TW200615367A - Thermoplastic resin composition and injection moulding material therefrom - Google Patents

Thermoplastic resin composition and injection moulding material therefrom

Info

Publication number
TW200615367A
TW200615367A TW094128576A TW94128576A TW200615367A TW 200615367 A TW200615367 A TW 200615367A TW 094128576 A TW094128576 A TW 094128576A TW 94128576 A TW94128576 A TW 94128576A TW 200615367 A TW200615367 A TW 200615367A
Authority
TW
Taiwan
Prior art keywords
derived
diamine
parts
constitution
resin composition
Prior art date
Application number
TW094128576A
Other languages
English (en)
Inventor
Yoshiaki Taguchi
Toru Katsumata
Toshio Shiwaku
Original Assignee
Polyplastics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co filed Critical Polyplastics Co
Publication of TW200615367A publication Critical patent/TW200615367A/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06Polyamides derived from polyamines and polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12Polyester-amides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
TW094128576A 2004-08-31 2005-08-22 Thermoplastic resin composition and injection moulding material therefrom TW200615367A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252278 2004-08-31

Publications (1)

Publication Number Publication Date
TW200615367A true TW200615367A (en) 2006-05-16

Family

ID=36000183

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128576A TW200615367A (en) 2004-08-31 2005-08-22 Thermoplastic resin composition and injection moulding material therefrom

Country Status (7)

Country Link
US (1) US20080139754A1 (zh)
EP (1) EP1792942A4 (zh)
JP (1) JPWO2006025538A1 (zh)
KR (1) KR20070059070A (zh)
CN (1) CN101006138A (zh)
TW (1) TW200615367A (zh)
WO (1) WO2006025538A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447171B (zh) * 2011-02-28 2014-08-01 Toray Industries 熱塑性樹脂組成物及其成形品

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007269937A (ja) * 2006-03-31 2007-10-18 Mitsui Chemicals Inc 難燃性ポリアミド組成物
WO2007144963A1 (ja) * 2006-06-13 2007-12-21 Polyplastics Co., Ltd. 熱可塑性樹脂組成物
KR100929383B1 (ko) * 2007-05-23 2009-12-02 삼성정밀화학 주식회사 방향족 액정 폴리에스테르 아미드 공중합체, 상기 방향족액정 폴리에스테르 아미드 공중합체를 채용한 프리프레그,및 상기 프리프레그를 채용한 적층판과 프린트 배선판
KR101007233B1 (ko) 2008-12-31 2011-01-13 삼성정밀화학 주식회사 열경화성 수지 조성물, 상기 열경화성 수지 조성물의 가교체, 상기 가교체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판
CN102574992B (zh) * 2009-09-30 2015-03-11 宝理塑料株式会社 液晶性高分子以及成型体
KR20120009705A (ko) 2010-07-20 2012-02-02 삼성정밀화학 주식회사 방향족 액정 폴리에스테르 수지의 제조방법 및 방향족 액정 폴리에스테르 수지 컴파운드의 제조방법
CN103764741B (zh) 2011-08-29 2015-09-23 提克纳有限责任公司 低熔体粘度液晶聚合物的熔融聚合
US8852730B2 (en) 2011-08-29 2014-10-07 Ticona Llc Melt-extruded substrate for use in thermoformed articles
KR20140057360A (ko) * 2011-08-29 2014-05-12 티코나 엘엘씨 고유동성 액정 중합체 조성물
WO2013032975A1 (en) * 2011-08-29 2013-03-07 Ticona Llc Thermotropic liquid crystalline polymer with improved low shear viscosity
CN103764623B (zh) 2011-08-29 2016-04-27 提克纳有限责任公司 芳族酰胺化合物
JP2014525498A (ja) * 2011-08-29 2014-09-29 ティコナ・エルエルシー 高流動性液晶ポリマー組成物
WO2013032970A1 (en) * 2011-08-29 2013-03-07 Ticona Llc Liquid crystalline polymer composition containing a fibrous filler
WO2013032974A1 (en) * 2011-08-29 2013-03-07 Ticona Llc Solid-state polymerization of a liquid crystalline polymer
WO2013032967A1 (en) * 2011-08-29 2013-03-07 Ticona Llc Cast molded parts formed form a liquid crystalline polymer
US8906258B2 (en) 2011-08-29 2014-12-09 Ticona Llc Heat-resistant liquid crystalline polymer composition having a low melting temperature
US20130053531A1 (en) * 2011-08-29 2013-02-28 Ticona Llc Method for Minimizing Process Disruptions During Formation of a Liquid Crystalline Polymer
KR101947215B1 (ko) 2011-11-15 2019-02-12 티코나 엘엘씨 미세 피치 전기 커넥터 및 그에 사용하기 위한 열가소성 조성물
WO2013074469A1 (en) * 2011-11-15 2013-05-23 Ticona Llc Compact camera module
TWI534253B (zh) * 2011-11-15 2016-05-21 堤康那責任有限公司 具有改良可燃性效能之富含環烷之液晶聚合物組合物
US20130123420A1 (en) * 2011-11-15 2013-05-16 Ticona Llc Liquid Crystalline Polymer Composition for High Voltage Electronic Components
KR101996106B1 (ko) * 2011-11-15 2019-07-03 티코나 엘엘씨 치수 공차가 작은 성형 부품에 사용하기 위한 저-나프텐 액정 중합체 조성물
US8932483B2 (en) 2011-11-15 2015-01-13 Ticona Llc Low naphthenic liquid crystalline polymer composition
KR20150023249A (ko) * 2012-06-27 2015-03-05 티코나 엘엘씨 초저 점도 액체 결정질 중합체 조성물
WO2014130275A2 (en) * 2013-02-22 2014-08-28 Ticona Llc High performance polymer composition with improved flow properties
EP3183320B1 (en) * 2014-08-21 2021-06-30 Ticona LLC Composition containing a polyaryletherketone and low naphthenic liquid crystalline polymer
KR20170000942A (ko) 2015-06-25 2017-01-04 주식회사 엘지화학 연료 누유방지 물품의 제조방법, 및 연료 누유방지 물품
WO2018097011A1 (ja) * 2016-11-24 2018-05-31 ポリプラスチックス株式会社 全芳香族ポリエステルアミド及びその製造方法
CN112662174B (zh) * 2019-10-16 2023-06-13 上海凯赛生物技术股份有限公司 包括聚酯酰胺和聚酰胺的组合物、其制备方法及其制品纤维
CN112724381A (zh) * 2020-12-29 2021-04-30 上海普利特化工新材料有限公司 一种高机械强度热致型液晶聚合物树脂
CN113637158B (zh) * 2021-08-31 2023-05-19 宁波聚嘉新材料科技有限公司 一种高耐热液晶聚酯酰胺薄膜及其制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330457A (en) * 1980-12-09 1982-05-18 Celanese Corporation Poly(ester-amide) capable of forming an anisotropic melt phase derived from 6-hydroxy-2-naphthoic acid, dicarboxylic acid, and aromatic monomer capable of forming an amide linkage
JPS6128059A (ja) * 1984-07-10 1986-02-07 ヘキスト・セラニーズ・コーポレーション サ−モトロピツク液晶ポリマ−繊維よりなる不織製品およびその製法
DE4119301A1 (de) * 1991-06-12 1992-12-17 Huels Chemische Werke Ag Formmassen auf basis aromatischer polyamide
JPH07247424A (ja) * 1994-03-09 1995-09-26 Mitsui Petrochem Ind Ltd 芳香族ポリアミド組成物
US6121388A (en) * 1998-05-12 2000-09-19 Toray Industries, Inc. Polyamide resin composition
JP2001131406A (ja) * 1999-11-01 2001-05-15 Toray Ind Inc 気体および/または液体バリア成形品用樹脂組成物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI447171B (zh) * 2011-02-28 2014-08-01 Toray Industries 熱塑性樹脂組成物及其成形品

