TW200611829A - Thin film ink jet printhead adhesion enhancement - Google Patents
Thin film ink jet printhead adhesion enhancementInfo
- Publication number
- TW200611829A TW200611829A TW093131221A TW93131221A TW200611829A TW 200611829 A TW200611829 A TW 200611829A TW 093131221 A TW093131221 A TW 093131221A TW 93131221 A TW93131221 A TW 93131221A TW 200611829 A TW200611829 A TW 200611829A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- adhesion
- ink jet
- cavitation
- thin film
- Prior art date
Links
- 239000010409 thin film Substances 0.000 title 1
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 abstract 1
- JMOHEPRYPIIZQU-UHFFFAOYSA-N oxygen(2-);tantalum(2+) Chemical compound [O-2].[Ta+2] JMOHEPRYPIIZQU-UHFFFAOYSA-N 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical group [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/685,115 US6929349B2 (en) | 2003-10-14 | 2003-10-14 | Thin film ink jet printhead adhesion enhancement |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200611829A true TW200611829A (en) | 2006-04-16 |
Family
ID=34423106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093131221A TW200611829A (en) | 2003-10-14 | 2004-10-14 | Thin film ink jet printhead adhesion enhancement |
Country Status (5)
Country | Link |
---|---|
US (1) | US6929349B2 (zh) |
AU (1) | AU2004282922A1 (zh) |
GB (1) | GB2423052B (zh) |
TW (1) | TW200611829A (zh) |
WO (1) | WO2005038872A2 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102947099A (zh) * | 2010-04-29 | 2013-02-27 | 惠普发展公司,有限责任合伙企业 | 流体喷射装置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006137030A (ja) * | 2004-11-10 | 2006-06-01 | Canon Inc | 液体吐出記録ヘッド及びその製造方法 |
JP4926669B2 (ja) | 2005-12-09 | 2012-05-09 | キヤノン株式会社 | インクジェットヘッドのクリーニング方法、インクジェットヘッドおよびインクジェット記録装置 |
US20090142599A1 (en) * | 2006-06-02 | 2009-06-04 | Nv Bekaert Sa | Method to prevent metal contamination by a substrate holder |
US8395318B2 (en) * | 2007-02-14 | 2013-03-12 | Ritedia Corporation | Diamond insulated circuits and associated methods |
US20080213927A1 (en) * | 2007-03-02 | 2008-09-04 | Texas Instruments Incorporated | Method for manufacturing an improved resistive structure |
US7795070B2 (en) * | 2007-03-30 | 2010-09-14 | Texas Instruments Incorporated | Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor |
JP5312202B2 (ja) * | 2008-06-20 | 2013-10-09 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
US9636902B2 (en) | 2013-04-30 | 2017-05-02 | Hewlett-Packard Development Company, L.P. | Film stack including adhesive layer |
US10137687B2 (en) | 2014-10-30 | 2018-11-27 | Hewlett-Packard Development Company, L.P. | Printing apparatus and methods of producing such a device |
CN107531053B (zh) * | 2015-07-15 | 2019-10-18 | 惠普发展公司有限责任合伙企业 | 粘附和绝缘层 |
WO2018013093A1 (en) * | 2016-07-12 | 2018-01-18 | Hewlett-Packard Development Company, L.P. | Printhead comprising a thin film passivation layer |
CN107746186B (zh) * | 2017-10-17 | 2021-02-05 | 信利光电股份有限公司 | 一种高硬度耐磨玻璃盖板及其制备方法 |
JP2022533006A (ja) * | 2019-06-17 | 2022-07-21 | ヒューレット-パッカード デベロップメント カンパニー エル.ピー. | 発熱部品を保護および状態を検出するためのキャビテーションプレート |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4335389A (en) * | 1979-03-27 | 1982-06-15 | Canon Kabushiki Kaisha | Liquid droplet ejecting recording head |
JPH0613219B2 (ja) * | 1983-04-30 | 1994-02-23 | キヤノン株式会社 | インクジェットヘッド |
US4663640A (en) * | 1984-07-20 | 1987-05-05 | Canon Kabushiki Kaisha | Recording head |
US4965611A (en) * | 1989-03-22 | 1990-10-23 | Hewlett-Packard Company | Amorphous diffusion barrier for thermal ink jet print heads |
US4956653A (en) * | 1989-05-12 | 1990-09-11 | Eastman Kodak Company | Bubble jet print head having improved multi-layer protective structure for heater elements |
JP3408292B2 (ja) * | 1992-09-09 | 2003-05-19 | ヒューレット・パッカード・カンパニー | プリントヘッド |
US5448273A (en) * | 1993-06-22 | 1995-09-05 | Xerox Corporation | Thermal ink jet printhead protective layers |
US6911124B2 (en) * | 1998-09-24 | 2005-06-28 | Applied Materials, Inc. | Method of depositing a TaN seed layer |
US6441838B1 (en) * | 2001-01-19 | 2002-08-27 | Hewlett-Packard Company | Method of treating a metal surface to increase polymer adhesion |
US6450622B1 (en) * | 2001-06-28 | 2002-09-17 | Hewlett-Packard Company | Fluid ejection device |
US6459047B1 (en) * | 2001-09-05 | 2002-10-01 | International Business Machines Corporation | Laminate circuit structure and method of fabricating |
US7018878B2 (en) * | 2001-11-07 | 2006-03-28 | Matrix Semiconductor, Inc. | Metal structures for integrated circuits and methods for making the same |
US6755509B2 (en) * | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
-
2003
- 2003-10-14 US US10/685,115 patent/US6929349B2/en not_active Expired - Fee Related
-
2004
- 2004-10-13 AU AU2004282922A patent/AU2004282922A1/en not_active Abandoned
- 2004-10-13 WO PCT/US2004/033771 patent/WO2005038872A2/en active Application Filing
- 2004-10-13 GB GB0609257A patent/GB2423052B/en not_active Expired - Fee Related
- 2004-10-14 TW TW093131221A patent/TW200611829A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102947099A (zh) * | 2010-04-29 | 2013-02-27 | 惠普发展公司,有限责任合伙企业 | 流体喷射装置 |
CN102947099B (zh) * | 2010-04-29 | 2015-11-25 | 惠普发展公司,有限责任合伙企业 | 流体喷射装置 |
Also Published As
Publication number | Publication date |
---|---|
US6929349B2 (en) | 2005-08-16 |
US20050078151A1 (en) | 2005-04-14 |
GB2423052A (en) | 2006-08-16 |
GB0609257D0 (en) | 2006-06-21 |
AU2004282922A1 (en) | 2005-04-28 |
GB2423052B (en) | 2007-03-14 |
WO2005038872A2 (en) | 2005-04-28 |
WO2005038872A3 (en) | 2005-07-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200611829A (en) | Thin film ink jet printhead adhesion enhancement | |
KR101033721B1 (ko) | 액체 토출 헤드 기체, 그 기체를 사용한 액체 토출 헤드 및그 제조 방법 | |
JPH03199050A (ja) | インクジェット・プリントヘッド | |
US9623655B2 (en) | Liquid discharge head and method for manufacturing the same | |
EP1078754A3 (en) | Fully integrated thermal inkjet printhead having etched back phosphosilicate glass layer | |
EP2666635B1 (en) | Substrate for liquid discharge head and liquid discharge head | |
WO2004059431A2 (en) | Improved ink jet heater chip and method therefor | |
TW200510184A (en) | Heater chip with doped diamond-like carbon layer and overlying cavitation layer | |
US9815282B2 (en) | Fluid ejection structure | |
EP1270228A1 (en) | Fluid ejection device and method of manufacturing | |
CN1919606A (zh) | 喷墨打印头和其制造方法 | |
WO2004061933B1 (en) | Diffusion barrier and method therefor | |
US5844586A (en) | Process for making ink jet heater chips | |
JP4925537B2 (ja) | サーマルヘッド | |
WO2002083424A1 (fr) | Tete d'injection de liquide, dispositif d'injection de liquide et procede de fabrication d'une tete d'injection de liquide | |
US20060284935A1 (en) | Inkjet printer head and fabrication method thereof | |
JP2004095535A5 (ja) | 発光装置の製造装置及び発光装置の作製方法 | |
CN113727860B (zh) | 电耦接到流体管芯的导电元件 | |
JP4925535B2 (ja) | サーマルヘッド | |
JP2003165224A (ja) | インクジェットヘッド | |
JP2003191472A (ja) | インクジェットヘッド | |
JP4925536B2 (ja) | サーマルヘッド | |
JP2003094707A (ja) | サーマルヘッド | |
JP2003127378A (ja) | インクジェットヘッド | |
JP2003127381A (ja) | インクジェットヘッド |