TW200613575A - Evaporator, vapor deposition apparatus, and method of switching evaporator in vapor deposition apparatus - Google Patents
Evaporator, vapor deposition apparatus, and method of switching evaporator in vapor deposition apparatusInfo
- Publication number
- TW200613575A TW200613575A TW094121254A TW94121254A TW200613575A TW 200613575 A TW200613575 A TW 200613575A TW 094121254 A TW094121254 A TW 094121254A TW 94121254 A TW94121254 A TW 94121254A TW 200613575 A TW200613575 A TW 200613575A
- Authority
- TW
- Taiwan
- Prior art keywords
- evaporation
- evaporator
- container
- vapor deposition
- deposition apparatus
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
Abstract
This invention discloses an evaporator (4) evaporating a specified material under a specified degree of vacuum. The evaporator comprises a container (11) for evaporation connected to a vacuum pump (12) and having material discharge holes (17) capable of discharging the evaporated evaporation material (B) formed in the upper wall part (11c) thereof and a loading table (15) installed in the container (11) for evaporation so as to be lifted by a cylinder device (13) for lifting and capable of placing, thereon, a material storage container (14) in which a vapor deposition material (A) is stored. A tubular partition wall member (19) suppressing the discharge of the evaporation material into the container (11) for evaporation by covering the outer periphery thereof when the material storage container (14) is raised through the loading table (15) is installed around the material release hole (17) for the material in the container (14) for evaporation. A heating device (21) heating the material storage container (14) is mounted on the loading table (15) and the partition wall member (19).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004189282A JP4570403B2 (en) | 2004-06-28 | 2004-06-28 | Evaporation apparatus, vapor deposition apparatus, and method for switching evaporation apparatus in vapor deposition apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200613575A true TW200613575A (en) | 2006-05-01 |
TWI398535B TWI398535B (en) | 2013-06-11 |
Family
ID=35776668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094121254A TWI398535B (en) | 2004-06-28 | 2005-06-24 | A vapor deposition apparatus, a vapor deposition apparatus, and a vapor deposition apparatus |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4570403B2 (en) |
KR (1) | KR101175165B1 (en) |
CN (1) | CN100558929C (en) |
TW (1) | TWI398535B (en) |
WO (1) | WO2006001205A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596224B (en) * | 2013-01-15 | 2017-08-21 | 日立造船股份有限公司 | Apparatus of vacuum evaporating |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5036264B2 (en) * | 2006-09-19 | 2012-09-26 | 日立造船株式会社 | Vacuum deposition equipment |
TWI353389B (en) * | 2007-02-09 | 2011-12-01 | Au Optronics Corp | Evaporation coater and evaporation source replacem |
JP5153410B2 (en) * | 2008-03-31 | 2013-02-27 | Hoya株式会社 | Lens film forming method, vapor deposition apparatus, and lens manufacturing method |
US8741062B2 (en) * | 2008-04-22 | 2014-06-03 | Picosun Oy | Apparatus and methods for deposition reactors |
KR101084234B1 (en) | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | Deposition source, Deposition apparatus using the same and method for forming thin film |
DE102010017895A1 (en) * | 2010-04-21 | 2011-10-27 | Ald Vacuum Technologies Gmbh | Device for coating substrates according to the EB / PVD method |
JP5384770B2 (en) * | 2011-03-15 | 2014-01-08 | シャープ株式会社 | Vapor deposition particle injection apparatus and vapor deposition apparatus |
WO2013005781A1 (en) * | 2011-07-05 | 2013-01-10 | 東京エレクトロン株式会社 | Film formation device |
JP5405549B2 (en) * | 2011-10-20 | 2014-02-05 | 株式会社日本製鋼所 | Vacuum film forming method and vacuum film forming apparatus |
JP6021377B2 (en) | 2012-03-28 | 2016-11-09 | 日立造船株式会社 | Vacuum deposition apparatus and crucible exchange method in vacuum deposition apparatus |
ES2817842T3 (en) * | 2013-11-05 | 2021-04-08 | Tata Steel Nederland Tech Bv | Method for controlling the composition of liquid metal in an evaporator device |
FR3018082B1 (en) | 2014-03-03 | 2016-03-18 | Riber | METHOD FOR RECHARGING EVAPORATION CELL |
US9909205B2 (en) * | 2014-03-11 | 2018-03-06 | Joled Inc. | Vapor deposition apparatus, vapor deposition method using vapor deposition apparatus, and device production method |
FR3020381B1 (en) * | 2014-04-24 | 2017-09-29 | Riber | EVAPORATION CELL |
JP6302786B2 (en) * | 2014-08-01 | 2018-03-28 | シャープ株式会社 | Vapor deposition apparatus, vapor deposition method, and organic EL element manufacturing method |
JP6445959B2 (en) * | 2015-12-16 | 2018-12-26 | 株式会社オプトラン | Film forming apparatus and film forming method |
KR102561591B1 (en) * | 2018-07-02 | 2023-08-02 | 삼성디스플레이 주식회사 | Deposition apparatus and deposition method thereof |
CN109321884A (en) * | 2018-10-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | Evaporation coating device |
WO2021207904A1 (en) * | 2020-04-14 | 2021-10-21 | 眉山博雅新材料有限公司 | Crystal growth method and device |
CN112553691A (en) * | 2020-12-02 | 2021-03-26 | 中电化合物半导体有限公司 | Silicon carbide crystal growth method and growth device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3773587B2 (en) * | 1996-04-15 | 2006-05-10 | 株式会社アルバック | Purification method for organic compound monomers |
JP3863988B2 (en) * | 1998-02-06 | 2006-12-27 | 株式会社アルバック | Vapor deposition equipment |
US6202591B1 (en) * | 1998-11-12 | 2001-03-20 | Flex Products, Inc. | Linear aperture deposition apparatus and coating process |
JP3662874B2 (en) * | 2001-10-26 | 2005-06-22 | 松下電工株式会社 | Vacuum deposition apparatus and vacuum deposition method |
JP2003155555A (en) * | 2001-11-15 | 2003-05-30 | Eiko Engineering Co Ltd | Multiple molecular beam source cell for thin film deposition |
JP2004099942A (en) * | 2002-09-05 | 2004-04-02 | Kiko Kenji Kagi Kofun Yugenkoshi | Evaporation source for deposition system, apparatus for heating the evaporation source, and apparatus for heating and evaporating deposition material by using them |
CN2618925Y (en) * | 2003-05-08 | 2004-06-02 | 深圳市创欧科技有限公司 | Steam plating device for making organic electroluminescence display device |
-
2004
- 2004-06-28 JP JP2004189282A patent/JP4570403B2/en not_active Expired - Fee Related
-
2005
- 2005-06-15 WO PCT/JP2005/010948 patent/WO2006001205A1/en active Application Filing
- 2005-06-15 CN CNB2005800146515A patent/CN100558929C/en not_active Expired - Fee Related
- 2005-06-24 TW TW094121254A patent/TWI398535B/en not_active IP Right Cessation
-
2006
- 2006-10-25 KR KR1020067022161A patent/KR101175165B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI596224B (en) * | 2013-01-15 | 2017-08-21 | 日立造船股份有限公司 | Apparatus of vacuum evaporating |
Also Published As
Publication number | Publication date |
---|---|
CN1950537A (en) | 2007-04-18 |
JP2006009107A (en) | 2006-01-12 |
CN100558929C (en) | 2009-11-11 |
WO2006001205A1 (en) | 2006-01-05 |
KR101175165B1 (en) | 2012-08-20 |
JP4570403B2 (en) | 2010-10-27 |
TWI398535B (en) | 2013-06-11 |
KR20070024519A (en) | 2007-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |