TW200607578A - Substrate processing apparatus - Google Patents

Substrate processing apparatus

Info

Publication number
TW200607578A
TW200607578A TW094121998A TW94121998A TW200607578A TW 200607578 A TW200607578 A TW 200607578A TW 094121998 A TW094121998 A TW 094121998A TW 94121998 A TW94121998 A TW 94121998A TW 200607578 A TW200607578 A TW 200607578A
Authority
TW
Taiwan
Prior art keywords
processing apparatus
substrate processing
light receiving
receiving part
light
Prior art date
Application number
TW094121998A
Other languages
Chinese (zh)
Other versions
TWI295590B (en
Inventor
Kentaro Nishioka
Yoshinori Takagi
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200607578A publication Critical patent/TW200607578A/en
Application granted granted Critical
Publication of TWI295590B publication Critical patent/TWI295590B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques

Abstract

To reduce the load on workers while preventing lowering of the precision of the detection of an object. A substrate processing apparatus is provided with a light projecting part 450a and a light receiving part 450b which constitute a detection sensor 450. The light receiving part 450b is shifted in the (+Z) direction from a position where laser beam emitted from the light projecting part 450a is received and arranged at a position where the reflection light reflected by the object is received. In the substrate processing apparatus, when the light receiving part 450b receives the laser beam, it is judged that the object is existed and a movement mechanism of a slit nozzle is controlled.
TW094121998A 2004-08-27 2005-06-29 Substrate processing apparatus TWI295590B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004248297A JP4417205B2 (en) 2004-08-27 2004-08-27 Substrate processing equipment

Publications (2)

Publication Number Publication Date
TW200607578A true TW200607578A (en) 2006-03-01
TWI295590B TWI295590B (en) 2008-04-11

Family

ID=36092477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121998A TWI295590B (en) 2004-08-27 2005-06-29 Substrate processing apparatus

Country Status (4)

Country Link
JP (1) JP4417205B2 (en)
KR (1) KR100676240B1 (en)
CN (1) CN100404146C (en)
TW (1) TWI295590B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637432B (en) * 2015-04-09 2018-10-01 東京威力科創股份有限公司 Foreign matter removing device, foreign matter removing method, peeling device, foreign matter detecting method, and foreign matter detecting device

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100643397B1 (en) * 2005-11-17 2006-11-10 삼성전자주식회사 Wafer sensing apparatus
JP4587950B2 (en) * 2005-12-22 2010-11-24 大日本スクリーン製造株式会社 Substrate processing equipment
JP4967446B2 (en) * 2006-05-12 2012-07-04 凸版印刷株式会社 Method for detecting foreign matter adhering during coating film formation by slit nozzle and method for monitoring thickness of glass substrate
JP4520975B2 (en) * 2006-12-06 2010-08-11 東京エレクトロン株式会社 Coating method and coating apparatus
JP4916971B2 (en) * 2007-07-30 2012-04-18 株式会社アルバック Coating device
JP5122371B2 (en) * 2008-05-26 2013-01-16 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, program, and storage medium
JP2010217086A (en) * 2009-03-18 2010-09-30 Anritsu Corp Device and method for inspection of printed solder
JP2010240550A (en) * 2009-04-03 2010-10-28 Dainippon Screen Mfg Co Ltd Apparatus for treating substrate
JP5108909B2 (en) 2010-03-12 2012-12-26 東京エレクトロン株式会社 Backside foreign matter detection method, backside foreign matter detection device, and coating device
JP5679866B2 (en) * 2011-02-28 2015-03-04 東レエンジニアリング株式会社 Coating apparatus and coating method
CN102680496B (en) * 2011-04-15 2016-04-20 京东方科技集团股份有限公司 Detection device for foreign matter and method
JP6106964B2 (en) * 2012-06-25 2017-04-05 セイコーエプソン株式会社 Printing apparatus and printing method
JP5714616B2 (en) * 2013-01-21 2015-05-07 中外炉工業株式会社 Coating equipment
JP6635888B2 (en) * 2016-07-14 2020-01-29 東京エレクトロン株式会社 Plasma processing system
JP6787294B2 (en) * 2017-10-31 2020-11-18 セイコーエプソン株式会社 Robot systems, control methods, and robots
JP7028607B2 (en) * 2017-11-06 2022-03-02 株式会社ディスコ Cutting equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2740588B2 (en) * 1991-07-24 1998-04-15 日立テクノエンジニアリング株式会社 Coating and drawing equipment
CN1164372C (en) * 1995-07-24 2004-09-01 松下电器产业株式会社 Binding agent coating method
JPH11300257A (en) * 1998-04-24 1999-11-02 Toray Ind Inc Coating device for applying coating liquid to uneven base material and manufacturing equipment of plasma display
WO2002053297A1 (en) * 2000-12-27 2002-07-11 Toray Industries, Inc. Mouthpiece and device and method for applying coating fluid
US7046353B2 (en) * 2001-12-04 2006-05-16 Kabushiki Kaisha Topcon Surface inspection system
JP4104924B2 (en) * 2002-07-08 2008-06-18 東レエンジニアリング株式会社 Optical measuring method and apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637432B (en) * 2015-04-09 2018-10-01 東京威力科創股份有限公司 Foreign matter removing device, foreign matter removing method, peeling device, foreign matter detecting method, and foreign matter detecting device
US10160015B2 (en) 2015-04-09 2018-12-25 Tokyo Electron Limited Foreign substance removal apparatus and foreign substance detection apparatus
US10946419B2 (en) 2015-04-09 2021-03-16 Tokyo Electron Limited Foreign substance removal apparatus and foreign substance detection apparatus

Also Published As

Publication number Publication date
CN1739865A (en) 2006-03-01
KR20060053901A (en) 2006-05-22
KR100676240B1 (en) 2007-01-30
TWI295590B (en) 2008-04-11
CN100404146C (en) 2008-07-23
JP4417205B2 (en) 2010-02-17
JP2006061854A (en) 2006-03-09

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