TW200603932A - Lead free solder fall - Google Patents

Lead free solder fall

Info

Publication number
TW200603932A
TW200603932A TW094106915A TW94106915A TW200603932A TW 200603932 A TW200603932 A TW 200603932A TW 094106915 A TW094106915 A TW 094106915A TW 94106915 A TW94106915 A TW 94106915A TW 200603932 A TW200603932 A TW 200603932A
Authority
TW
Taiwan
Prior art keywords
free solder
type
bump
mass
lead
Prior art date
Application number
TW094106915A
Other languages
English (en)
Chinese (zh)
Other versions
TWI334366B (cg-RX-API-DMAC7.html
Inventor
Daisuke Souma
Takahiro Roppongi
Hiromi Kawamata
Hiroshi Okada
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW200603932A publication Critical patent/TW200603932A/zh
Application granted granted Critical
Publication of TWI334366B publication Critical patent/TWI334366B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/346—Solder materials or compositions specially adapted therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW094106915A 2004-03-19 2005-03-08 Lead free solder fall TW200603932A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079348 2004-03-19

Publications (2)

Publication Number Publication Date
TW200603932A true TW200603932A (en) 2006-02-01
TWI334366B TWI334366B (cg-RX-API-DMAC7.html) 2010-12-11

Family

ID=34993512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106915A TW200603932A (en) 2004-03-19 2005-03-08 Lead free solder fall

Country Status (3)

Country Link
JP (1) JP4392020B2 (cg-RX-API-DMAC7.html)
TW (1) TW200603932A (cg-RX-API-DMAC7.html)
WO (1) WO2005089999A1 (cg-RX-API-DMAC7.html)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5071802B2 (ja) * 2008-04-08 2012-11-14 日立金属株式会社 はんだボール、はんだ層及びはんだバンプ
JP2011031253A (ja) * 2009-07-30 2011-02-17 Eishin Kogyo Kk 無鉛ハンダ合金
KR101283580B1 (ko) 2011-12-14 2013-07-05 엠케이전자 주식회사 주석계 솔더 볼 및 이를 포함하는 반도체 패키지
KR20150035671A (ko) * 2012-08-08 2015-04-07 센주긴조쿠고교 가부시키가이샤 고온 납프리 땜납 합금
EP3112080A4 (en) * 2014-02-24 2017-11-29 Koki Company Limited Lead-free solder alloy, solder material, and joined structure
JP6579253B1 (ja) * 2018-11-09 2019-09-25 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
CN115464299A (zh) * 2021-10-21 2022-12-13 上海华庆焊材技术股份有限公司 一种降低焊接空洞的预成型无铅焊片及其制备方法和应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3684811B2 (ja) * 1998-01-28 2005-08-17 株式会社村田製作所 半田および半田付け物品
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト

Also Published As

Publication number Publication date
JPWO2005089999A1 (ja) 2008-01-31
TWI334366B (cg-RX-API-DMAC7.html) 2010-12-11
WO2005089999A1 (ja) 2005-09-29
JP4392020B2 (ja) 2009-12-24

Similar Documents

Publication Publication Date Title
TWI392750B (zh) Lead-free solder alloy
JP5633837B2 (ja) 鉛フリーはんだボール
ATE555871T1 (de) Bleifreie lotkugel
TW200740549A (en) Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
US9175368B2 (en) MN doped SN-base solder alloy and solder joints thereof with superior drop shock reliability
KR101345940B1 (ko) 땜납, 납땜 방법 및 반도체 장치
TWI636140B (zh) 焊料凸塊之形成方法及焊料球固定用焊料膏
CN104737630B (zh) 低温焊膏的焊接方法
EP3696850A3 (en) Method of soldering an electronic component to a substrate with the use of a solder paste comprising a lead-free solder alloy consisting of sn, bi and at least one of sb and mn
MY201060A (en) Core material, electronic component and method for forming bump electrode
WO2006011204A1 (ja) 鉛フリーはんだ合金
US7029542B2 (en) Lead-free solder alloy
WO2013052428A1 (en) A mn doped sn-base solder alloy and solder joints thereof with superior drop shock reliability
JP4392020B2 (ja) 鉛フリーはんだボール
MX2007003369A (es) Mejoramientos en soldaduras o relacionados con las mismas.
TW548771B (en) Structure of solder bump
KR20110026666A (ko) 솔더 페이스트, 이를 사용하여 형성된 솔더링 접합부, 및 상기 솔더링 접합부를 갖는 인쇄 회로 기판
TW201343311A (zh) 無鉛焊料錫球
JP2019072742A (ja) 線はんだ、はんだ継手の製造方法およびはんだ付け方法
JP2019126827A (ja) 鉛フリーはんだ合金
JP2011183430A (ja) はんだ
US20090301760A1 (en) Method of Soldering a Module Board
JP2011198777A (ja) はんだ接合方法及びはんだ継手
JP2018144076A (ja) はんだバンプ製造用金属粉末、はんだバンプ製造用ペーストおよびはんだバンプの製造方法
Hegde et al. Experimental and analytical study of lead-free solder joint reliability in surface mount devices

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent