JP2004099942A - Evaporation source for deposition system, apparatus for heating the evaporation source, and apparatus for heating and evaporating deposition material by using them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an evaporation source in a deposition system, which is easily workable, is low in cost and has an excellent impact resistance by devising the material of the evaporation source for storing a deposition material and that of a cylindrical member constituting a heating apparatus for heating the evaporation source, and to provide the heating apparatus therefor, and a heating and evaporation system for the deposition material. <P>SOLUTION: The evaporation source 1 which can store the deposition material and the cylindrical member 1, in which the evaporation source can be put in and out, around which a heating wire 13 for heating the evaporation source 1 is wound and which is opened at top and bottom, are made of aluminum being the material, which is obtainable unexpensively, is relatively soft, has good workability such as machining and is higher in impact resistance and heat resistance than ceramics. Powerful passive films are formed by anodic treatment on the aluminum surface. The heating wires 13 constituting the heating equipment 20 together with the cylindrical member 12 are double wires and the coils of two wire portions 13a and 13b are set in two grooves 16a and 16b formed on the outer periphery of the cylindrical member 12. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
According to the present invention, for example, in the manufacture of an organic EL device, an organic material such as an organic electroluminescent (hereinafter abbreviated as “organic EL”) luminescent material is heated and evaporated, and a gaseous organic material is deposited on a substrate. In a film forming apparatus for forming a luminescent thin film layer, an evaporation source for a film forming apparatus containing a film forming material, a heating apparatus for heating the evaporation source, and a film forming material heating and evaporating apparatus using a combination thereof About.
[0002]
[Prior art]
Examples of the thin film layer formed in the thin film display element or the thin film semiconductor element include a semiconductor layer, a thin film electrode layer made of an electrode material, and the like, in addition to the thin film light emitting layer made of the organic EL light emitting material. As one of the basic techniques for manufacturing these thin film display elements and thin film semiconductor elements, an evaporation source and a film formation substrate are appropriately combined and arranged in a vacuum atmosphere such as a vacuum chamber, and a film formation material is formed. There is a vacuum evaporation method in which a film is formed by heating and evaporating the generated evaporative gas on a substrate in a linear, dot, or planar pattern.
[0003]
Conventionally, as a device for heating an evaporation source, a resistance heating method in which a film forming material is housed in a metal container having a relatively high electric resistance, and the container itself is heated by passing an electric current through the metal container to evaporate a film forming material. (For example, see Patent Document 1). In the resistance heating method, a container capable of containing a film-forming material is usually manufactured by processing a metal material having a relatively high melting point, such as tungsten, tantalum, or molybdenum, into a thin plate, and further molding the thin plate. Although the resistance heating method has a relatively simple structure as a heating device, it is necessary to frequently replenish the film-forming material because the amount of film-forming material to be charged at one time is small. For this reason, the operating rate of the film forming apparatus is reduced, and there is a limit in reducing the manufacturing cost of the film forming element. Further, as another method of evaporating a film forming material, a method of directly irradiating a beam such as an electron beam or a laser beam is known.
[0004]
On the other hand, as a heating / evaporating method in which a large amount of a film-forming material is supplied at one time, there is a method of indirectly heating a cell-type evaporation source containing a film-forming material (for example, see Patent Document 2). The indirect heating method of the evaporation source is a method of heating the evaporation source by radiant heat from a heating body heated to a high temperature by a heating coil or the like disposed around the evaporation source. The responsiveness and evaporation rate control from the evaporation of the film-forming material from the stop or the heating to the stop of the evaporation of the film-forming material are slightly reduced compared to the direct heating method, but the structure is simple, Used. In particular, in the case of manufacturing an organic EL element, since the evaporation temperature of an expensive organic material, which is a film forming material, is low, heat radiation efficiency is poor, thermal responsiveness is further reduced, and it is more difficult to reduce the manufacturing cost.
[0005]
An example of a conventional heating device for heating an evaporation source is shown in FIG. As shown in FIG. 4, the heating device 30 for heating the evaporation source is attached to the evaporation cylinder 45 by the mounting plate 31 at the lower end 34 and connected to the heater 32 and the heater body 44 having upper and lower ends opened. Further, a heating wire 33 made of a nichrome wire or the like closely wound around the cylindrical body 32 is provided. By energizing the heating wire 33, the cylindrical body 32 is heated, and a cell-type evaporation source 40 composed of a film-forming material (for example, an organic material) and a container such as a crucible (for example, made of glass) containing the film-forming material is formed. It is heated by the radiant heat from the cylinder 32 that has become hot. The evaporating cylinder 45 is arranged in a vacuum chamber (not shown).
[0006]
The cell-type evaporation source 40 is moved into and out of the inside 36 of the cylindrical body 32 through the opened lower end portion 34 by raising and lowering a lifting rod 41 as an operation rod. The film-forming material heated and evaporated by the radiant heat from the cylindrical body 32 rises from the opened upper end portion 35 and is discharged into the interior of the evaporation cylinder 45 when the shutter S provided on the evaporation cylinder 45 is open. Then, it is deposited on the substrate B through an opening formed in the mask M. The temperature of the cylinder 32 is detected by a temperature sensor 42 provided on the cylinder 32, and a temperature controller 43 controls the current flowing through the heating wire 33 based on the detected temperature to control the temperature of the cylinder 32. The heating wire 33 is double-wrapped around the outer periphery of the cylindrical body 32 so that both terminals come to the lower end portion 34 side, and the folded front-side inverted portion 33a is bent into a U-shape. It is engaged with an engaging portion 35 a formed on the upper end 35.
[0007]
In order to indirectly heat the evaporation source in a vacuum environment, the radiant heat generated by the heating device heats the evaporation source, so that the heating device needs to be heated to a considerably high temperature. In order to improve the heat resistance of the evaporation source for a film forming apparatus and its heating device, it has been considered to manufacture the cylindrical body of the evaporation source and the heating device with ceramic. Ceramic cell-type evaporation sources and cylinders are manufactured by firing ceramic powder into ceramic containers or ceramic pipes, which are generally expensive and are easily damaged by impact. It is not possible to flexibly respond to changes in dimensions, and when changing the storage capacity of the evaporation source or the heat capacity of the ceramic cylinder, it is necessary to redesign from the mold, which is a cost increase factor . In addition, since the workability of ceramics is generally low, it is difficult to form a cell-type evaporation source or to form a spiral groove for winding a heating wire at a predetermined pitch around the outer periphery of a cylindrical body. It is difficult to reduce the manufacturing cost while maintaining the long term. In addition, in order to avoid the necessity of forming a spiral groove and obtain heat retention, cement is attached to a heating wire and wound around the outer periphery of a ceramic pipe for firing of the evaporation source heating cylinder. However, as the manufacturing process becomes complicated and the manufacturing cost rises, the heating wire is buried in the cement, so it is virtually impossible to repair the heating wire if it burns out. It becomes disposable. Furthermore, a ceramic evaporation cell and a cylindrical body exhibit heat resistance that can withstand a high temperature of 1200 ° C., but when a film-forming material is an organic raw material, a nichrome wire as a heating wire usually has 3 to 3 μm. It is sufficient to heat the organic raw material at a relatively low heating temperature of up to 400 ° C. by passing a current of 5 A, and the heat resistance of the ceramic evaporation cell and the cylindrical body is generally excessive.
[0008]
[Patent Document 1]
JP-A-10-319870 (pages 3 to 4, FIG. 3)
[Patent Document 2]
JP-A-11-229123 (page 2, FIG. 7)
[0009]
[Problems to be solved by the invention]
Wire-like heating means, such as nichrome wires, are useful heating means made from relatively inexpensive and easy-to-process materials, and alternative heating means are currently difficult to find. Therefore, focusing on the evaporation source for the film forming apparatus for housing and evaporating the film forming material and evaporating the film forming material, or focusing on the material of the cylindrical body constituting the heating apparatus together with the wire-shaped heating means, at a low cost. An evaporation source for a film forming apparatus which can be manufactured, is easy to process and has excellent impact resistance, an evaporation source heating apparatus for heating the evaporation source for the film forming apparatus, and a film forming material heating and evaporating apparatus using them. There are issues to be solved in terms of gain.
[0010]
An object of the present invention is to provide a film forming apparatus for depositing a film forming material heated and evaporated to manufacture a film forming element on a substrate or the like. Alternatively, a cylindrical body that is heated by surrounding an evaporation source for a film forming apparatus that enters and exits to heat and evaporate a film forming material is manufactured from a material that is easy to process, low cost, and has heat resistance and impact resistance. Thus, an evaporation source for a film forming apparatus, a heating apparatus for an evaporation source for a film forming apparatus, and a heating method for a film forming material using the same, which can be manufactured at low cost, are easy to handle, and can cope with a film forming material having a high evaporation temperature. It is to provide an evaporator.
[0011]
[Means for Solving the Problems]
In order to solve the above-described problems, the evaporation source for a film forming apparatus according to the present invention includes a storage unit that stores a film forming material to be heated for vapor deposition on a substrate, and is entirely made of aluminum. Made up of
[0012]
According to this evaporation source for a film forming apparatus, the material is aluminum, which is available at a low cost and is a relatively soft metal material as compared with a ceramic material. Good molding by processing such as drilling and drilling. In addition, the shape of the peripheral wall of the housing, such as the diameter, thickness, and length, does not require a mold, and requires only changing processing conditions, as compared with the case of ceramics, which must be manufactured from a mold. Can be easily handled based on the specifications. Furthermore, as compared with a ceramic cell-type evaporation source, it is more resistant to impact and does not break even if dropped. With regard to heat resistance, the evaporation source made of aluminum can withstand a high temperature of 1000 ° C. as well as a film forming material having an evaporation temperature of 800 ° C., and can cope with a sufficient amount of a normal evaporation material.
[0013]
In this evaporation source for a film forming apparatus, the aluminum may be anodized. By anodizing the aluminum forming the evaporation source for the film forming apparatus, the surface of the evaporation source for the film forming apparatus is covered with an aluminum oxide layer as a passivation film and is hardened so as not to be damaged. As a result, a protective evaporation source is obtained that does not corrode or damage the surface even when used for a long period of time.
[0014]
In this film forming apparatus evaporation source, the housing section is formed in a cylindrical container having an open upper end, and a bottom side of the housing section is provided with a heating apparatus for heating the film forming apparatus evaporation source. An engaging portion into which an operation rod for moving in and out can be fitted is formed of the aluminum integrally with the housing portion. The evaporating source for the film forming apparatus is provided with an engaging portion with which an operation rod is engaged to raise and lower the evaporating source for the film forming apparatus into the heating apparatus. In consideration of the performance, the engaging portion can also be formed integrally with the housing portion. Further, the evaporation source for the film forming apparatus thus formed can be easily handled such as storage and transportation, installation in the apparatus, and the like.
[0015]
Further, in order to solve the above-described problems, a heating apparatus for an evaporation source for a film forming apparatus according to the present invention includes an open-ended cylindrical body through which an evaporation source for a film forming apparatus containing a film forming material can enter and exit, A heating wire wound around the outer periphery of the cylindrical body, and the cylindrical body is made of aluminum.
[0016]
According to the heating apparatus of the evaporation source for the film forming apparatus, the cylindrical body is heated by energizing a heating wire or the like so that the temperature of the cylindrical body becomes high. The source is surrounded, and the evaporation source for the film forming apparatus is heated from all around. The material forming the cylinder is aluminum, which is available at a lower cost and is relatively soft compared to ceramic materials, so it can be cut or drilled using a normal machine tool. By such processing, the formation of grooves, notches, holes, holes, etc. is good. In addition, the shape of the peripheral wall, such as diameter, thickness and length, can be easily determined based on the specifications, such as only setting the processing conditions in the machine tool, compared to the case of ceramics that must start to be manufactured from the mold. Can be handled. Furthermore, as compared with a ceramic cylinder, it is more resistant to impact and does not break even if dropped. Regarding heat resistance, the aluminum cylinder can withstand a high temperature of 1000 ° C. as well as a film forming material having an evaporation temperature of 800 ° C., and can sufficiently cope with a normal evaporation material.
[0017]
In the heating device for the evaporation source for the film forming apparatus, a spiral groove for winding the heating wire can be formed on the outer periphery of the cylindrical body. As described above, the cylinder is made of aluminum, which has a soft hardness as a metal, so it has excellent cutting workability, and the spiral groove can be easily formed by the usual processing method of cutting with a cutting tool while rotating the cylinder. It is possible to form. By winding the heating wire in the spiral groove thus formed, the outer periphery of the cylindrical body is simplified, and even when used for a long time, the position of the winding of the heating wire around the cylindrical body does not shift. It is wound at a fixed position, and it is possible to prevent the temperature of the cylindrical body from being biased.
[0018]
In the heating device of the evaporation source for a film forming apparatus, the heating wire is a double wire formed by being folded in the middle, and the cylindrical body has an edge portion at one end, and the double wire is The folded notch is formed with a locking notch that can be locked, and the spiral groove can be a double groove into which each wire portion before and after the double wire folding is fitted. The heating wire is folded back in the middle to form a double wire, so that, for example, the heating wire can be handled in a state where both terminals are aligned without energizing the terminals when the heating wire is energized. The heating wire configured as a double wire is wound, for example, from the base end side of the cylindrical body, and a folded end that is the distal end of the double wire is formed at the edge of the distal end of the cylindrical body. Locked in the notch for stopping. The spiral groove is a double groove, and since the respective wire portions of the double wire are separately fitted in each line, the heating wires do not come into contact with each other and short-circuit.
[0019]
In the heating device of the evaporation source for the film forming apparatus, the cylindrical body can be made of anodized aluminum. By anodizing the aluminum that forms the cylindrical body, the cylindrical body is in a hardened state in which the surface is covered with an aluminum oxide layer as a passivation film and is hardly damaged, and the uncoated heating wire As a result, the surface of the cylinder is not corroded or damaged even if the cylinder is used for a long time.
[0020]
In the heating device for the evaporation source for the film forming apparatus, an aluminum heat insulating sheath can be fitted to the cylindrical body around which the heating wire is wound. The heat insulation sheath is fitted to the cylindrical body around which the heating wire is wound, and is in a state of covering the cylindrical body in a surrounding state, and heat generated from the heating wire and the high temperature cylindrical body is discharged outside the heating device. Insulate the heating device to prevent dissipation. According to the heat retaining sheath, it is possible to maintain the temperature of the cylindrical body which is easily radiated and cooled in the evaporating cylinder, to secure the heating and evaporation of the film forming material, and to save energy such as reduction of heating power. Moreover, the heat insulation sheath can also prevent damage such as cutting of the heating wire due to collision of foreign matter. Furthermore, when the heating wire is damaged by cutting or the like, if the heating wire is baked with ceramics, it is necessary to crush the ceramics, take out the heating wire, and repair after repair. If a heat insulating sheath is used, simply removing the heat insulating sheath can replace the heating wire wound around the outer surface of the cylinder, take measures such as repair, and reuse the cylinder. It is possible.
[0021]
In the heating device of the evaporation source for the film forming apparatus to which the heat insulation sheath is fitted, the heat insulation sheath is anodized. By anodizing the heat-insulating sheath, a hardened protective layer of an oxide film is formed on the surface of the heat-insulating sheath, so that the insulation for the heating wire can be secured, and the durability is reduced by preventing corrosion and damage. be able to.
[0022]
Further, the apparatus for heating and evaporating a film-forming material according to the present invention is configured by combining any one of the above-described evaporation sources for the film-forming apparatus and any one of the above-described apparatuses for heating the evaporation source for the film-forming apparatus. Both the evaporation source for the film forming apparatus and the heating apparatus into and out of which the evaporation source for the film forming apparatus enters and exits are made of aluminum, particularly anodized aluminum. Although it is a material, it is lightweight, does not require a mold in molding, has good workability such as cutting, and can easily realize a combination having accurate dimensions according to specifications. Further, since the heating and evaporating device is made of aluminum, it has excellent impact resistance as compared with a ceramic evaporating device, and has sufficient heat resistance to obtain organic material deposition.
[0023]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of an evaporation source for a film forming apparatus, a heating apparatus for an evaporation source for a film forming apparatus, and a heating and evaporating apparatus for a film forming material using a combination thereof will be described with reference to the accompanying drawings. . FIG. 1 is a perspective view showing one embodiment of an evaporation source for a film forming apparatus according to the present invention. The structure of the film forming apparatus itself including the evaporating cylinder and the substrate and the mask may be, for example, the structure shown in FIG. 4, and the description thereof will not be repeated.
[0024]
An evaporation source 1 for a film forming apparatus (hereinafter simply referred to as “evaporation source 1” for simplicity) shown in FIG. 1 is a cell that stores an organic material to be deposited on a substrate and evaporates the organic material by heating from the surroundings. Type evaporation source. The evaporation source 1 includes a substantially cylindrical storage unit 2 that stores a film forming material 8 such as an organic raw material. The accommodating part 2 has a structure of a cylindrical container whose upper end part 3 is open. An engaging part 5 is integrally formed on the bottom part 4 of the housing part 2 to be engaged with an elevating rod 41 (see FIG. 4) as an operating rod for elevating and lowering the evaporation source 1. The engagement portion 5 is formed in a substantially cylindrical shape having a smaller diameter than the storage portion 2 and an opening at a lower portion. The engaging portion 5 has a ventilation hole 6 through which gas inside the engaging portion 5 can enter and exit from the evaporating source 1 in order to facilitate insertion and exit of the elevating rod 41 when loading and removing the evaporation source 1. Is formed.
[0025]
The evaporation source 1 is entirely made of aluminum. Aluminum is an inexpensive metal material, and the shape including the radius, length, and wall thickness of the cylindrical body forming the housing portion 2 and the engagement portion 5 can be easily adapted to changes in specifications. Yes, so that the heat capacity can also be easily changed. Aluminum is relatively soft as a metal and has excellent workability such as cutting and drilling. The aluminum evaporation source 1 is more resistant to impacts than the ceramic evaporation source, does not break even if dropped, and is excellent in handleability. Further, with respect to heat resistance, it can withstand a high temperature of about 1000 ° C. and not only heats and evaporates an organic material having an evaporation temperature of 200 to 300 ° C., but also heats and heats a film forming material having an evaporation temperature of 800 ° C. Can be evaporated.
[0026]
The aluminum evaporation source 1 is anodized at the stage when the housing part 2, the engagement part 5, and the ventilation hole 6 are formed. In the anodic treatment, a passivation which is a strong oxidation protective film (aluminum oxide layer) on the surface of the evaporation source 1 by passing a current through the evaporation source 1 as an anode of a battery in an electrolyte solution such as chromic acid or sulfuric acid. A coating is formed. By subjecting the evaporation source 1 to anodizing, the metallic luster loses its luster and becomes soft and easy to handle, and the surface of the evaporation source 1 is hardened to be less susceptible to corrosion and damage.
[0027]
FIG. 2 is a perspective view showing an embodiment of a heating apparatus for an evaporation source for a film forming apparatus according to the present invention. A heating device 10 (hereinafter, simply referred to as a “heating device 10”) of an evaporation source for a film forming apparatus shown in FIG. 2 is wound around an outer periphery of the cylinder 12 having upper and lower ends open. And a heating wire 13, and the cylindrical body 12 is arranged vertically in the film forming apparatus. The evaporation source 1 can enter and exit the cylindrical body 12 through the opened lower end portion 14 by operating the elevating rod 41, and the film forming material 8 (see FIG. 1 or 3) stored in the evaporation source 1 is heated. -When evaporating, it diffuses into the evaporating cylinder 45 from the open upper end 15. The vapor deposition of the evaporation gas on the substrate B is the same as the conventional method, and thus the detailed description is omitted.
[0028]
The cylinder 12 is made of aluminum, like the evaporation source 1. Aluminum is an inexpensive metal material, and the shape, including the radius, length and wall thickness of the cylinder, can be easily changed according to the change of the specification, thereby easily changing the heat capacity Can be. Aluminum is relatively soft as a metal and has excellent workability such as cutting and drilling. The aluminum cylinder 12 is more resistant to impacts than the ceramic cylinder 12 and is not damaged even if dropped, and is excellent in handleability. Further, with respect to heat resistance, it can withstand a high temperature of about 1000 ° C. and not only heats and evaporates an organic material having an evaporation temperature of 200 to 300 ° C., but also heats and heats a film forming material having an evaporation temperature of 800 ° C. Can be evaporated.
[0029]
On the outer periphery of the cylindrical body 12 of the heating device 10, there is formed a spiral groove 16 having a rectangular cross section which can accommodate and wind the heating wire 13. At the edge of the upper end 15 of the cylindrical body 12, a notch 17 for locking the heating wire 13 is formed. The cylindrical body 12 can easily form the spiral groove 16 and the notch 17 for locking by the good cutting workability exhibited by aluminum. The spiral groove 16 is a double groove composed of grooves 16a and 16b, and the wire portions 13a and 13b of the folded heating wire 13 are individually fitted into the grooves 16a and 16b, respectively. 13b are prevented from contacting each other on the way and causing an electrical short circuit. A male screw portion 19 is formed in a part of the lower end portion 14 of the cylindrical body 12, and a flange portion 20 having an annular shelf surface 21 is integrally formed above the male screw portion 19. The lower end 14 is inserted into a mounting hole of a mounting plate (31 shown in FIG. 5) provided in the evaporating cylinder 45, and the mounting plate 31 is sandwiched between the flange portion 20 and the nut 22 screwed to the male screw portion 19. The cylindrical body 12 of the heating device 10 can be mounted on the mounting plate 31. The cylindrical body 12 in which the spiral groove 16, the locking notch 17, and the male screw portion 19 are formed is anodized at this stage. The anodic treatment is the same as in the case of the evaporation source 1, so that detailed description is omitted again. By anodizing the cylindrical body 12, the surface of the cylindrical body 12 becomes insulative, and even if the uncoated heating wire 13 is directly wound, an electrical short circuit is prevented.
[0030]
The heating wire 13 can be composed of a nichrome wire that generates heat when energized. The heating wire 13 is folded in the middle, that is, at just half the length, to form a double wire. The folded portion 13c of the heating wire 13 configured as a double wire is locked by a locking notch 17 formed in the upper end portion 15 of the cylindrical body 12, and the wire portions 13a and 13b on both sides thereof are respectively connected to the anode. The cylindrical body 12 is wound toward the lower end portion 14 while being accommodated in the grooves 16a and 16b of the processed cylindrical body 12. The heating wire 13 is completely accommodated in the spiral groove 16, and does not have a complicated structure in which the heating wire 13 protrudes outside from the outer peripheral surface of the cylindrical body 12. Therefore, even when the heating wire 13 is used for a long period of time, the heating wire 13 can be wound and maintained at a fixed position, and when the heating wire 13 is energized, the cylindrical body 12 can be heated uniformly or at a desired temperature distribution. Axial grooves 23a and 23b extending over both upper and lower sides of the flange 20 can be formed in the cylindrical body 12 at a depth slightly deeper than the grooves 16a and 16b. The axial grooves 23a and 23b extend below the male screw portion 19. The axial groove 23b is formed at a position located on the opposite side of the axial groove 23a in the diametrical direction, but is not shown in order to avoid complication. Each of the wire portions 13a and 13b of the heating wire 13 can be pulled out from below the nut 22 through the axial grooves 23a and 23b when the nut 22 is tightened to the male screw portion 19.
