TW200607418A - Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device - Google Patents

Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device

Info

Publication number
TW200607418A
TW200607418A TW094118604A TW94118604A TW200607418A TW 200607418 A TW200607418 A TW 200607418A TW 094118604 A TW094118604 A TW 094118604A TW 94118604 A TW94118604 A TW 94118604A TW 200607418 A TW200607418 A TW 200607418A
Authority
TW
Taiwan
Prior art keywords
manufacturing
nozzle
metal pads
circuit
conductive material
Prior art date
Application number
TW094118604A
Other languages
English (en)
Other versions
TWI283557B (en
Inventor
Kenji Wada
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200607418A publication Critical patent/TW200607418A/zh
Application granted granted Critical
Publication of TWI283557B publication Critical patent/TWI283557B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/22—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material
    • B41J2/23—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of impact or pressure on a printing material or impression-transfer material using print wires
    • B41J2/235—Print head assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L2224/03505—Sintering
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
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    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1302—Disposition
    • H01L2224/13023—Disposition the whole bump connector protruding from the surface
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    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
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    • H01L2224/93—Batch processes
    • H01L2224/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
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    • H01L2924/078—Adhesive characteristics other than chemical
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
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    • H01L2924/30—Technical effects
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    • H01L2924/3025—Electromagnetic shielding
TW094118604A 2004-06-08 2005-06-06 Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device TWI283557B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004170101A JP2005353682A (ja) 2004-06-08 2004-06-08 回路素子の製造方法、電子素子の製造方法、回路基板、電子機器、および電気光学装置

Publications (2)

Publication Number Publication Date
TW200607418A true TW200607418A (en) 2006-02-16
TWI283557B TWI283557B (en) 2007-07-01

Family

ID=35449540

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118604A TWI283557B (en) 2004-06-08 2005-06-06 Method of manufacturing circuit device, method of manufacturing electronic device, and circuit board, electronic apparatus, and photoelectric device

Country Status (5)

Country Link
US (1) US20050272244A1 (zh)
JP (1) JP2005353682A (zh)
KR (1) KR100691708B1 (zh)
CN (1) CN1706641A (zh)
TW (1) TWI283557B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576599B (zh) * 2014-10-23 2017-04-01 Murata Manufacturing Co Test equipment for electronic parts

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US9953259B2 (en) 2004-10-08 2018-04-24 Thin Film Electronics, Asa RF and/or RF identification tag/device having an integrated interposer, and methods for making and using the same
US20070148951A1 (en) * 2005-12-27 2007-06-28 Mengzhi Pang System and method for flip chip substrate pad
CN100559173C (zh) * 2005-12-27 2009-11-11 中芯国际集成电路制造(上海)有限公司 集成电路制造中用于俄歇电子能谱的样品的处理方法
JP2007250849A (ja) * 2006-03-16 2007-09-27 Casio Comput Co Ltd 半導体装置の製造方法
JP5305148B2 (ja) * 2006-04-24 2013-10-02 株式会社村田製作所 電子部品、それを用いた電子部品装置およびその製造方法
DE102006024286B4 (de) * 2006-05-24 2015-06-03 Robert Bosch Gmbh Mikrofluidische Vorrichtung, insbesondere zur Dosierung einer Flüssigkeit oder zur dosierten Abgabe einer Flüssigkeit, und Verfahren zur Herstellung einer mikrofluidischen Vorrichtung
US7709307B2 (en) 2006-08-24 2010-05-04 Kovio, Inc. Printed non-volatile memory
KR101596537B1 (ko) 2008-11-25 2016-02-22 씬 필름 일렉트로닉스 에이에스에이 인쇄형 안테나, 안테나 인쇄 방법, 및 인쇄형 안테나를 포함하는 디바이스
DE102012216546B4 (de) * 2012-09-17 2023-01-19 Infineon Technologies Ag Verfahren zum verlöten eines halbleiterchips mit einem träger

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JP4741045B2 (ja) * 1998-03-25 2011-08-03 セイコーエプソン株式会社 電気回路、その製造方法および電気回路製造装置
US6442033B1 (en) * 1999-09-24 2002-08-27 Virginia Tech Intellectual Properties, Inc. Low-cost 3D flip-chip packaging technology for integrated power electronics modules
CN1310259C (zh) 2001-04-20 2007-04-11 松下电器产业株式会社 电子元件的制造方法及其制造用材料
WO2003079430A1 (en) * 2002-03-19 2003-09-25 Seiko Epson Corporation Semiconductor device and its manufacturing method, circuit board and electronic apparatus
JP2004039956A (ja) 2002-07-05 2004-02-05 Sumitomo Bakelite Co Ltd プリント回路板の製造方法
JP4239560B2 (ja) * 2002-08-02 2009-03-18 セイコーエプソン株式会社 組成物とこれを用いた有機導電性膜の製造方法
JP3987404B2 (ja) 2002-09-27 2007-10-10 セイコーエプソン株式会社 光導波路およびその製造方法、回路基板、光モジュール、光伝達装置
US7018007B2 (en) * 2003-04-16 2006-03-28 Osram Opto Semiconductors Gmbh Ink-jet pocket printing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI576599B (zh) * 2014-10-23 2017-04-01 Murata Manufacturing Co Test equipment for electronic parts

Also Published As

Publication number Publication date
JP2005353682A (ja) 2005-12-22
KR20060046039A (ko) 2006-05-17
KR100691708B1 (ko) 2007-03-09
US20050272244A1 (en) 2005-12-08
TWI283557B (en) 2007-07-01
CN1706641A (zh) 2005-12-14

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