Also Published As

Publication number Publication date
JPWO2006025538A1 (ja) 2008-05-08
WO2006025538A1 (ja) 2006-03-09
EP1792942A4 (en) 2008-12-03
CN101006138A (zh) 2007-07-25
KR20070059070A (ko) 2007-06-11
US20080139754A1 (en) 2008-06-12
EP1792942A1 (en) 2007-06-06

Similar Documents

Publication Publication Date Title
TW200615367A (en) Thermoplastic resin composition and injection moulding material therefrom
ES2347677T3 (es) Lamina a base de una masa de moldeo transparente.
JP3945686B2 (ja) 成形材料又は射出成形材料及び成形品
ES2316041T3 (es) Hoja compuesta de una mezcla de poliamidas.
SG141208A1 (en) Liquid crystal polyester resin mixture
KR102629843B1 (ko) 폴리아미드 수지, 성형품 및 폴리아미드 수지의 제조방법
EP2100919A4 (en) FLAME-RESISTANT POLYAMIDE RESIN COMPOSITION AND FORM BODY
DE60323490D1 (de) Polyesterzusammensetzung und diese enthaltendes verpackungsmaterial
TW200516095A (en) Biodegradable polyester mixture
CA2208840A1 (en) Semiaromatic polyamides, processes for preparing the same and compositions containing the same
TW200940642A (en) Liquid crystalline polyester, and molded article thereof
DE602007002886D1 (de) Amorphe copolyamide, die p-bis(aminocyclohexyl)methan und terephthalsäure enthalten
EP1422044A4 (en) THROUGH STRUCTURES AND HEAT-FIXING FORM BODY AND MANUFACTURING METHOD THEREFOR
CA2507451A1 (en) Transparent amorphous polyamides based on diamines and on tetradecanedioic acid
EP1757636A4 (en) POLYAMIDE RESIN AND ARTICULATED MOLDED ARTICLES
BR0302095A (pt) Materiais de moldagem de poliamida transparente tendo aperfeiçoada transparência, resistência a produtos quìmicos e permanente alta resistência à fadiga
ATE533805T1 (de) Polyamidformmasse und deren verwendung zur herstellung von transparenten, heissdampfsterilisierbaren formteilen und extrudaten
ATE463534T1 (de) Thermoplastgegenstände mit geringem glanz
US20020128377A1 (en) Impact resistant transparent polyamide alloys
JP2011102360A (ja) 繊維強化ポリアミド樹脂組成物
EP1138719A4 (en) POLYIMIDE / POLYARYLATE RESIN COMPOSITIONS AND MOLDED ARTICLES OBTAINED FROM SUCH COMPOSITIONS
JP2010285553A (ja) 耐熱性ポリアミド樹脂
KR970000096B1 (ko) 화학약품에 대해 높은 내성을 지닌 투명한 무정형 조성물
KR20130060301A (ko) 내충격성이 우수한 폴리옥사미드 수지 및 내충격성 부품
ATE493473T1 (de) Fügen von formteilen aus unterschiedlichen polyamidformmassen