TW200615389A - Film forming method, electronic device and electronic apparatus - Google Patents

Film forming method, electronic device and electronic apparatus

Info

Publication number
TW200615389A
TW200615389A TW094129503A TW94129503A TW200615389A TW 200615389 A TW200615389 A TW 200615389A TW 094129503 A TW094129503 A TW 094129503A TW 94129503 A TW94129503 A TW 94129503A TW 200615389 A TW200615389 A TW 200615389A
Authority
TW
Taiwan
Prior art keywords
forming method
film forming
forming
electronic device
electronic
Prior art date
Application number
TW094129503A
Other languages
English (en)
Other versions
TWI278522B (en
Inventor
Shinichi Yotsuya
Tsuyoshi Yoda
Suguru Akagawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200615389A publication Critical patent/TW200615389A/zh
Application granted granted Critical
Publication of TWI278522B publication Critical patent/TWI278522B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/146—By vapour deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
TW094129503A 2004-09-17 2005-08-29 Film forming method, electronic device and electronic apparatus TWI278522B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004270891A JP2006083442A (ja) 2004-09-17 2004-09-17 成膜方法、電子デバイス、及び電子機器

Publications (2)

Publication Number Publication Date
TW200615389A true TW200615389A (en) 2006-05-16
TWI278522B TWI278522B (en) 2007-04-11

Family

ID=36074388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129503A TWI278522B (en) 2004-09-17 2005-08-29 Film forming method, electronic device and electronic apparatus

Country Status (5)

Country Link
US (1) US20060062978A1 (zh)
JP (1) JP2006083442A (zh)
KR (1) KR100665424B1 (zh)
CN (1) CN100414682C (zh)
TW (1) TWI278522B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658603B (zh) * 2017-07-04 2019-05-01 茂迪股份有限公司 單面受光式太陽能電池及其製造方法
TWI789569B (zh) * 2019-01-31 2023-01-11 日商大日本印刷股份有限公司 蒸鍍遮罩群、電子裝置之製造方法及電子裝置

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5139429B2 (ja) * 2006-08-07 2013-02-06 インクテック カンパニー リミテッド 金属積層板の製造方法
RU2494201C2 (ru) * 2009-03-31 2013-09-27 Андрей Виленович Любомирский Облицовочная панель (варианты)
RU2494202C2 (ru) * 2009-03-31 2013-09-27 Андрей Виленович Любомирский Облицовочная панель (варианты)
DE102009022660B3 (de) * 2009-05-26 2010-09-16 Semikron Elektronik Gmbh & Co. Kg Befestigung eines Bauelements an einem Substrat und/oder eines Anschlusselementes an dem Bauelement und/oder an dem Substrat durch Drucksinterung
DE102015108494B4 (de) * 2015-05-29 2024-01-18 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines Gehäusedeckels und Verfahren zum Herstellen eines optoelektronischen Bauelements
JP2017150017A (ja) * 2016-02-23 2017-08-31 株式会社ジャパンディスプレイ 蒸着マスクの製造方法及び有機ｅｌディスプレイの製造方法
DE102017126590A1 (de) * 2017-11-13 2019-05-16 Doduco Solutions Gmbh Verfahren zum Herstellen einer Bodenplatte für ein Elektronikmodul
CN110592526A (zh) * 2018-06-12 2019-12-20 张东晖 金属蒸镀遮罩结构
JP7189846B2 (ja) * 2019-07-16 2022-12-14 株式会社東芝 半導体装置の製造方法および金属の積層方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4011143A (en) * 1973-06-25 1977-03-08 Honeywell Inc. Material deposition masking for microcircuit structures
US3897324A (en) * 1973-06-25 1975-07-29 Honeywell Inc Material deposition masking for microcircuit structures
US4122215A (en) * 1976-12-27 1978-10-24 Bell Telephone Laboratories, Incorporated Electroless deposition of nickel on a masked aluminum surface
US4715940A (en) * 1985-10-23 1987-12-29 Gte Products Corporation Mask for patterning electrode structures in thin film EL devices
JP2552159B2 (ja) * 1987-02-02 1996-11-06 セイコーエプソン株式会社 半導体装置及びその製造方法
JPH04236758A (ja) * 1991-01-16 1992-08-25 Oki Electric Ind Co Ltd 蒸着用マスク
US6316097B1 (en) * 1998-09-28 2001-11-13 Seagate Technology Llc Electroless plating process for alternative memory disk substrates
JP2001185350A (ja) * 1999-12-24 2001-07-06 Sanyo Electric Co Ltd 被着用マスク、その製造方法、エレクトロルミネッセンス表示装置及びその製造方法
JP3656612B2 (ja) * 2001-06-08 2005-06-08 株式会社村田製作所 金属膜およびその製造方法ならびに積層セラミック電子部品およびその製造方法
JP4932094B2 (ja) * 2001-07-02 2012-05-16 日本リーロナール有限会社 無電解金めっき液および無電解金めっき方法
JP2004039628A (ja) * 2003-06-04 2004-02-05 Hitachi Metals Ltd メタルマスク

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI658603B (zh) * 2017-07-04 2019-05-01 茂迪股份有限公司 單面受光式太陽能電池及其製造方法
TWI789569B (zh) * 2019-01-31 2023-01-11 日商大日本印刷股份有限公司 蒸鍍遮罩群、電子裝置之製造方法及電子裝置
US11566316B2 (en) 2019-01-31 2023-01-31 Dai Nippon Printing Co., Ltd. Deposition mask group, manufacturing method of electronic device, and electronic device
US11649539B2 (en) 2019-01-31 2023-05-16 Dai Nippon Printing Co., Ltd. Deposition mask group, manufacturing method of electronic device, and electronic device
US11939659B2 (en) 2019-01-31 2024-03-26 Dai Nippon Printing Co., Ltd. Deposition mask group, manufacturing method of electronic device, and electronic device

Also Published As

Publication number Publication date
KR20060051312A (ko) 2006-05-19
CN1750250A (zh) 2006-03-22
CN100414682C (zh) 2008-08-27
TWI278522B (en) 2007-04-11
JP2006083442A (ja) 2006-03-30
US20060062978A1 (en) 2006-03-23
KR100665424B1 (ko) 2007-01-04

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees