TW200611941A - Positive-type photosensitive resin composition - Google Patents

Positive-type photosensitive resin composition

Info

Publication number
TW200611941A
TW200611941A TW094118921A TW94118921A TW200611941A TW 200611941 A TW200611941 A TW 200611941A TW 094118921 A TW094118921 A TW 094118921A TW 94118921 A TW94118921 A TW 94118921A TW 200611941 A TW200611941 A TW 200611941A
Authority
TW
Taiwan
Prior art keywords
resin composition
pattern
photosensitive resin
positive
excelling
Prior art date
Application number
TW094118921A
Other languages
English (en)
Inventor
Masakazu Kato
Hisanori Ohishi
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW200611941A publication Critical patent/TW200611941A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
TW094118921A 2004-06-08 2005-06-08 Positive-type photosensitive resin composition TW200611941A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004169642 2004-06-08

Publications (1)

Publication Number Publication Date
TW200611941A true TW200611941A (en) 2006-04-16

Family

ID=35503231

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118921A TW200611941A (en) 2004-06-08 2005-06-08 Positive-type photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP4525937B2 (zh)
TW (1) TW200611941A (zh)
WO (1) WO2005121895A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140110091A (ko) * 2007-04-02 2014-09-16 닛산 가가쿠 고교 가부시키 가이샤 포지티브형 감광성 수지 조성물, 이의 경화막 및 표시소자
JP5061703B2 (ja) * 2007-04-25 2012-10-31 東レ株式会社 感光性樹脂組成物
JP5088169B2 (ja) * 2008-02-25 2012-12-05 東レ株式会社 ポジ型感光性樹脂組成物
JP5381491B2 (ja) * 2009-08-19 2014-01-08 東レ株式会社 樹脂およびポジ型感光性樹脂組成物
JP5715440B2 (ja) * 2011-02-24 2015-05-07 旭化成イーマテリアルズ株式会社 アルカリ可溶性重合体、それを含む感光性樹脂組成物、及びその用途
JP2013130816A (ja) * 2011-12-22 2013-07-04 Nippon Zeon Co Ltd 永久膜用樹脂組成物及び電子部品
SG11201701691PA (en) * 2014-09-02 2017-04-27 Toray Industries Resin and photosensitive resin composition
CN107431020B (zh) 2015-03-27 2020-07-24 东丽株式会社 薄膜晶体管用感光性树脂组合物、固化膜、薄膜晶体管

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3369344B2 (ja) * 1994-01-21 2003-01-20 信越化学工業株式会社 感光性樹脂組成物
JP4449119B2 (ja) * 1999-06-25 2010-04-14 東レ株式会社 ポジ型感光性樹脂前駆体組成物
JP4154086B2 (ja) * 1999-07-29 2008-09-24 日立化成工業株式会社 感光性重合体組成物、パターンの製造法及び電子部品
JP4009181B2 (ja) * 2002-11-08 2007-11-14 富士フイルム株式会社 平版印刷版原版
JP2005250160A (ja) * 2004-03-04 2005-09-15 Kyocera Chemical Corp ポジ型感光性樹脂組成物及びその硬化物
JP2005266673A (ja) * 2004-03-22 2005-09-29 Kyocera Chemical Corp カラーフィルター、液晶表示装置、ポジ型感光性樹脂組成物及びスペーサーの製造方法

Also Published As

Publication number Publication date
JP4525937B2 (ja) 2010-08-18
JPWO2005121895A1 (ja) 2008-04-10
WO2005121895A1 (ja) 2005-12-22

Similar Documents

Publication Publication Date Title
TW200611941A (en) Positive-type photosensitive resin composition
TW200613923A (en) Protective film-forming composition for immersion exposure and pattern forming method using the same
EP2637063A3 (en) Pattern forming method
EP2003504A3 (en) Method of forming patterns
TW200731016A (en) Composition for forming upper film and method for forming photoresist pattern
EP2019334A3 (en) Positive resist composition and method of pattern formation with the same
MY137961A (en) Photoresist composition for imaging thick films
EP2003505A3 (en) Method of forming patterns
TW200736836A (en) Developable undercoating composition for thick photoresist layers
WO2008117693A1 (ja) ポジ型感放射線性組成物およびそれを用いたレジストパターン形成方法
JPS6435433A (en) Radiation sensitive mixture for photosensitive layer forming material
EP1542078A4 (en) COMPOSITION FOR ANTIREFLEX COATINGS AND METHOD FOR FORMING A STRUCTURE
JP2001281849A5 (zh)
JP2003167333A5 (zh)
TW200627070A (en) Photosensitive resin composition
TW201203318A (en) Exposure method, exposure device, and device manufacturing method
WO2003085455A3 (en) Photoresist compositions comprising acetals and ketals as solvents
EP1811338A3 (en) Pattern forming method
EP1939692A3 (en) Method for preparation of lithographic printing plate
WO2006107010A3 (en) Positive photoresist composition, thick film photoresist laminate, method for producing thick film resist pattern, and method for producing connecting terminal
EP1684119A3 (en) Positive resist composition for immersion exposure and pattern-forming method using the same
JP2009258506A5 (zh)
TW200643625A (en) Polymer for immersion lithography, photoresist composition containing the same, method of manufacturing a semiconductor device, and semiconductor device
EP1975717A3 (en) Positive resist compostion and pattern forming method using the same
TW200602807A (en) Photosensitive insulative paste composition and photosensitive film using the same