TW200605317A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
TW200605317A
TW200605317A TW094119844A TW94119844A TW200605317A TW 200605317 A TW200605317 A TW 200605317A TW 094119844 A TW094119844 A TW 094119844A TW 94119844 A TW94119844 A TW 94119844A TW 200605317 A TW200605317 A TW 200605317A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
functional
functional element
opposed
rewiring layer
Prior art date
Application number
TW094119844A
Other languages
English (en)
Inventor
Kazumasa Tanida
Tadahiro Morifuji
Osamu Miyata
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of TW200605317A publication Critical patent/TW200605317A/zh

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    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H01L2224/732—Location after the connecting process
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    • H01L2224/732—Location after the connecting process
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    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/151—Die mounting substrate
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    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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  • General Physics & Mathematics (AREA)
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TW094119844A 2004-06-16 2005-06-15 Semiconductor device TW200605317A (en)

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US6710454B1 (en) * 2000-02-16 2004-03-23 Micron Technology, Inc. Adhesive layer for an electronic apparatus having multiple semiconductor devices
JP5183893B2 (ja) * 2006-08-01 2013-04-17 新光電気工業株式会社 配線基板及びその製造方法、及び半導体装置
JP2011233854A (ja) * 2010-04-26 2011-11-17 Nepes Corp ウェハレベル半導体パッケージ及びその製造方法
KR101817159B1 (ko) 2011-02-17 2018-02-22 삼성전자 주식회사 Ｔｓｖ를 가지는 인터포저를 포함하는 반도체 패키지 및 그 제조 방법
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WO2013114481A1 (ja) 2012-01-30 2013-08-08 パナソニック株式会社 半導体装置
TWI550731B (zh) * 2013-02-23 2016-09-21 南茂科技股份有限公司 晶片封裝製程及晶片封裝

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JP2001007252A (ja) 1999-06-25 2001-01-12 Matsushita Electronics Industry Corp 半導体装置およびその製造方法
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JP3772066B2 (ja) 2000-03-09 2006-05-10 沖電気工業株式会社 半導体装置
US6696765B2 (en) 2001-11-19 2004-02-24 Hitachi, Ltd. Multi-chip module
JP2002118224A (ja) 2000-10-05 2002-04-19 Hitachi Ltd マルチチップモジュール
TW574752B (en) * 2000-12-25 2004-02-01 Hitachi Ltd Semiconductor module
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JP3888854B2 (ja) * 2001-02-16 2007-03-07 シャープ株式会社 半導体集積回路の製造方法
JP2002270720A (ja) * 2001-03-09 2002-09-20 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP4413452B2 (ja) 2001-05-30 2010-02-10 パナソニック株式会社 半導体装置およびその製造方法
JP4593835B2 (ja) 2001-07-04 2010-12-08 パナソニック株式会社 半導体装置およびその製造方法
US6680529B2 (en) * 2002-02-15 2004-01-20 Advanced Semiconductor Engineering, Inc. Semiconductor build-up package
CN1568546B (zh) * 2002-08-09 2010-06-23 卡西欧计算机株式会社 半导体器件及其制造方法
JP2004140037A (ja) * 2002-10-15 2004-05-13 Oki Electric Ind Co Ltd 半導体装置、及びその製造方法
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CN100539090C (zh) 2009-09-09
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