[0031]
FIG. 3 is a partial cross-sectional side view in which a heating sheath is applied to the heating device according to the present invention. An aluminum insulation sheath 25 can be fitted to the outside of the cylinder 12. Since the heating wire 13 is wound while being housed in the spiral groove 16, the heat retaining sheath 25 is fitted to the cylindrical body 12 without being hindered by the heating wire 13. The heat insulating sheath 25 is fitted to the cylindrical body 12 around which the heating wire 13 is wound until the lower end portion 26 of the cylindrical body 12 abuts against the shelf surface 21. In this state, the upper end 27 of the tubular body 12 is located at a position extending slightly above the upper end 15 of the tubular body 12. Since the heat-insulating sheath 25 is also subjected to anodic treatment to form a hardened protective layer made of an oxide film, the heat-insulating sheath 25 is less susceptible to corrosion and damage due to collision of foreign matter. In addition, since the cured protective layer has an insulating property, even if the heating wire 13 comes into contact with the heat retaining sheath 25, no short circuit occurs. The heat insulation sheath 25 also has an effect of preventing the heating wire 13 from coming off the spiral groove 16 due to thermal expansion. The heat-retaining sheath 25 prevents heat generation in the evaporating cylinder 45 from the heating wire 13 and the high-temperature cylinder 12 that generates heat, keeps the temperature of the cylinder 12 easy to be cooled, and saves energy such as reduction of electric power required for heating. Can be achieved. The heat insulation sheath 25 has a hole corresponding to the temperature sensor attachment portion 12a formed in the cylindrical body 12 in a state of abutting the shelf surface 21. A wire for the temperature sensor 42 is led out through the hole of the cylinder 12.
[0032]
When the heating wire 13 is broken, in a heating device using a ceramic cylindrical body, the heating wire 13 is embedded in the hardened cement-like ceramic, so that the cement is crushed and the heating wire is crushed. Since the cement was repaired after the 13 was taken out and repaired, replacement and repair were practically impossible, and the expensive heating device was disposable. In the present invention, the heating wire 13 can be easily replaced or repaired by removing the heat retaining sheath 25 from the cylinder 12, and the cylinder 12 can be reused.
[0033]
In the present invention, an evaporation source 1 and an evaporation source heating device 10 can be used in combination as a device for heating and evaporating a film forming material. That is, as shown in FIG. 3, the evaporation source 1 containing the film-forming material 8 is moved up and down inside the evaporation source heating device 10 by the elevating rod 41, and the evaporation source 1 is surrounded by the evaporation source heating device 10 when ascending. The source 1 is heated to heat and evaporate the film forming material 8 contained therein. Both the evaporation source 1 and the evaporation source heating device 10 are made of aluminum, or are subjected to anodization, so that the same handling, quality control and the like for the same production, storage, transportation, etc. as a heating and evaporation device for a film forming material. It can be carried out. Further, the use of the same material facilitates thermal design and thermal management according to the specifications of the film forming apparatus.
[0034]
【The invention's effect】
As described above, the evaporation source for a film forming apparatus according to the present invention can accommodate a film forming material and is entirely made of aluminum. In addition, the heating device of the evaporation source for the film forming apparatus includes an open-ended cylindrical body through which the evaporation source for the film forming apparatus can enter and exit, and a heating wire wound around the outer circumference of the cylindrical body, The tubular body is made of aluminum, and the tubular body is heated by heating the tubular body by applying a current to a heating wire, and the tubular body is formed of a film containing a film-forming material. The apparatus evaporation source is heated by radiant heat from the outside. Since the evaporation source for the film forming apparatus and the cylinder of the heating apparatus are made of aluminum, it is a metal material that can be obtained at a low cost, and is a material that is relatively soft and has good workability such as cutting. . Therefore, the evaporation source for the film forming apparatus and the heating apparatus can be manufactured at low cost and in any shape. In addition, it is superior in impact resistance as compared with a ceramic cylinder. Further, with respect to heat resistance, it is possible to cope with a film forming material having a high temperature of 1000 ° C. and an evaporation temperature of 800 ° C. In addition, by anodizing the aluminum evaporation source and the cylindrical body for the film forming apparatus, the surface is provided with insulating properties, is hardened, and can withstand corrosion and damage. As described above, by elaborating the material of the evaporation source and the cylindrical body for the film forming apparatus, the evaporation source and the heating apparatus can be manufactured at a low cost, and the handling is easy. A film material evaporation heating apparatus is advantageous in quality control and design, and is applicable to a film formation apparatus that handles a film formation material having a high evaporation temperature.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of an evaporation source for a film forming apparatus according to the present invention.
FIG. 2 is a perspective view showing one embodiment of a heating apparatus for an evaporation source for a film forming apparatus according to the present invention.
FIG. 3 is a partial cross-sectional side view showing a state where a heat retaining sheath is applied to the heating device shown in FIG. 2;
FIG. 4 is a view showing an example of a conventional organic EL element manufacturing apparatus.
[Explanation of symbols]
1. Evaporation source for film forming equipment 2. Storage unit
5 Engagement part 6 Vent
8 Film forming materials
DESCRIPTION OF SYMBOLS 10 Heating device of evaporation source for film forming apparatus 12 Cylindrical body
13 Heating wire 13a, 13b Wire part
14 Lower end 15 Upper end
16 spiral groove 16a, 16b groove
17 Notch for locking 19 Male thread
20 Flange 21 Shelf surface
22 Nut 25 Heat insulation sheath
40 cell-type evaporation source 41 lifting rod (operation rod)
42 temperature sensor 43 temperature controller
44 Heater power supply 45 Evaporation cylinder
B substrate M mask
S shutter

Claims (10)

An evaporation source for a film forming apparatus, comprising: a housing for housing a film forming material to be heated for vapor deposition on a substrate, the whole being made of aluminum. The evaporation source according to claim 1, wherein the aluminum is anodized. The housing portion is formed in a cylindrical container having an open upper end, and an operation rod for entering and exiting a heating device for heating the evaporation source for the film forming apparatus can be fitted into a bottom side of the housing portion. 2. The evaporation source for a film forming apparatus according to claim 1, wherein said engaging portion is formed integrally with said accommodating portion from said aluminum. An open-ended cylindrical body through which an evaporation source for a film-forming apparatus containing a film-forming material can enter and exit, and a heating wire wound around the outer periphery of the cylindrical body, wherein the cylindrical body is made of aluminum. A heating device for an evaporation source for a film forming apparatus. The heating device for an evaporation source for a film forming apparatus according to claim 4, wherein a spiral groove for winding the heating wire is formed on an outer periphery of the cylindrical body. The heating wire is a double wire formed by being folded in the middle, and the cylindrical body is provided with a notch for locking the folded end of the double wire at an edge of one end. The heating device for an evaporation source for a film forming apparatus according to claim 4, wherein the spiral groove is a double groove into which each wire portion before and after the double wire folding is fitted. 5. The heating device for an evaporation source for a film forming apparatus according to claim 4, wherein the aluminum forming the cylinder is anodized. The heating device for an evaporation source for a film forming apparatus according to claim 4, wherein an aluminum heat insulating sheath is fitted to the cylindrical body around which the heating wire is wound. The heating device for an evaporation source for a film forming apparatus according to claim 8, wherein the heat retaining sheath is anodized. A combination of the evaporation source for a film formation apparatus according to any one of claims 1 to 3 and a heating apparatus for an evaporation source for a film formation apparatus according to any one of claims 4 to 9. A film-forming material heating and evaporating device comprising:

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