (1)

Publication Number Publication Date
TW200617928A true TW200617928A (en) 2006-06-01

Family

ID=36145272

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133703A TW200617928A (en) 2004-10-13 2005-09-28 Semiconductor laser unit and optical pickup device equipped with the same

Country Status (6)

Country Link
US (1) US20060078021A1 (zh)
JP (1) JP2006114096A (zh)
KR (1) KR20060052168A (zh)
CN (1) CN1779811A (zh)
SG (1) SG121989A1 (zh)
TW (1) TW200617928A (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523574B2 (ja) 2006-08-25 2010-08-11 パナソニック株式会社 光ピックアップ装置
EP2218419A1 (en) * 2007-12-04 2010-08-18 Panasonic Corporation Laser unit
JP2011077458A (ja) * 2009-10-01 2011-04-14 Panasonic Corp レーザー装置
JP2012038894A (ja) * 2010-08-06 2012-02-23 Sumitomo Electric Ind Ltd 発熱源実装用基板モジュール、照明装置
JP2013011841A (ja) * 2011-09-28 2013-01-17 Panasonic Corp 画像表示装置
CN103904552A (zh) * 2012-12-26 2014-07-02 鸿富锦精密工业（深圳）有限公司 投影用激光芯片封装结构
JP6749807B2 (ja) * 2016-07-26 2020-09-02 新光電気工業株式会社 光半導体装置
JP2019096637A (ja) * 2017-11-17 2019-06-20 株式会社小糸製作所 レーザー光源ユニット
JP7293697B2 (ja) * 2019-02-06 2023-06-20 富士フイルムビジネスイノベーション株式会社 発光装置、光学装置および情報処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2737345C2 (de) * 1976-08-20 1991-07-25 Canon K.K., Tokio/Tokyo Halbleiterlaser-Vorrichtung mit einem Peltier-Element
JPH05307759A (ja) * 1992-04-28 1993-11-19 Olympus Optical Co Ltd 光ピックアップ
US5748658A (en) * 1993-10-22 1998-05-05 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and optical pickup head
JPH07311970A (ja) * 1994-05-17 1995-11-28 Seiko Epson Corp 光ヘッド及び光記憶装置
US5812582A (en) * 1995-10-03 1998-09-22 Methode Electronics, Inc. Vertical cavity surface emitting laser feedback system and method
US7061949B1 (en) * 2002-08-16 2006-06-13 Jds Uniphase Corporation Methods, apparatus, and systems with semiconductor laser packaging for high modulation bandwidth
US7508001B2 (en) * 2004-06-21 2009-03-24 Panasonic Corporation Semiconductor laser device and manufacturing method thereof
US7279751B2 (en) * 2004-06-21 2007-10-09 Matsushita Electric Industrial Co., Ltd. Semiconductor laser device and manufacturing method thereof

Also Published As

Publication number Publication date
CN1779811A (zh) 2006-05-31
SG121989A1 (en) 2006-05-26
KR20060052168A (ko) 2006-05-19
JP2006114096A (ja) 2006-04-27
US20060078021A1 (en) 2006-04-13

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